Patent application number | Description | Published |
20100117885 | ELECTROMAGNETIC SCANNING IMAGER - In one aspect, the present invention provides an imager, preferably portable, that includes a source of electromagnetic radiation capable of generating radiation with one or more frequencies in a range of about 1 GHz to about 2000 GHz. An optical system that is optically coupled to the source focuses radiation received therefrom onto an object plane, and directs at least a portion of the focused radiation propagating back from the object plane onto an image plane. The imager further includes a scan mechanism coupled to the optical system for controlling thereof so as to move the focused radiation over the object plane. A detector optically coupled to the lens at the image plane detects at least a portion of the radiation propagating back from a plurality of scanned locations in the object plane, thereby generating a detection signal. A processor that is in communication with the detector generates an image of at least a portion of the object plane based on the detection signal. | 05-13-2010 |
20140007436 | POWER TOOL INCLUDING AN ANTI-VIBRATION HANDLE - A power tool includes a tool operable to work on a workpiece, a drive mechanism coupled to the tool and operable to move the tool, and a housing defining an interior. The drive mechanism is disposed within the interior. A handle has a first end and a second end. The first end is fixed to the housing and the second end is spaced apart from the housing to define a gap therebetween. An insert is fixedly attached to the housing and the second end to fill the gap. The insert is more flexible then the handle and the housing. | 01-09-2014 |
20140190715 | TOOL WITH ROTATABLE HEAD - An articulating head of a power tool is disclosed in the present invention, which includes a base member adapted to couple to a main body of the power tool, an articulating member pivotably connected to the base member, and a locking device coupled to the articulating member for locking an orientation of the articulating member with respect to the base member. The base member contains a first power transmission part which is capable of receiving mechanical driving power from the main body of the power tool. The articulating member contains a second power transmission part mechanically coupled to the first power transmission part. The locking device has an actuation lever rotatable about a pivot axis between a free position and a lock position. | 07-10-2014 |
Patent application number | Description | Published |
20100268325 | MEDICAL DEVICES AND METHODS OF MAKING THE SAME - Medical devices, such as endoprostheses, and methods of making the devices are disclosed. In some embodiments, an endoprosthesis includes a first portion having a first width, and a second portion having a second width different than the first width, wherein the first and second portions have different grain sizes. | 10-21-2010 |
20110245905 | ENDOPROSTHESIS - Among other things, a bio-erodible implantable endoprosthesis comprises a member that includes (a) a core having a surface, and (b) a bio-erodible metal on a least a portion of the surface of the core, wherein the bio-erodible metal erodes more slowly than the core and includes openings through which physiological fluids can access the core upon implantation. | 10-06-2011 |
20120095548 | MEDICAL IMPLANT INCLUDING A MAGNESIUM-BASED TIE LAYER - A medical implant includes a metallic base, a tie layer, and at least a first layer overlying an outer surface of the tie layer. The tie layer is bonded to at least a portion of a surface of the metallic base. The tie layer includes magnesium or a magnesium-based alloy. The tie layer can have an outer surface comprising dendritic grains. The tie layer can have a rough outer surface defined by pores, projecting grain structures, and/or projecting particles. A method of producing a tie layer on a medical device includes applying magnesium or a magnesium-based alloy to the medical device and cooling the magnesium or the magnesium-based alloy to produce a rough outer surface. | 04-19-2012 |
20140058275 | PRESSURE-SENSING MEDICAL DEVICES AND MEDICAL DEVICE SYSTEMS - Medical device systems and methods for making and using medical device systems are disclosed. An example medical device system may include a guidewire. A pressure sensor assembly may be disposed within the guidewire. The pressure sensor assembly may include a pressure sensor and a first optical fiber coupled to the pressure sensor. The first optical fiber may have a first outer diameter. A cable may be coupled to the guidewire. The cable may include a second optical fiber. The second optical fiber may have a second outer diameter greater than the first outer diameter. | 02-27-2014 |
20140276109 | PRESSURE SENSING GUIDEWIRE - Medical devices and methods for making and using medical devices are disclosed. An example medical device includes a pressure sensing guidewire. The pressure sensing guidewire may include a tubular member having a proximal portion and a distal portion. The distal portion may have a plurality of slots formed therein. The distal portion may have a first wall thickness along a first region and a second wall thickness different from the first wall thickness along a second region. A pressure sensor may be disposed within the distal portion of the tubular member. | 09-18-2014 |
Patent application number | Description | Published |
