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Grunow, US
Christopher Grunow, Tucson, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090292798 | APPARATUS, SYSTEM, AND METHOD FOR COMMUNICATING CONTROL MESSAGES BETWEEN A FIRST DEVICE AND A SECOND DEVICE - An apparatus and system are provided for communicating control messages between a first device and a second device. The apparatus and system include a communication module that directs control messages between a first device and a second device through an intermediate device. The intermediate device is coupled to the first device by a control path and to the second device by a data path. The apparatus and system also include a translation module and a transmission module that cooperate to translate control messages received over the control path at the intermediate device to transport data messages and transport data messages received over the data path at the second device to control messages. Transport data messages are sent over the data path to the second device and control messages from the second device are sent over the control path to the first device. | 11-26-2009 |
David William Grunow, Round Rock, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20090115197 | Apparatus, Systems and Methods for Damping Vibration of an Elastic Member within an Information Handling System Latch - The disclosure provides a system, apparatus, and method for damping vibration of an elastic member within a latch for securing a top panel to a base of an information handling system (IHS) wherein the latch includes an elastic member with a first end and a second end, the first end attached to a fixed portion of the top panel. The latch may further include a body attachable to the top panel, the body defining a cavity for receiving the elastic member, wherein the body further comprises a movable anchor for attaching the second end of the elastic member and a raised portion, wherein the raised portion is in contact with the elastic member within the cavity to damp vibration of the elastic member and an actuation tab coupled to the body to engage the body in a movable position. | 05-07-2009 |
Gerard Grunow, Tucson, AZ US
| Patent application number | Description | Published |
|---|---|---|
| 20090292798 | APPARATUS, SYSTEM, AND METHOD FOR COMMUNICATING CONTROL MESSAGES BETWEEN A FIRST DEVICE AND A SECOND DEVICE - An apparatus and system are provided for communicating control messages between a first device and a second device. The apparatus and system include a communication module that directs control messages between a first device and a second device through an intermediate device. The intermediate device is coupled to the first device by a control path and to the second device by a data path. The apparatus and system also include a translation module and a transmission module that cooperate to translate control messages received over the control path at the intermediate device to transport data messages and transport data messages received over the data path at the second device to control messages. Transport data messages are sent over the data path to the second device and control messages from the second device are sent over the control path to the first device. | 11-26-2009 |
Jonathan T. Grunow, Indian Trail, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20090091886 | PORTABLE DATA TERMINAL INTERNAL SUPPORT STRUCTURE - A portable data terminal comprising a circuit board which supports and interconnects a plurality of electrical components, a display, an angled frame which maintains the display at an angle to the circuit board, and a bracket which extends across the angled frame. The angled frame engages a peripheral portion of a first side of the circuit board. The bracket engages the circuit board so as to reduce the flexure of, and secure at least one electrical component on the circuit board. | 04-09-2009 |
| 20090093229 | Panic Button for Data Collection Device - A data collection device comprising: a data collection subsystem; a wireless communication device; a dedicated panic button; and a processor that, responsive to a user activating the dedicated panic button, uses the wireless communication device to cause a message to be sent to a designated emergency contact. | 04-09-2009 |
Philip A. Grunow, San Leandro, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100124723 | METHOD FOR THE PROTECTION OF EXTREME ULTRAVIOLET LITHOGRAPHY OPTICS - A coating for the protection of optical surfaces exposed to a high energy erosive plasma. A gas that can be decomposed by the high energy plasma, such as the xenon plasma used for extreme ultraviolet lithography (EUVL), is injected into the EUVL machine. The decomposition products coat the optical surfaces with a protective coating maintained at less than about 100 Å thick by periodic injections of the gas. Gases that can be used include hydrocarbon gases, particularly methane, PH | 05-20-2010 |
Sarah L. Grunow, Poughkeepsie, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100237467 | Interconnect Structures, Methods for Fabricating Interconnect Structures, and Design Structures for a Radiofrequency Integrated Circuit - Interconnect structures that include a passive element, such as a thin film resistor or a metal-insulator-metal (MIM) capacitor, methods for fabricating an interconnect structure that includes a passive element, and design structures embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit, such as a radiofrequency integrated circuit. A top surface of a dielectric layer is recessed relative to a top surface of a conductive feature in the dielectric layer. The passive element is formed on the recessed top surface of the dielectric layer and includes a layer of a conductive material that is coplanar with, or below, the top surface of the conductive feature. | 09-23-2010 |
