| Patent application number | Description | Published |
|---|
| 20090142858 | Power-Measured Pulses for Thermal Trimming - A circuit for trimming a thermally-trimmable resistor, measuring a temperature coefficient of resistance of the thermally-trimmable resistor, and annealing a thermally-trimmable resistor post-trimming, the circuit comprising: a thermally-isolated area on a substrate housing the thermally-trimmable resistor; heating circuitry for applying a signal to a heating resistor; and a constant-power module adapted to maintain power dissipated in the heating resistor substantially constant over a duration of the signal by varying at least one parameter of the signal as a result of a change in resistance of the heating resistor during the signal. | 06-04-2009 |
| 20090205196 | SELF-HEATING EFFECTS DURING OPERATION OF THERMALLY-TRIMMABLE RESISTORS - The thermal isolation of a thermally-trimmable resistor has a direct impact on temperature rise. It is possible to design the thermal isolation of the portions of a compound resistor to minimize or optimize the resistance variation of the overall compound resistor. The resistance variation of the overall compound resistor due to self-heating of its portions can be reduced or optimized, by designing different thermal isolation for each of the portions, such that compensation and/or optimization can occur. Furthermore, one can also design such different thermal isolation of the portions of a compound resistor to minimize resistance variation over a trim range of a compound resistor due to self-heating. | 08-20-2009 |
| 20090322356 | THERMAL PRE-SCANNING OF ELECTRIC CIRCUITS USING THERMALLY-TRIMMABLE RESISTORS - There is described a method to change the value of a thermally-trimmable resistor in a non-permanent way by raising the temperature of the thermally-trimmable resistor to a level that is somewhere between room temperature and trimming temperature. By doing this, the trimming range that is available via true thermal trimming may be explored without actually trimming the value of the resistor. This is possible when the thermal Iy-trimmable resistor, or a portion thereof, has an essentially non-zero temperature coefficient of resistance (TCR). | 12-31-2009 |
| 20100073121 | MULTI-STRUCTURE THERMALLY TRIMMABLE RESISTORS - A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor. | 03-25-2010 |
| 20100101077 | BIDIRECTIONAL THERMAL TRIMMING OF ELECTRICAL RESISTANCE - There are described various methods and circuits for trimming the parameter value of a thermally mutable electrical component in two directions. A sequence of heat pulses is selected as a function of thermal history using an adaptive trimming algorithm, where parameters of the sequence of heat pulses are based on a resulting impact of previous heating pulses. Direction of trimming, trimming increment, and remaining trimming distance can all be used to determine the parameters of succeeding heat pulses, wherein the parameters of the pulses can be, for example, amplitude, duration, and time interval between pulses. | 04-29-2010 |
| 20110220631 | METHOD OF STABILIZING THERMAL RESISTORS - There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component | 09-15-2011 |
| 20110314435 | ETCHING TECHNIQUE FOR CREATION OF THERMALLY-ISOLATED MICROSTRUCTURES - There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist. | 12-22-2011 |
| 20120017424 | POWER-MEASURED PULSES FOR THERMAL TRIMMING - A method for post-thermal-trimming annealing a thermally-trimmable resistor thermally-isolated on a substrate, the method comprising: trimming said thermally-trimmable resistor by applying a first power-measured signal to a heating resistor; and applying a second power-measured signal corresponding to a desired average annealing temperature to said heating resistor, wherein said second power-measured signal has a lower power level than said first power-measured signal. | 01-26-2012 |
