| Patent application number | Description | Published |
|---|
| 20090278238 | TSVS HAVING CHEMICALLY EXPOSED TSV TIPS FOR INTEGRATED CIRCUIT DEVICES - A method for fabricating ICs including via-first through substrate vias (TSVs) and ICs and electronic assemblies therefrom. A substrate having a substrate thickness including a top semiconductor surface and a bottom surface is provided including at least one embedded TSV including a dielectric liner and an electrically conductive filler material formed on the dielectric liner. A portion of the bottom surface of the substrate is mechanically removed to approach but not reach the embedded TSV tip. A protective substrate layer having a protective layer thickness remains over the tip of the embedded TSV after the mechanical removing. Chemical etching exclusive of mechanical etching for removing the protective substrate layer is used form an integral TSV tip that has an exposed tip portion that generally protrudes from the bottom surface of the substrate. The chemical etching is generally a three step chemical etch. | 11-12-2009 |
| 20090289324 | MASK OVERHANG REDUCTION OR ELIMINATION AFTER SUBSTRATE ETCH - A method of forming IC devices includes providing a substrate and forming a patterned masking layer including at least one masked region having at least one masking layer, and a feature region bounded by the masking layer. Etching forms an etched feature in the substrate, wherein undercutting during the etching forms at least one mask overhang region over a surface portion of the etched feature that is recessed relative to an outer edge of the masking layer. A pullback etch process exclusive of any additional patterning step laterally etches the masking layer. The conditions for the pullback etch retain at least a portion of the masking layer and reduce a length of the mask overhang region by at least 50%, or eliminate the mask overhang region entirely. The etched feature is then filled after the pullback etch process to form a filled etched feature. | 11-26-2009 |
| 20100289108 | Silicon dioxide cantilever support and method for silicon etched structures - A semiconductor device includes a semiconductor layer ( | 11-18-2010 |
| 20100327393 | Method and structures for etching cavity in silicon under dielectric membrane - A semiconductor device includes a semiconductor layer ( | 12-30-2010 |
| 20110018107 | TSVS Having Chemically Exposed TSV Tips for Integrated Circuit Devices - A method for fabricating ICs including via-first through substrate vias (TSVs) and ICs and electronic assemblies therefrom. A substrate having a substrate thickness including a top semiconductor surface and a bottom surface is provided including at least one embedded TSV including a dielectric liner and an electrically conductive filler material formed on the dielectric liner. A portion of the bottom surface of the substrate is mechanically removed to approach but not reach the embedded TSV tip. A protective substrate layer having a protective layer thickness remains over the tip of the embedded TSV after the mechanical removing. Chemical etching exclusive of mechanical etching for removing the protective substrate layer is used form an integral TSV tip that has an exposed tip portion that generally protrudes from the bottom surface of the substrate. The chemical etching is generally a three step chemical etch. | 01-27-2011 |
| 20110158439 | Silicon Microphone Transducer - A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit. | 06-30-2011 |
| Patent application number | Description | Published |
|---|
| 20090114113 | Shotshell with Shot Pellets Having Multiple Shapes - In at least one embodiment, a shotshell comprises a casing defining an internal chamber, a plurality of first shot pellets within the internal chamber and a plurality of second shot pellets within the internal chamber. The first shot pellets comprise a first shape and the second shot pellets comprise a second shape that is different from the first shape. | 05-07-2009 |
| 20090266263 | ADVANCED MUZZLE LOADER AMMUNITION - A fixed round of ammunition for a muzzle loader firearm. The round has a bullet within a sabot that is engaged to a consumable cartridge case. The case is filled with propellant that is precisely calibrated to provide optimal ballistic properties with the particular bullet it is engaged to. The consumable cartridge case can be more tailored to respectively increase or decrease the burn rate of the consumable cartridge case. The consumable cartridge case can be constructed out of nitrocellulose or other energetic materials. A wide range of propellant formulas can be used that are safe because the burn rate is precisely calibrated for the bullet used. The propellant can contain pyrotechnic material and/or other ingredients to reduce the burn rate of a smokeless propellant and can contain a stabilizer to increase the shelf life of the ammunition round. | 10-29-2009 |
| 20100269724 | Reduced Energy Cartridge and Method of Making Same - A method of manufacturing a cartridge comprising providing a cartridge body with forward and rearward cavities interconnected by an aperture, providing a piston with a primer retaining cavity, inserting primer into the primer retaining cavity, securing the primer, placing a seal member around the piston, inserting the piston and seal member combination into the rearward cavity of the cartridge body, and crimping at least a portion of the cartridge body to the piston. | 10-28-2010 |
| 20100275487 | ADVANCED MUZZLE LOADER AMMUNITION - A fixed round of ammunition for a muzzle loader firearm. The round has a bullet within a sabot that is engaged to a consumable cartridge case. The case is filled with propellant that is precisely calibrated to provide optimal ballistic properties with the particular bullet it is engaged to. The consumable cartridge case can be more tailored to respectively increase or decrease the burn rate of the consumable cartridge case. The consumable cartridge case can be constructed out of nitrocellulose or other energetic materials. A wide range of propellant formulas can be used that are safe because the burn rate is precisely calibrated for the bullet used. The propellant can contain pyrotechnic material and/or other ingredients to reduce the burn rate of a smokeless propellant and can contain a stabilizer to increase the shelf life of the ammunition round. | 11-04-2010 |
| 20100294158 | Shotshell with Shot Pellets Having Multiple Shapes - In at least one embodiment, a shotshell comprises a casing defining an internal chamber, a plurality of first shot pellets within the internal chamber and a plurality of second shot pellets within the internal chamber. The first shot pellets comprise a first shape and the second shot pellets comprise a second shape that is different from the first shape. | 11-25-2010 |
