Patent application number | Description | Published |
20110109383 | MEMS VARACTORS - MEMS varactors capable of handling large signals and/or achieving a high capacitance tuning range are described. In an exemplary design, a MEMS varactor includes (i) a first bottom plate electrically coupled to a first terminal receiving an input signal, (ii) a second bottom plate electrically coupled to a second terminal receiving a DC voltage, and (iii) a top plate formed over the first and second bottom plates and electrically coupled to a third terminal. The DC voltage causes the top plate to mechanically move and vary the capacitance observed by the input signal. In another exemplary design, a MEMS varactor includes first, second and third plates formed on over one another and electrically coupled to first, second and third terminals, respectively. First and second DC voltages may be applied to the first and third terminals, respectively. An input signal may be passed between the first and second terminals. | 05-12-2011 |
20110157058 | COATED LIGHT-TURNING FEATURE WITH AUXILIARY STRUCTURE - This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device includes a light guide having light-turning features that include recesses formed on the light guide and that extend down into the light guide. The recesses may be coated with a material where the material also forms an auxiliary structure outside of the recesses on the light guide. The auxiliary structure may be conductive and may form, for example, an electrode. | 06-30-2011 |
20110157093 | ILLUMINATION DEVICE WITH METALIZED LIGHT-TURNING FEATURES - This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system. | 06-30-2011 |
20120081406 | INTEGRATED BACKLIT FRONTLIGHT FOR REFLECTIVE DISPLAY ELEMENTS - This disclosure provides systems, methods and apparatus, including reflective display elements that are illuminated using a light source that is situated behind the pixel elements. In one aspect, a back light guide is disposed behind the pixel elements and is configured to inject light through light-injection apertures between reflective pixel elements. The light travels through the light-injection apertures and into a front light guide. The front light guide comprises light turning features configured to turn the light propagating through the light-injection apertures so that the light is redirected onto the reflective pixel elements, thereby illuminating the reflective pixel elements. | 04-05-2012 |
20120116709 | DISPLAY-INTEGRATED OPTICAL ACCELEROMETER - An optical accelerometer and method of determining an acceleration are disclosed. In one aspect, an accelerometer includes a light source, a substrate, a light guide attached to a first side of the substrate and configured to redirect light from the light source through the substrate. The accelerometer also includes a light detector, a proof mass attached to a second side of the substrate via one or more springs, wherein the second side is opposite the first side and wherein motion of the proof mass alters a characteristic of the light from the light source reaching the light detector, and a processor configured to determine an acceleration based on the characteristic of the light reaching the light detector. | 05-10-2012 |
20130002685 | BONDED DOUBLE SUBSTRATE APPROACH TO SOLVE LASER DRILLING PROBLEMS - This disclosure provides systems, methods and apparatus for bonding a device substrate formed of a substantially transparent material to a carrier substrate. A laser etch stop layer may be formed on the device substrate. The carrier substrate may be coated with a releasable layer, such as a polymer layer. Vias may be formed in the device substrate by laser drilling. The vias may be filled with conductive material, e.g., by electroplating or by filling the vias with a conductive paste. One or more types of devices may then be attached to the device substrate and configured for electrical communication with the vias. In some implementations, passive devices may be formed on the device substrate before the vias are formed. Before or after device fabrication, the substrates may be separated. The substrates may be separated by laser irradiation or chemical dissolution of the releasable layer. | 01-03-2013 |
20130242493 | LOW COST INTERPOSER FABRICATED WITH ADDITIVE PROCESSES - This disclosure provides systems, methods and apparatus for interposers in compact three-dimensional (3-D) device packages. In one aspect, one or more methods of fabricating an interposer using an additive process are provided. The additive process can involve depositing flowable dielectric material around a plurality of metal interconnect posts after forming the plurality of metal interconnect posts on a carrier substrate. In another aspect, an interposer including through-glass vias and one or more passive devices is provided. | 09-19-2013 |
20140009862 | MEMS VARACTORS - Tunable MEMS resonators having adjustable resonance frequency and capable of handling large signals are described. In one exemplary design, a tunable MEMS resonator includes (i) a first part having a cavity and a post and (ii) a second part mated to the first part and including a movable layer located under the post. Each part may be covered with a metal layer on the surface facing the other part. The movable plate may be mechanically moved by a DC voltage to vary the resonance frequency of the MEMS resonator. The cavity may have a rectangular or circular shape and may be empty or filled with a dielectric material. The post may be positioned in the middle of the cavity. The movable plate may be attached to the second part (i) via an anchor and operated as a cantilever or (ii) via two anchors and operated as a bridge. | 01-09-2014 |