20080215136 | DIFFERENTIAL DRUG RELEASE FROM A MEDICAL DEVICE - The invention relates to a medical device, such as an intravascular stent, useful for delivering two or more therapeutic agents to a body tissue of a patient at different rates, and methods for making and using such medical device. The medical device includes a substrate and/or coating having a plurality of pores, dispersed in said pores are a plurality of a first and second therapeutic agents, wherein said first therapeutic agent is bonded to one or more molecule(s) of a first material and the second therapeutic agent bonded to one or more molecule(s) of a second material, such that when the medical device, is in use (e.g., implanted into a body lumen such as a blood vessel), bonded first therapeutic agent is released from the medical device at a rate that is slower than the rate at which the bonded second therapeutic agent is released from the medical device. | 09-04-2008 |
20090118820 | DEFORMABLE UNDERLAYER FOR STENT - An endoprosthesis includes a brittle layer, e.g. a ceramic and an underlayer to accommodate dimensional changes as the endoprosthesis is flexed. | 05-07-2009 |
20090216185 | BALLOON CATHETER WITH DURABLE TIP PORTION - A durable distal tip structure for an intravascular catheter that may include a distal portion comprising a ring of durable material configured to provide a durable distal tip to the catheter, and a proximal portion extending proximally from the distal portion and configured for connecting the distal tip structure to the catheter, wherein the proximal portion of the distal tip structure is more laterally flexible than the distal portion. In some cases, the durable distal tip structure comprises a metal or metal alloy, and in some cases, the distal ring portion and proximal portion of the durable distal tip structure comprise a single monolith of material. Also, catheters including such durable distal tip structures, and methods of making and using such catheters. In some cases, the catheter is a balloon catheter. In some other embodiments, the catheter is a stent delivery catheter for a self expanding stent. | 08-27-2009 |
20100137977 | Coating for Medical Device Having Increased Surface Area - Described herein are implantable medical devices for delivering a therapeutic agent to the body tissue of a patient, and methods for making such medical devices. In particular, the implantable medical devices, such as intravascular stents, have a coating which includes at least one coating composition and has an exposed abluminal surface and an exposed luminal surface or exposed side surface. | 06-03-2010 |
20110009942 | BALLOON CATHETER - Balloon catheters and stent delivery systems including bifurcated stent delivery systems are disclosed. An example bifurcated stent delivery system may include an elongate shaft including a proximal section, a midshaft section, and a distal section. The proximal section may include a tubular member having a plurality of slots formed therein. The slots may be arranged in one or more sections having differing slot densities. The midshaft section may include a guidewire port in fluid communication with a guidewire lumen formed in the shaft. A main branch balloon may be coupled to the shaft. A side branch balloon may be disposed adjacent to the main branch balloon. A stent may be disposed on the main branch balloon and on the side branch balloon. | 01-13-2011 |
20110301574 | ADJUSTABLE STIFFNESS CATHETER - Medical devices such as catheters can include structure or provision that permit a physician or other health care professional to adjust the stiffness of at least a portion of the medical device. In some instances, the medical device may be adjusted prior to inserting the medical device into a patient. In some cases, the medical device may be adjusted while in use within the patient. | 12-08-2011 |
20130096535 | ADJUSTABLE STIFFNESS CATHETER - Medical devices such as catheters can include structure or provision that permit a physician or other health care professional to adjust the stiffness of at least a portion of the medical device. In some instances, the medical device may be adjusted prior to inserting the medical device into a patient. In some cases, the medical device may be adjusted while in use within the patient. | 04-18-2013 |
20140005558 | PRESSURE SENSING GUIDEWIRE | 01-02-2014 |
Patent application number | Description | Published |
20120032322 | FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION - A flip chip package includes a substrate having a die attach surface; and a die mounted on the die attach surface with an active surface of the die facing the substrate, wherein the die is interconnected to the substrate via a plurality of copper pillar bumps on the active surface, wherein at least one of the plurality of copper pillar bumps has a bump width that is substantially equal to or smaller than a line width of a trace on the die attach surface of the substrate. | 02-09-2012 |
20120032343 | PACKAGE SUBSTRATE FOR BUMP ON TRACE INTERCONNECTION - A package substrate including a conductive pattern disposed on a die attach surface of the package substrate; at least one bumping trace inlaid into the conductive pattern; and at least one gap disposed along with the bumping trace in the conductive pattern to separate the bumping trace from a bulk portion of the conductive pattern. The bumping trace may have a lathy shape from a plan view and a width substantially between 10 μm and 40 μm and a length substantially between 70 μm and 130 μm, for example. | 02-09-2012 |
