Guebey
Jonas Guebey, Kriens CH
Patent application number | Description | Published |
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20090038950 | High speed method for plating palladium and palladium alloys - A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. | 02-12-2009 |
20130284605 | HIGH SPEED METHOD FOR PLATING PALLADIUM AND PALLADIUM ALLOYS - A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. | 10-31-2013 |
20140306147 | CHROME-FREE METHODS OF ETCHING ORGANIC POLYMERS WITH MIXED ACID SOLUTIONS - A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal. | 10-16-2014 |
Jonas Guebey, Lucerne CH
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20110147220 | ANTI-DISPLACEMENT HARD GOLD COMPOSITIONS - Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold. | 06-23-2011 |
20110147225 | HIGH SPEED METHOD FOR PLATING PALLADIUM AND PALLADIUM ALLOYS - A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. | 06-23-2011 |
Jonas Guebey, Luzern CH
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20130236742 | ADHESION PROMOTION OF CYANIDE-FREE WHITE BRONZE - White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals. | 09-12-2013 |
Jonas Guebey, Adligenswil CH
Patent application number | Description | Published |
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20130224515 | METHOD OF PREVENTING SILVER TARNISHING - A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity. | 08-29-2013 |