20140354601 | ILLUMINATION DEVICE WITH METALIZED LIGHT-TURNING FEATURES - This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system. | 12-04-2014 |
Patent application number | Description | Published |
20090011610 | SELECTIVE IMPLEMENTATION OF BARRIER LAYERS TO ACHIEVE TRESHOLD VOLTAGE CONTROL IN CMOS DEVICE FABRICATION WITH HIGH K DIELECTRICS - A method of forming a CMOS structure, and the device produced therefrom, having improved threshold voltage and flatband voltage stability. The inventive method includes the steps of providing a semiconductor substrate having an nFET region and a pFET region; forming a dielectric stack atop the semiconductor substrate comprising an insulating interlayer atop a high k dielectric; removing the insulating interlayer from the nFET region without removing the insulating interlayer from the pFET region; and providing at least one gate stack in the pFET region and at least one gate stack in the nFET region. The insulating interlayer can be AlN or AlO | 01-08-2009 |
20090152642 | SELECTIVE IMPLEMENTATION OF BARRIER LAYERS TO ACHIEVE THRESHOLD VOLTAGE CONTROL IN CMOS DEVICE FABRICATION WITH HIGH-k DIELECTRICS - The present invention provides a semiconductor structure including a semiconductor substrate having a plurality of source and drain diffusion regions located therein, each pair of source and drain diffusion regions are separated by a device channel. The structure further includes a first gate stack of pFET device located on top of some of the device channels, the first gate stack including a high-k gate dielectric, an insulating interlayer abutting the gate dielectric and a fully silicided metal gate electrode abutting the insulating interlayer, the insulating interlayer includes an insulating metal nitride that stabilizes threshold voltage and flatband voltage of the p-FET device to a targeted value and is one of aluminum oxynitride, boron nitride, boron oxynitride, gallium nitride, gallium oxynitride, indium nitride and indium oxynitride. A second gate stack of an nFET devices is located on top remaining device channels, the second gate stack including a high-k gate dielectric and a fully silicided gate electrode located directly atop the high-k gate dielectric. | 06-18-2009 |
20110165767 | SELECTIVE IMPLEMENTATION OF BARRIER LAYERS TO ACHIEVE THRESHOLD VOLTAGE CONTROL IN CMOS DEVICE FABRICATION WITH HIGH-k DIELECTRICS - The present invention provides a semiconductor structure including a semiconductor substrate having a plurality of source and drain diffusion regions located therein, each pair of source and drain diffusion regions are separated by a device channel. The structure further includes a first gate stack of pFET device located on top of some of the device channels, the first gate stack including a high-k gate dielectric, an insulating interlayer abutting the gate dielectric and a fully silicided metal gate electrode abutting the insulating interlayer, the insulating interlayer includes an insulating metal nitride that stabilizes threshold voltage and flatband voltage of the p-FET device to a targeted value and is one of aluminum oxynitride, boron nitride, boron oxynitride, gallium nitride, gallium oxynitride, indium nitride and indium oxynitride. A second gate stack of an nFET devices is located on top remaining device channels, the second gate stack including a high-k gate dielectric and a fully silicided gate electrode located directly atop the high-k gate dielectric. | 07-07-2011 |
Patent application number | Description | Published |
20120075216 | INTEGRATED PASSIVES AND POWER AMPLIFIER - This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate. | 03-29-2012 |
20130057557 | HIGH AREA STACKED LAYERED METALLIC STRUCTURES AND RELATED METHODS - This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers. | 03-07-2013 |
20130106875 | METHOD OF IMPROVING THIN-FILM ENCAPSULATION FOR AN ELECTROMECHANICAL SYSTEMS ASSEMBLY | 05-02-2013 |
20130176657 | ELECTROMECHANICAL SYSTEMS VARIABLE CAPACITANCE ASSEMBLY - This disclosure provides systems, methods and apparatus for a variable capacitance apparatus. In one aspect, an apparatus includes a plurality of electromechanical systems varactors connected in parallel. Each of the plurality of electromechanical systems varactors includes a first, a second, and a third metal layer. The first metal layer includes a first bias electrode. The second metal layer is spaced apart from the first metal layer to define a first air gap, and includes a first radio frequency electrode. A third metal layer is spaced apart from the second metal layer to define a second air gap, and includes a second radio frequency electrode and a second bias electrode. The second bias electrode of each of the plurality of electromechanical systems varactors has a different projected area perpendicular to a surface of the second metal layer and onto the surface of the second metal layer. | 07-11-2013 |
20130249293 | FUNCTIONAL BACK GLASS FOR A SOLAR PANEL - A photovoltaic solar panel includes a front glass, a back glass, and a photovoltaic (PV) power generating layer encapsulated between the front glass and the back glass. The PV power generating layer is configured to convert ambient electromagnetic energy, received through the front glass, to a direct current (DC) power output. The PV solar panel also includes at least one component, disposed behind the PV power generating layer, selected from the group consisting of: a direct current to alternating current (DC-AC) inverter configured to convert the DC power output from the PV power generator to an alternating current (AC) power output, a battery, and an antenna. | 09-26-2013 |
