Patent application number | Description | Published |
20090115074 | Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element - In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed. | 05-07-2009 |
20110031625 | Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element - An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region. | 02-10-2011 |
20120038352 | Sensor Package and Method of Manufacturing Thereof - A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment comprises a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on and/or around the encapsulation, wherein the soft magnet comprises a composition of an insulating material and a material having soft magnetic properties. | 02-16-2012 |
20120080690 | Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core - According to an embodiment, a composite wafer includes a carrier substrate having a graphite core and a monocrystalline semiconductor layer attached to the carrier substrate. | 04-05-2012 |
20120083098 | Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core - According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate. | 04-05-2012 |
20120256323 | METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DEPOSITION DEVICE - According to various embodiments, a method for processing a semiconductor wafer or die is provided including supplying particles to a plasma such that the particles are activated by the plasma and spraying the activated particles on the semiconductor wafer or die to generate a particle layer on the semiconductor wafer or die. | 10-11-2012 |
20120256542 | VEHICLE LIGHTING ARRANGEMENT - A vehicle lighting arrangement comprising a luminous device, a luminous device driver circuit, a sensor and a nonvolatile memory, wherein the luminous device driver circuit is designed to drive the luminous device during luminous device driving such that the luminous device emits light, wherein the sensor is designed to detect a sensor state of the luminous device, and wherein the vehicle lighting arrangement is designed to read in a sensor state of the luminous device detected by the sensor and to write the read-in sensor state to the nonvolatile memory. | 10-11-2012 |
20130056703 | Sensor Device and Method - A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces. | 03-07-2013 |
20140070232 | Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core - A composite wafer including a carrier substrate having a graphite core and a monocrystalline semiconductor substrate or layer attached to the carrier substrate and a corresponding method for manufacturing such a composite wafer is provided. | 03-13-2014 |
20140170446 | Sensor Module and Battery Elements - A sensor module includes an enclosure adapted to hermetically seal an opening or a hole on the outer surface of a casing or packaging, a sensor element and a membrane. The membrane is arranged between the enclosure and the opening or hole of the casing or packaging. | 06-19-2014 |
20140209852 | Semiconductor Device Including a Phase Change Material - A semiconductor device includes a transistor including a plurality of transistor cells in a semiconductor body, each transistor cell including a control terminal and first and second load terminals. The semiconductor device further includes a first electrical connection electrically connecting the first load terminals. The semiconductor device further includes a second electrical connection electrically connecting the second load terminals. The transistor further includes a phase change material exhibiting a solid-solid phase change at a phase transition temperature T | 07-31-2014 |
20140260545 | SENSOR AND SENSING METHOD - A sensor is provided, which may include: a sensor layer containing a sensor material, wherein an electrical resistance of the sensor material changes upon adsorption of an adsorbate at the sensor material; a circuit electrically coupled to the sensor layer and configured to apply an electrical current to the sensor layer that heats the sensor layer. | 09-18-2014 |
20140264255 | Method for Making a Sensor Device Using a Graphene Layer - A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces. | 09-18-2014 |
20140270271 | MEMS Acoustic Transducer, MEMS Microphone, MEMS Microspeaker, Array of Speakers and Method for Manufacturing an Acoustic Transducer - A MEMS acoustic transducer includes a substrate having a cavity therethrough, and a conductive back plate unit including a plurality of conductive perforated back plate portions which extend over the substrate cavity. A dielectric spacer arranged on the back plate unit between adjacent conductive perforated back plate portions, and one or more graphene membranes are supported by the dielectric spacer and extend over the conductive perforated back plate portions. | 09-18-2014 |
20140306184 | TWO-DIMENSIONAL MATERIAL CONTAINING ELECTRONIC COMPONENTS - In various embodiments, an electronic component is provided. The electronic component may include a dielectric structure; and a two-dimensional material containing structure over the dielectric structure. The dielectric structure is doped with dopants to change the electric characteristic of the two-dimensional material containing structure. | 10-16-2014 |
20140335676 | METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE - According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate. | 11-13-2014 |
20140374906 | METHOD FOR PROCESSING A CARRIER AND AN ELECTRONIC COMPONENT - In various embodiments, a method for processing a carrier is provided. The method for processing a carrier may include: forming a first catalytic metal layer over a carrier; forming a source layer over the first catalytic metal layer; forming a second catalytic metal layer over the source layer, wherein the thickness of the second catalytic metal layer is larger than the thickness of the first catalytic metal layer; and subsequently performing an anneal to enable diffusion of the material of the source layer forming an interface layer adjacent to the surface of the carrier from the diffused material of the source layer. | 12-25-2014 |