| Patent application number | Description | Published |
|---|
| 20080218737 | OPTICALLY ISOLATED CURRENT MONITORING FOR IONIZATION SYSTEMS - Current is measured in an ionization device that includes a high voltage supply, and an emitter electrically coupled to the HV supply. An opto-isolator is provided that includes a light source and a light detector. The light source has a current flowing through it. The light source is electrically coupled to the emitter. The output of the light detector is measured. The output of the light detector is related to the current flowing through the light source. | 09-11-2008 |
| 20080309310 | HIGH VOLTAGE POWER SUPPLY CONNECTOR SYSTEM - A connector system is provided for coupling an ionization emitter to an high voltage (HV) supply. The connector system includes one or more contacts for distributing voltage from the HV supply to the emitter. The connector system further includes a detection device that detects an element of an emitter that provides one or more properties of the emitter. The connector system further includes a detection logic device that sets one or more operating parameters of the HV supply according the one or more properties provided by the element of the emitter. | 12-18-2008 |
| 20090127452 | METHOD AND APPARATUS FOR SELF CALIBRATING METER MOVEMENT FOR IONIZATION POWER SUPPLIES - A method of determining a relative condition of an ionizer in an ionization system includes placing the ionization system in a calibration mode, stepping the ionization system through one or more of a range of adjustments, collecting calibration data at each step and storing the calibration data in a memory, placing the ionization system in an operating mode, collecting real-time data regarding an output of the ionization system, comparing the real-time data to the calibration data and determining difference values therebetween, and using the difference values to determine the relative condition of the ionizer. | 05-21-2009 |
| 20090128981 | MULTIPLE-AXIS CONTROL APPARATUS FOR IONIZATION SYSTEMS - A bipolar ionization apparatus includes a positive high voltage power supply having an output with at least one positive ion emitting electrode connected thereto and configured to generate positive ions. A negative high voltage power supply has an output with at least one negative ion emitting electrode connected thereto and is configured to generate negative ions. A controller for an ionizer outputs a positive high voltage ionization waveform and a negative high voltage ionization waveform. The controller simultaneously adjusts an amplitude and a duty cycle of each of the waveforms. | 05-21-2009 |
| 20090176431 | METHOD OF FORMING A CORONA ELECTRODE SUBSTANTIALLY OF CHEMICAL VAPOR DEPOSITION SILICON CARBIDE AND A METHOD OF IONIZING GAS USING THE SAME - A method is provided for forming a corona-producing emitter electrode by depositing substantially pure silicon carbide by CVD and forming a corona-producing emitter electrode with the deposited silicon carbide. In addition, a method of forming a corona-producing gas ionizer is provided by providing a corona electrode formed from CVD silicon carbide, electrically coupling the corona electrode to a high voltage power supply, and providing an AC or DC voltage from the high voltage power supply to the corona electrode. Furthermore, a method of ionizing gas in an environment is provided by providing a corona-producing ionizer emitter electrode formed substantially of CVD silicon carbide, electrically coupling the electrode to a high voltage power supply, and providing an AC or DC voltage from the high voltage power supply to the electrode. | 07-09-2009 |
| Patent application number | Description | Published |
|---|
| 20080299384 | BARRIER COATING AND METHOD - A barrier coating for a composite article is provided. The barrier coating includes an organic zone; an inorganic zone; and an interface zone between the organic zone and the inorganic zone. | 12-04-2008 |
| 20100133683 | SYSTEM AND APPARATUS FOR VENTING ELECTRONIC PACKAGES AND METHOD OF MAKING SAME - An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers. | 06-03-2010 |
| 20100207261 | CHIP ATTACH ADHESIVE TO FACILITATE EMBEDDED CHIP BUILD UP AND RELATED SYSTEMS AND METHODS - Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator. | 08-19-2010 |
| 20100296261 | ELECTRICAL CONNECTORS FOR OPTOELECTRONIC DEVICE PACKAGING - Packaged optoelectronic device include a first barrier layer having a plurality of feedthrough apertures communicating with at least one electrode layer of the device, and a plurality of conductive patches disposed on at least one of the plurality of feedthrough apertures for electrically connecting the device to a power supply. Each conductive patch includes a conductive metal surface layer and a non-conducting surface layer having an opening exposing the metal surface layer. | 11-25-2010 |
| 20110215480 | STRESS RESISTANT MICRO-VIA STRUCTURE FOR FLEXIBLE CIRCUITS - A chip package is disclosed that includes an electronic chip having a plurality of die pads formed on a top surface thereof, with a polyimide flex layer positioned thereon by way of an adhesive layer. A plurality of vias is formed through the polyimide flex layer and the adhesive layer corresponding to the die pads. A plurality of metal interconnects are formed on the polyimide flex layer each having a cover pad covering a portion of a top surface of the polyimide flex layer, a sidewall extending down from the cover pad and through the via along a perimeter thereof, and a base connected to the sidewall and forming an electrical connection with a respective die pad. Each of the base and the sidewall is formed to have a thickness that is equal to or greater than a thickness of the adhesive layer. | 09-08-2011 |