20140035892 | INCORPORATION OF PASSIVES AND FINE PITCH THROUGH VIA FOR PACKAGE ON PACKAGE - This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided. | 02-06-2014 |
20140035935 | PASSIVES VIA BAR - This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including embedded wafer level packages. The glass via bars can provide high density electrical interconnections in a package. In some implementations, the glass via bars can include integrated passive components. Methods of fabricating glass via bars are provided. In some implementations, the methods can include patterning and etching photo-patternable glass substrates. Packaging methods employing glass via bars are also provided. | 02-06-2014 |
20150083917 | INFRARED LIGHT DIRECTOR FOR GESTURE OR SCENE SENSING FSC DISPLAY - This disclosure provides systems, methods and apparatus for touch and gesture recognition, using a field sequential color display. The display includes a processor, a lighting system, and an arrangement for spatial light modulation that includes a number of apertures, and devices for opening and shutting the apertures. A light directing arrangement includes at least one light turning feature. The display lighting system is configured to emit visible light and infrared (IR) light through at least a first opened one of the plurality of apertures. The light turning feature is configured to redirect IR light emitted through the opened aperture into at least one lobe, and to pass visible light emitted by the display lighting system through the opened aperture with substantially no redirection. | 03-26-2015 |
20150084927 | INTEGRATION OF A LIGHT COLLECTION LIGHT-GUIDE WITH A FIELD SEQUENTIAL COLOR DISPLAY - This disclosure provides systems, methods and apparatus for touch and gesture recognition, using a field sequential color display. The display includes a processor, a lighting system, and an arrangement for spatial light modulation that includes an array of light modulators. Each light modulator is switchable between an open position that permits transmittance of light from the lighting system through a respective aperture and a shut position that blocks light transmission through the respective aperture. The processor switches the light modulators in accordance with a first modulation scheme to render an image and in accordance with a second modulation scheme to selectively pass object illuminating light through at least one of the respective apertures. A light sensor receives light resulting from interaction of the object illuminating with an object and outputs a signal to the processor. The processor recognizes, from the output of the light sensor, a characteristic of the object. | 03-26-2015 |
20150084928 | TOUCH-ENABLED FIELD SEQUENTIAL COLOR DISPLAY USING IN-CELL LIGHT SENSORS - This disclosure provides systems, methods and apparatus for touch and gesture recognition, using a field sequential color display. The display includes a processor, a lighting system, and an arrangement for spatial light modulation that includes an array of light modulators. Each light modulator is switchable between an open position that permits transmittance of light from the lighting system through a respective aperture and a shut position that blocks light transmission through the respective aperture. The processor switches the light modulators in accordance with a first modulation scheme to render an image and in accordance with a second modulation scheme to selectively pass object illuminating light through at least one of the respective apertures. A light sensor receives light resulting from interaction of the object illuminating with an object and outputs a signal to the processor. The processor recognizes, from the output of the light sensor, a characteristic of the object. | 03-26-2015 |
20150084994 | TOUCH-ENABLED FIELD-SEQUENTIAL COLOR (FSC) DISPLAY USING A LIGHT GUIDE WITH LIGHT TURNING FEATURES - This disclosure provides systems, methods and apparatus for touch and gesture recognition, using a field sequential color display. The display includes a processor, a lighting system, and an arrangement for spatial light modulation that includes an array of light modulators. Each light modulator is switchable between an open position that permits transmittance of light from the lighting system through a respective aperture and a shut position that blocks light transmission through the respective aperture. The processor switches the light modulators in accordance with a first modulation scheme to render an image and in accordance with a second modulation scheme to selectively pass object illuminating light through at least one of the respective apertures. A light sensor receives light resulting from interaction of the object illuminating with an object and outputs a signal to the processor. The processor recognizes, from the output of the light sensor, a characteristic of the object. | 03-26-2015 |
Patent application number | Description | Published |
20140104284 | THROUGH SUBSTRATE VIA INDUCTORS - This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized. | 04-17-2014 |
20140104288 | THROUGH SUBSTRATE VIA INDUCTORS - This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized. | 04-17-2014 |