Graziosi
Danillo B. Graziosi, Carlsbad, CA US
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20150201176 | Methods for Full Parallax Compressed Light Field 3D Imaging Systems - A compressed light field imaging system is described. The light field 3D data is analyzed to determine optimal subset of light field samples to be (acquired) rendered, while the remaining samples are generated using multi-reference depth-image based rendering. The light field is encoded and transmitted to the display. The 3D display directly reconstructs the light field and avoids data expansion that usually occurs in conventional imaging systems. The present invention enables the realization of full parallax 3D compressed imaging system that achieves high compression performance while minimizing memory and computational requirements. | 07-16-2015 |
Danillo B. Graziosi, Somerville, MA US
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20120269458 | Method for Generating High Resolution Depth Images from Low Resolution Depth Images Using Edge Layers - A method interpolates and filters a depth image with reduced resolution to recover a high resolution depth image using edge information, wherein each depth image includes an array of pixels at locations and wherein each pixel has a depth. The reduced depth image is first up-sampled, interpolating the missing positions by repeating the nearest-neighboring depth value. Next, a moving window is applied to the pixels in the up-sampled depth image. The window covers a set of pixels centred at each pixel. The pixels covered by the window are selected according to their relative offset to the depth edge, and only pixels that are within the same side of the depth edge of the centre pixel are used for the filtering procedure. | 10-25-2012 |
Danillo Bracco Graziosi, Somerville, MA US
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20130202194 | Method for generating high resolution depth images from low resolution depth images using edge information - A method interpolates and filters a depth image with reduced resolution to recover a high resolution depth image using edge information, wherein each depth image includes an array of pixels at locations and wherein each pixel has a depth. The reduced depth image is first up-sampled, interpolating the missing positions by repeating the nearest-neighboring depth value. Next, a moving window is applied to the pixels in the up-sampled depth image. The window covers a set of pixels centred at each pixel. The pixels covered by the window are selected according to their relative position to the edge, and only pixels that are within the same side of the edge of the centre pixel are used for the filtering procedure. A single representative depth from the set of selected pixel in the window is assigned to the pixel to produce a processed depth image. | 08-08-2013 |
20130287289 | Synthetic Reference Picture Generation - A synthetic image block in a synthetic picture is generated for a viewpoint based on a texture image and a depth image. A subset of samples from the texture image are warped to the synthetic image block. Disoccluded samples are marked, and the disoccluded samples in the synthetic image block are filled based on samples in a constrained area. The method and system enables both picture level and block level processing for synthetic reference picture generation. The method can be used for power limited devices, and can also refine the synthetic reference picture quality at a block level to achieve coding gains. | 10-31-2013 |
Eduardo Graziosi, San Jose, CA US
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20130217527 | RETENTION MECHANISMS FOR BICYCLE DRIVE TRAINS - Retention mechanisms for bicycle drive trains are disclosed. In some embodiments, a retention mechanism may include a backplate having at least one spur, at least one chain ring coupled to the backplate, and a slider coupled to the spur. The slider may be positioned between the at least one chain ring and a bicycle chain, and may include at least one track and at least one chain guide (e.g., an O-ring or ring component) seated in the track. The at least one chain guide may be configured to rotate about the track while applying tension to the bicycle chain so as to reduce friction and/or dampen noise. | 08-22-2013 |
Giovanni Graziosi, Carnate (mi) IT
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20100052144 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described. | 03-04-2010 |
Giovanni Graziosi, Vimercate IT
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20120249276 | INTEGRATED INDUCTOR DEVICE WITH HIGH INDUCTANCE, FOR EXAMPLE FOR USE AS AN ANTENNA IN A RADIOFREQUENCY IDENTIFICATION SYSTEM - An embodiment of integrated inductor device, comprising a plurality of modules overlaid to each other, each module including at least one coil of conducting material. The directly overlaid pairs of coils are coiled in opposite directions. The directly overlaid modules are mechanically coupled through first adhesive conductive regions and the coils of the directly overlaid modules are electrically coupled to each other through second adhesive conductive regions. The first and the second adhesive conductive regions coupling directly overlaid modules are formed in the same step of the process, are of the same material and are arranged at a same level. | 10-04-2012 |
20130105952 | SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF | 05-02-2013 |
20150217993 | SHIELDED ENCAPSULATING STRUCTURE AND MANUFACTURING METHOD THEREOF - One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal. | 08-06-2015 |
Giovanni Graziosi, Vimercate Mb IT
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20130170166 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described. | 07-04-2013 |
20150364409 | ELECTRONIC DEVICE WITH DIE BEING SUNK IN SUBSTRATE - An electronic device includes a circuit integrated on a die having front and back surfaces with die terminals on the front surface. The die is embedded in a package including substrate of thermally conductive material with front and back surfaces and a through-hole. The die is sunk in the through-hole. A first insulating material layer covers the die front surface and the package front surface with first windows for accessing die terminals. Package terminals and package track are arranged on the first insulating layer. A second insulating material layer covers the first insulating layer and the package tracks with second windows for accessing the package terminals. | 12-17-2015 |
Juan Graziosi, San Jose, CA US
Patent application number | Description | Published |
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20130217527 | RETENTION MECHANISMS FOR BICYCLE DRIVE TRAINS - Retention mechanisms for bicycle drive trains are disclosed. In some embodiments, a retention mechanism may include a backplate having at least one spur, at least one chain ring coupled to the backplate, and a slider coupled to the spur. The slider may be positioned between the at least one chain ring and a bicycle chain, and may include at least one track and at least one chain guide (e.g., an O-ring or ring component) seated in the track. The at least one chain guide may be configured to rotate about the track while applying tension to the bicycle chain so as to reduce friction and/or dampen noise. | 08-22-2013 |
Mateo Graziosi, San Francisco, CA US
Patent application number | Description | Published |
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20130217527 | RETENTION MECHANISMS FOR BICYCLE DRIVE TRAINS - Retention mechanisms for bicycle drive trains are disclosed. In some embodiments, a retention mechanism may include a backplate having at least one spur, at least one chain ring coupled to the backplate, and a slider coupled to the spur. The slider may be positioned between the at least one chain ring and a bicycle chain, and may include at least one track and at least one chain guide (e.g., an O-ring or ring component) seated in the track. The at least one chain guide may be configured to rotate about the track while applying tension to the bicycle chain so as to reduce friction and/or dampen noise. | 08-22-2013 |
20140194197 | GAME ASSET LINKED TO OPERATIONS PERFORMED OUTSIDE THE GAME - Methods, systems, and computer programs are presented for executing game operations. One method includes an operation for receiving a request from a player to acquire a first game asset to be utilized in the game, the first game asset being associated with a token usable in the real world outside the game. After assigning the first game asset to the player in the game, the player is rewarded in the game with a second asset in response to the request. Further, the method includes an operation for detecting a commercial operation executed outside the game by the player with the token, and the player is rewarded in the game with a third asset in response to the detecting. | 07-10-2014 |
Patrizio Graziosi, Vignola IT
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20150123703 | LOGIC GATE AND A CORRESPONDING METHOD OF FUNCTION - A logic gate ( | 05-07-2015 |
Renzo Graziosi, Baranzate-(mi) IT
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20160031796 | ANTIMUSCARINIC COMPOUND HAVING A LOW CONTENT OF IMPURITIES - Substantially stable to degradation Fesoterodine fumarate, a process for its preparation and a process for the synthesis of specific degradation impurities of Fesoterodine fumarate are disclosed. | 02-04-2016 |