Patent application number | Description | Published |
20080295966 | Electrode Assembly For The Removal Of Surface Oxides By Electron Attachment - An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas. | 12-04-2008 |
20090223831 | Removal of Surface Oxides by Electron Attachment - The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate. | 09-10-2009 |
20090236236 | Removal of Surface Oxides by Electron Attachment - Described herein are a method and an apparatus for removing metal oxides from a substrate surface within a target area. In one particular embodiment, the method and apparatus has an energizing electrode which has an array of protruding conductive tips that are electrically connected by a conductive wire and separated into a first electrically connected group and a second electrically connected group wherein at least a portion of the conductive tips are activated by a DC voltage source that is negatively biased to generate electrons within the target area that attach to at least a portion of a reducing gas that is present in the target area to form a negatively charged reducing gas that contacts the treating surface to reduce the metal oxides on the treating surface of the substrate. | 09-24-2009 |
20110094679 | ELECTRODE ASSEMBLY FOR THE REMOVAL OF SURFACE OXIDES BY ELECTRON ATTACHMENT - An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas. | 04-28-2011 |
20110204123 | Method for the Removal of Surface Oxides by Electron Attachment - Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface within a target area. In one particular embodiment, the method and apparatus form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes and exposing at least a portion of the layer and solder bumps to the energizing electrode. | 08-25-2011 |
20120055980 | Apparatus and Method for Providing an Inerting Gas During Soldering - Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus that is placed atop of a solder reservoir and comprises a plurality of porous tubes that are in fluid communication with an inerting gas. In another aspect, there is provided a method for providing an inerting gas to a wave soldering apparatus comprising the steps of, among other things, placing an apparatus atop at least one edge of the solder reservoir wherein the apparatus comprises a plurality of tubes comprising one or more openings in fluid communication with an inerting gas source. In a further aspect, at least one of the tubes comprises a non-stick coating or is comprised of a porous non-stick material such as a sleeve. | 03-08-2012 |
20130098974 | Apparatus And Method For Providing An Inerting Gas During Soldering - Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap. | 04-25-2013 |
20140027495 | Apparatus And Method For Providing An Inerting Gas During Soldering - Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a base comprising an interior volume in fluid communication with an inerting gas source, a tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough, and one or more support legs comprising an interior volume in fluid communication with the interior volume of the base and the interior volume of the tube, wherein the one or more support legs extend vertically upward from the base and elevate the tube above the surface of molten solder contained within a solder reservoir, and wherein the inerting gas travels through the base, upward through the one or more support legs, into the interior volume of the tube, and out through the one or more perforations in the tube. | 01-30-2014 |