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Greisen

Christoffer G. Greisen, Valby DK

Patent application number	Description	Published
20100244055	SEMICONDUCTOR-BASED SUB-MOUNTS FOR OPTOELECTRONIC DEVICES WITH CONDUCTIVE PATHS TO FACILITATE TESTING AND BINNING - The disclosure facilitates testing and binning of multiple LED chip or other optoelectronic chip packages fabricated on a single semiconductor wafer. The testing can take place prior to dicing. For example, in one aspect, metallization on the front-side of a semiconductor wafer electrically connects together cathode pads (or anode pads) of adjacent sub-mounts such that the cathode pads (or anode pads) in a given column of sub-mounts are electrically connected together. Likewise, metallization on the back-side of the wafer electrically connects together anode pads (or cathode pads) of adjacent sub-mounts such that the anode pads (or cathode pads) in a given row of sub-mounts are electrically connected together. Probe pads, which can be located one or both sides of the wafer, are electrically connected to respective ones of the rows or columns.	09-30-2010
20110101350	SEMICONDUCTOR-BASED SUB-MOUNTS FOR OPTOELECTRONIC DEVICES WITH CONDUCTIVE PATHS - The disclosure facilitates testing and binning of multiple LED chip or other optoelectronic chip packages fabricated on a single semiconductor wafer. The testing can take place prior to dicing. For example, in one aspect, metallization on the front-side of a semiconductor wafer electrically connects together cathode pads (or anode pads) of adjacent sub-mounts such that the cathode pads (or anode pads) in a given column of sub-mounts are electrically connected together. Likewise, metallization on the back-side of the wafer electrically connects together anode pads (or cathode pads) of adjacent sub-mounts such that the anode pads (or cathode pads) in a given row of sub-mounts are electrically connected together. Probe pads, which can be located one or both sides of the wafer, are electrically connected to respective ones of the rows or columns.	05-05-2011

Christoffer Graae Greisen, Valby DK

Patent application number	Description	Published
20080199982	Fabrication Process for Package With Light Emitting Device On A Sub-Mount - A method of fabricating a package with a light emitting device includes depositing a first metallization to form a conductive pad on which the light emitting device is to be mounted and to form one or more feed-through interconnections extending through a semiconductor material that supports the conductive pad. Subsequently, a second metallization is deposited to form a reflective surface for reflecting light, emitted by the light emitting device, through a lid of the package. Deposition of the second metallization is de-coupled from deposition of the first metallization.	08-21-2008

Marc Greisen, Snohomish, WA US

Patent application number	Description	Published
20080244564	Bookmark and configuration file for installation sequence - A bookmark file is stored in persistent storage and is updated as various tasks are completed during an installation process. The bookmark file may be read when an installation process is started so that the installation process may continue from a point after the last successfully completed task, if the installation process had failed and was restarted. The bookmark file may also include data collected from a user interface during the installation process. When an installation process is restarted, some embodiments may present the data in a user interface for the user to modify. The installation process may be defined in a configuration file that includes metadata that defines the sequence of installation tasks as well as some error handling for various tasks.	10-02-2008
20090089776	Configuration and Change Management System with Restore Points - A configuration and change management system may have installation and configuration processes that include a discovery mechanism for discovering incomplete installations or configuration changes, a cleanup mechanism for placing the system in a state to continue, an installation or configuration mechanism, and a rollback mechanism for rolling back to a defined restore point if a problem is detected. The configuration and change management system may be used for initial installation, as well as configuration changes after installation. The system may be used in a multiple server environment with interdependencies between devices, as well as a multiple services environment with interdependencies between applications and services, including services provided over the Internet.	04-02-2009
20100031248	Installation Sequence Manager - An installation manager may have a user interface that may enable a user to modify the execution of an installation sequence. A user may indicate an installation step or task within a step that may for pausing the sequence, skipping the step or task, repeating a step or task, or closely monitoring a specific step or task. The user's modifications to the installation sequence may be presented in the user interface, and the modifications may persist even when a system reboot operation is performed during the sequence. The installation manager may enable a user to augment the installation sequence by pausing the sequence, inspecting an item or performing an additional task, and resuming the sequence.	02-04-2010
20100058105	Environment Wide Configuration System - An installation and configuration system consolidates workloads of multiple applications and services, including applications or services that may be installed or configured on multiple server devices or remotely hosted services. The system gathers environmental information, analyzes dependencies among the workloads, and populates the input data used by the workloads from a common database. The system then executes the workloads, allowing branching within the workloads or the sequence of workloads. An example of branching may include detecting an error condition, pausing the sequence, and presenting alternative fixes to a user.	03-04-2010