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| 20080223579 | Cooling Systems for Downhole Tools - A cooling system for a downhole tool includes an insulating chamber disposed in the downhole tool, wherein the insulating chamber is adapted to house an object to be cooled; a thermoacoustic cooler disposed in the downhole tool, wherein the thermoacoustic cooler has a cold end configured to remove heat from the insulating chamber and a hot end configured to dissipate heat; and an energy source for generating an acoustic wave in the thermoacoustic cooler. A method for constructing a downhole tool includes disposing a to-be-cooled object in an insulating chamber in the downhole tool; and disposing a thermoacoustic cooler in the downhole tool proximate the insulating chamber such that the thermoacoustic cooler is configured to remove heat from the insulating chamber. | 09-18-2008 |
| 20090008079 | METHODS AND APPARATUS TO SAMPLE HEAVY OIL IN A SUBTERRANEAN FORMATION - A method for sampling fluid in a subterranean formation includes, reducing a viscosity a fluid, pressurizing a portion of the subterranean formation, and collecting a fluid sample. Specifically, a viscosity of a fluid in a portion of the subterranean formation is reduced and a portion of the subterranean formation is pressurizing by injecting a displacement fluid into the subterranean formation. A sample of the fluid pressurized by the displacement fluid is then collected. | 01-08-2009 |
| 20090126928 | APPARATUS AND METHODS TO ANALYZE DOWNHOLE FLUIDS USING IONIZED FLUID SAMPLES - Apparatus and methods to analyze downhole fluids are described herein. A disclosed example method involves obtaining a sample of a downhole fluid. Additionally the example method involves ionizing at least a portion of the sample to decompose molecules having a relatively high molar mass into molecules having a relatively lower molar mass. Further, the example method involves analyzing the ionized portion of the sample to determine a parameter of the downhole fluid sample. | 05-21-2009 |
| 20090128818 | APPARATUS AND METHODS TO ANALYZE DOWNHOLE FLUIDS USING IONIZED FLUID SAMPLES - Apparatus and methods to analyze downhole fluids are described herein. A disclosed example method involves obtaining a sample of a downhole fluid, and depressurizing at least a portion of the sample. Additionally, a disclosed example method involves ionizing at least the portion of the sample, and analyzing the ionized portion of the sample to determine a parameter of the downhole fluid. | 05-21-2009 |
| 20090151937 | WELL THERMAL INSULATION FOR FORMATION SAMPLING OF VISCOUS FLUIDS - Evaluating a subterranean formation fluid by lowering a testing tool to a depth in a wellbore formed in a subterranean formation, limiting wellbore fluid convection near the depth with the testing tool, heating formation fluid in the subterranean formation near the depth, obtaining a sample of the heated formation fluid from the subterranean formation, and evaluating at least a portion of the sample of heated formation fluid obtained from the subterranean formation. | 06-18-2009 |
| 20100126717 | INSTRUMENTED FORMATION TESTER FOR INJECTING AND MONITORING OF FLUIDS - An example instrumented formation tester for injecting fluids and monitoring of fluids described herein includes a downhole tool which can be deployed in a wellbore via a wireline or a drill string. The downhole tool may facilitate the injection of fluids into an underground formation, and the monitoring of the directions in which the injected fluids flow in the formation in an open hole environment. In particular, the downhole tool may be configured for removing the mud cake from a portion of the wellbore wall for facilitating a fluid communication with the formation to be tested. | 05-27-2010 |
| 20110132609 | FORMATION FLUID SAMPLING TOOLS AND METHODS UTILIZING CHEMICAL HEATING - A formation fluid sampling tool is provided with reactants which are carried downhole and which are combined in order to generate heat energy which is applied to the formation adjacent the borehole. By applying heat energy to the formation, the formation fluids are heated, thereby increasing mobility, and fluid sampling is expedited. | 06-09-2011 |
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| 20090120168 | MICROFLUIDIC DOWNHOLE DENSITY AND VISCOSITY SENSOR - The present invention recited a method and apparatus for providing a parameter of a fluid within a fluid channel using a MEMS resonating element in contact with the fluid moving through the fluid channel. Additionally an actuating device associated with the MEMS resonating element is further provided, such that the actuating device can induce motion in the MEMS resonating element. In communication with the MEMS resonating element is an interpretation element capable of calculating a parameter of the fluid moving through the fluid channel based upon data from the MEMS resonating element upon actuation by the actuating device. | 05-14-2009 |
| 20090120171 | VIBRATING WIRE VISCOSITY SENSOR - A method and apparatus for providing, e.g., identifying or determining, at least one parameter of a fluid moving through a fluid channel using a vibrating wire in contact with the fluid moving through the fluid channel that is clamped under tension. The vibrating wire is actuated by an actuating device capable of displacing the vibrating wire from an initial position. An interpretation element further is utilized to provide a parameter of the fluid moving through the fluid channel based upon data from the vibrating wire following actuation by the actuation element. | 05-14-2009 |
| 20090159278 | Single Packer System for Use in Heavy Oil Environments - A technique involves collecting formation fluids through a single packer having at least one drain located within the single packer. The single packer comprises an outer seal layer, and the at least one drain is positioned in the outer seal layer. A viscosity system also is incorporated and enables the viscosity of a surrounding fluid to be selectively lowered for sampling. | 06-25-2009 |
