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Groenhuis
Magne Roar Groenhuis, Groningen NL
| Patent application number | Description | Published |
|---|---|---|
| 20090254515 | SYSTEM AND METHOD FOR PRESENTING GALLERY RENDITIONS THAT ARE IDENTIFIED FROM A NETWORK - A presentation system provided for use on a network. The presentation system includes an index and one or more modules. The index that stores gallery information, the gallery including (i) information that identifies a plurality of galleries, and (ii) data corresponding to renditions of individual media objects that comprise at least a portion of each of the plurality of galleries. The one or more modules may be configured to (i) receive a selection criteria, (ii) use the selection criteria to identify, from the index, one or more galleries from the index, and (iii) generate a presentation that includes renditions of at least some of the plurality of media objects that comprise the identified one or more galleries. | 10-08-2009 |
| 20090254643 | SYSTEM AND METHOD FOR IDENTIFYING GALLERIES OF MEDIA OBJECTS ON A NETWORK - Collections of media objects may be aggregated from network resources available over a network. An embodiment provides that a network resource is accessed at each of a plurality of network locations. The network resource is analyzed at each network location to determine whether the network resource includes, or provides access to, any or all media objects in a set of multiple media objects that collectively satisfy one or more editorial criteria for being deemed a gallery, as presented at the network location or network locations where the multiple media objects are provided. The information about the set of media objects may be stored. | 10-08-2009 |
Roelf Groenhuis, Nijmegen NL
| Patent application number | Description | Published |
|---|---|---|
| 20080230926 | Surface Treatments for Contact Pads Used in Semiconductor Chip Packagages and Methods of Providing Such Surface Treatments - An inorganic solder mask ( | 09-25-2008 |
Roelf Anco Jacob Groenhuis, Nijmegen NL
| Patent application number | Description | Published |
|---|---|---|
| 20080272475 | Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package - A die package ( | 11-06-2008 |
| 20080277772 | Methods of Packaging a Semiconductor Die and Package Formed by the Methods - A method of packaging a semiconductor die ( | 11-13-2008 |
| 20090162791 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF - The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer. | 06-25-2009 |
| 20100117171 | SENSOR PACKAGE - Sensor package | 05-13-2010 |