Stephan Grunow, Dallas, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20090085197 | Method of Fabrication of On-Chip Heat Pipes and Ancillary Heat Transfer Components - The density of components in integrated circuits (ICs) is increasing with time. The density of heat generated by the components is similarly increasing. Maintaining the temperature of the components at reliable operating levels requires increased thermal transfer rates from the components to the IC package exterior. Dielectric materials used in interconnect regions have lower thermal conductivity than silicon dioxide. This invention comprises a heat pipe located in the interconnect region of an IC to transfer heat generated by components in the IC substrate to metal plugs located on the top surface of the IC, where the heat is easily conducted to the exterior of the IC package. Refinements such as a wicking liner or reticulated inner surface will increase the thermal transfer efficiency of the heat pipe. Strengthening elements in the interior of the heat pipe will provide robustness to mechanical stress during IC manufacture. | 04-02-2009 |
Stephan Grunow, Wappingers Falls, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080197495 | STRUCTURE FOR REDUCING LATERAL FRINGE CAPACITANCE IN SEMICONDUCTOR DEVICES - A semiconductor structure includes a plurality of conductive lines formed within an interlevel dielectric (ILD) layer and a non-planar cap layer formed over the ILD layer and the conductive lines, wherein the cap layer is raised with respect to the conductive lines at locations between the conductive lines. | 08-21-2008 |
| 20090146143 | TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNESSES FOR DUAL DAMASCENE PROCESSING - A test structure for integrated circuit (IC) device fabrication includes a plurality of test structure chains formed at various regions of an IC wafer, each of the plurality of test structure chains including one or more vias; each of the one or more vias in contact with a conductive line disposed thereabove, the conductive line being configured such that at least one dimension thereof varies from chain to chain so as to produce variations in seed layer and liner layer thickness from chain to chain for the same deposition process conditions. | 06-11-2009 |
| 20090151981 | GAP FREE ANCHORED CONDUCTOR AND DIELECTRIC STRUCTURE AND METHOD FOR FABRICATION THEREOF - A microelectronic structure and a method for fabricating the microelectronic structure use a dielectric layer that is located and formed upon a first conductor layer. An aperture is located through the dielectric layer. The aperture penetrates vertically into the first conductor layer and extends laterally within the first conductor layer beneath the dielectric layer while not reaching the dielectric layer, to form an extended and winged aperture. A contiguous via and interconnect may be formed anchored into the extended and winged aperture while using a plating method, absent voids | 06-18-2009 |
Stephan Grunow, Hopewell Junction, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20110092069 | SELF-ALIGNED PATTERNED ETCH STOP LAYERS FOR SEMICONDUCTOR DEVICES - A method of forming a semiconductor device includes patterning a photoresist layer formed over a homogeneous semiconductor device layer to be etched; subjecting the semiconductor device to an implant process that selectively implants a sacrificial etch stop layer that is self-aligned in accordance with locations of features to be etched within the homogeneous semiconductor device layer, and at a desired depth for the features to be etched; etching a feature pattern defined by the patterned photoresist layer into the homogenous semiconductor device layer, stopping on the implanted sacrificial etch stop layer; and removing remaining portion of the implanted sacrificial etch stop layer prior to filling the etched feature pattern with a fill material. | 04-21-2011 |
| 20110108990 | Capping of Copper Interconnect Lines in Integrated Circuit Devices - A method for capping lines includes forming a metal film layer on a copper line by a selective deposition process, the copper line disposed in a dielectric substrate, wherein the depositing also results in the deposition of stray metal material on the surface of the dielectric substrate, and etching with an isotropic etching process to remove a portion of the metal film layer and the stray metal material on the surface of the dielectric substrate, wherein the metal film layer is deposited at an initial thickness sufficient to leave a metal film layer cap remaining on the copper line following the removal of the stray metal material. | 05-12-2011 |
Stephen Grunow, Poughkeepsie, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080290515 | PROPERTIES OF METALLIC COPPER DIFFUSION BARRIERS THROUGH SILICON SURFACE TREATMENTS - In accordance with the invention, there are diffusion barriers, integrated circuits, and semiconductor devices and methods of fabricating them. The method of fabricating a diffusion barrier can include providing a dielectric layer, forming a first silicon enriched layer over the dielectric layer by exposing the dielectric layer to a silicon-containing ambient, and forming a barrier layer over the first silicon enriched layer. | 11-27-2008 |
Todd G. Grunow, Port Orchard, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20110017882 | HOSE HOLSTER - A mechanical apparatus for securely holding a hose, even while liquid is flowing through the hose, by creating a frictional force on the hose without kinking or otherwise restricting the flow through the hose. The apparatus includes a tube with a diameter suitably larger than the hose to be used with the apparatus. The tube includes a suitable bend such that the hose must bend as it passes through the tube. The apparatus also includes a bracket allowing the apparatus to be attached to, for example, a bucket or other suitable reservoir. | 01-27-2011 |