| 20100241407 | METHODS, APPARATUS AND ARTICLES OF MANUFACTURE TO PROCESS MEASUREMENTS OF WIRES VIBRATING IN FLUIDS - Example methods, apparatus and articles of manufacture to process measurements of wires vibrating in fluids are disclosed. A disclosed example apparatus includes a downhole assembly and a surface assembly. The downhole assembly including a sensor to measure a waveform representative of a motion of a wire vibrating within a fluid at a downhole location in a wellbore, a waveform modeler to compute a model parameter from the measured waveform, and a first telemetry module to transmit the computed model parameter to a surface location. The surface assembly including a second telemetry module to receive the computed model parameter from the downhole assembly, and a viscosity analyzer to estimate a viscosity of the fluid from the computed model parameter. | 09-23-2010 |
| 20100294493 | METHODS AND APPARATUS TO CHANGE THE MOBILITY OF FORMATION FLUIDS USING THERMAL AND NON-THERMAL STIMULATION - Methods and apparatus to change the mobility of formation fluids using thermal and non-thermal stimulation are described. An example apparatus to simultaneously provide thermal and non-thermal stimulation to change a mobility of a fluid in a subsurface formation includes one or more containers to hold one or more reactants. Additionally, the example apparatus includes a reactor to initiate a chemical reaction with at least one of the reactants. Further, the example apparatus includes an injector to inject a product of the chemical reaction into a formation. The product of the chemical reaction includes heat and a gaseous diluent to change a mobility of a fluid in a subsurface formation. | 11-25-2010 |
| 20110083501 | VIBRATING WIRE VISCOMETERS - Vibrating wire viscometers are disclosed. An example apparatus to determine the viscosity of a downhole fluid is described, the apparatus including a wire to be immersed in a downhole fluid, to vibrate when an alternating current is applied to the wire within a magnetic field, and to generate an electromotive force when vibrating within the magnetic field, the wire comprising a first resistance. The apparatus further includes a nulling circuit coupled to the wire, wherein the nulling circuit comprises a second resistance that is selectable to be substantially equal to the first resistance, and an analyzer coupled to the wire and the nulling circuit to determine the first resistance, the second resistance, and a viscosity of the downhole fluid based on the first and second resistances, at least one characteristic of the wire, and the electromotive force. | 04-14-2011 |
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| 20090067337 | TESTING A CIRCUIT USING A SHARED BANDWIDTH TEST BUS - According to one embodiment, a method for testing a circuit includes receiving a test access session request, where the test access session request indicates that a test session is to be performed on a circuit path. A reservation message is sent to a test bus, where the reservation message reserves the test bus for the test session. The test bus includes a portion of bandwidth shared among a plurality of network elements. Traffic associated with the circuit path is copied to the test bus. | 03-12-2009 |
| 20110180314 | Filler Panel with Cable Management Feature - A filler panel for an electronics shelf is provided. The electronics shelf includes a number of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a side wall, and a back wall. The front wall and back wall are configured to fill a width of a slot of the electronics shelf and the side wall is configured to extend into a depth of the slot. The filler panel also includes an electromagnetic shielding portion made of a conductive material and coupled to the main body. Furthermore, the main body includes one or more cable clips each configured to retain one or more cables within the main body. | 07-28-2011 |
| 20110180315 | Filler Panel for Air Flow Management - A filler panel for an electronics shelf is provided. The electronics shelf includes a plurality of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a back wall, a top wall, a bottom wall and a single side wall. The front wall, back wall, top wall and bottom wall are configured to fill a width of a slot of the electronics shelf. The side wall is configured to extend into a depth of the slot, The filler panel also includes an electromagnetic shielding portion comprising a conductive material that is coupled to the main body. The main body further includes one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body. | 07-28-2011 |
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| 20080278901 | Memory module system and method - Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry. | 11-13-2008 |
| 20080278924 | DIE MODULE SYSTEM - A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board. | 11-13-2008 |
| 20080291747 | Buffered Memory Device - A memory module having a DRAM device configured to generate a low DQS state on a DQS line, and a buffer coupled to the DRAM device, the buffer having a plurality of drivers, wherein the buffer is configured to detect the low DQS state by comparing the low DQS state to a low voltage level of one of the plurality of drivers. | 11-27-2008 |
| 20090046431 | High Capacity Thin Module System - Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module. | 02-19-2009 |
| 20090052124 | Circuit Module with Thermal Casing Systems - Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module. | 02-26-2009 |
| 20090309214 | Circuit Module Turbulence Enhancement - Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat spreaders employed by circuit modules constructed according to traditional or new technologies. | 12-17-2009 |