20120140427 | PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEAD (A-QFN) PACKAGE - A printed circuit board assembly (PCB) assembly is provided, including a printed circuit board (PCB) comprising a plurality of conductive pads and an advanced quad pack no-lead chip (a-QFN) package soldered to the printed circuit board. In one embodiment, the conductive pads have a first surface area and the QFN package includes a plurality of leads facing the conductive pads, having a second surface area, wherein a ratio between the second surface area and the first surface area is about 20% to 85% to ensure a physical connection between the PCB and the a-QFN package. | 06-07-2012 |
20130087911 | INTEGRATED CIRCUIT PACKAGE STRUCTURE - An integrated circuit (IC) package structure is provided, including: a first integrated circuit (IC) package, including: a first package substrate, having opposite first and second surfaces, wherein a first semiconductor chip is disposed over a first portion of the first surface of the first package substrate. In addition, a second integrated circuit (IC) package is disposed on a second portion different from the first portion of the first surface of the first package substrate, including: a second package substrate, having opposite third and fourth surfaces, wherein a second semiconductor chip is disposed over a portion of the third surface of the second package substrate, and the second semiconductor chip has a function different from that of the first semiconductor chip. | 04-11-2013 |
20130140694 | FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION - A flip chip package includes a substrate having a die attach surface; and a die mounted on the die attach surface with an active surface of the die facing the substrate, wherein the die is interconnected to the substrate via a plurality of copper pillar bumps on the active surface, wherein at least one of the plurality of copper pillar bumps has a bump width that is substantially equal to or smaller than a line width of a trace on the die attach surface of the substrate. | 06-06-2013 |
20130161810 | SEMICONDUCTOR PACKAGE - The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A solder resistance layer is disposed on the substrate, having an extending portion covering a portion of the first conductive trace, wherein a width of the extending portion of the solder resistance layer is larger than that of the portion of the first conductive trace. A semiconductor die is disposed over the first conductive trace. | 06-27-2013 |
20130168857 | MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME - The invention provides a molded interposer package and a method for fabricating the same. The molded interposer package includes a plurality of metal studs. A molding material encapsulates the metal studs leaving the bottom surfaces of the metal studs exposed. A first chip is disposed on the molding material, connecting to the top surfaces of the metal studs. A plurality of solder balls connects and contacts to the bottom surfaces of the metal studs. | 07-04-2013 |
20130221536 | ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT - A flip chip package includes a carrier coupled to a die. The carrier includes: at least a via, for coupling the surface of the carrier to electrical traces in the carrier; and at least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via. The die includes: at least a bond pad formed on the surface of the die; and at least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein the copper column is disposed on one side of the capture pad about the via opening only. | 08-29-2013 |
20140091481 | SEMICONDUCTOR PACKAGE - The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A first conductive trace disposed on the substrate. A semiconductor die is disposed over the first conductive trace. A solder resist layer that extends across an edge of the semiconductor die is also included. Finally, an underfill material is provided that fills a gap between the substrate and the semiconductor die. | 04-03-2014 |
20140127865 | MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME - A method includes the operations performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; mounting a carrier on the top surface of the metal sheet, covering the first recesses; performing a second anisotropic etching process to remove a portion of the metal sheet under the first recesses from the bottom surface of the metal sheet; filling a molding material from the bottom surface of the metal sheet, leaving the bottom surface of the metal sheet exposed; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed. | 05-08-2014 |
20140377913 | MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a molded interposer package includes performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet, forming a molding material covering the top surface, filling the first recesses, forming a plurality of first via openings in the molding material, wherein the first via openings expose the top surface, forming a plurality of first metal vias in the first via openings and a plurality of first redistribution layer patterns respectively on the first metal vias, performing a second anisotropic etching process to remove a portion of the metal sheet from a bottom surface of the metal sheet until a bottom of the molding material is exposed, and forming a solder mask layer on the molding material, leaving the first redistribution layer patterns exposed. | 12-25-2014 |