| Patent application number | Description | Published |
|---|
| 20080204052 | INTEGRATED CIRCUIT SYSTEM WITH MOS DEVICE - An integrated circuit system includes measuring capacitance for a base structure between a base gate and a base connector thereof, measuring capacitance for a test structure between a test gate and a test connector thereof, the test structure having the test gate, a test dielectric, and the test connector with the test dielectric extending thereunder, and determining a difference between the capacitances of the base structure and the test structure to determine parasitic capacitance for the base structure between the base gate and the base connector thereof. | 08-28-2008 |
| 20080286887 | Method for adjusting a transistor model for increased circuit simulation accuracy - According to one exemplary embodiment, a method for adjusting a transistor model for increased circuit simulation accuracy includes determining a first gate CD offset by matching a C-V test structure having a normalized channel current to an I-V test structure having the normalized channel current. The method further includes utilizing the first gate CD offset to adjust the transistor model for increased circuit simulation. The method also includes determining a second gate CD offset by varying I-V and C-V gate length parameters in the transistor model to cause simulated data from a test circuit to be approximately equal to measured data from the test circuit. The method further includes utilizing the second gate CD offset to adjust the transistor model. | 11-20-2008 |
| 20090094013 | TWO-STEP SIMULATION METHODOLOGY FOR AGING SIMULATIONS - The present invention is a method and system for simulating the aging process of a circuit. A two-step process is employed whereby, in a first simulation step, a simulation is conducted to obtain node voltages for the original circuit and the node voltages are stored in a file. In the second step, a subsequent simulation is run after transistors of the circuit are replaced by aging subcircuits, which contain aging models, and initial node voltages are updated. A script is used to set the bias voltage inputs for the aging models using the node voltages stored in the file from the first step. With more accurate bias voltage inputs for the aging models, the aging simulations are conducted to compute the circuit degradation. | 04-09-2009 |
| 20090101976 | BODY TIE TEST STRUCTURE FOR ACCURATE BODY EFFECT MEASUREMENT - A body tie test structure and methods for its manufacture are provided. The transistor comprises a body-tied semiconductor on insulator (SOI) transistor formed in a layer of semiconductor material, the transistor comprising a cross-shaped gate structure with a substantially constant gate length L. An insulating blocking layer enables formation of a spacer region in the layer of semiconductor material separating the source and drain regions from the body tie region. A conductive channel with substantially the same inversion characteristics as the intrinsic transistor body connects the body tie to the intrinsic transistor body through the spacer region. | 04-23-2009 |
| 20100144106 | DYNAMIC RANDOM ACCESS MEMORY (DRAM) CELLS AND METHODS FOR FABRICATING THE SAME - A method for fabricating a memory cell is provided. A trench is formed in a semiconductor structure that comprises a semiconductor layer, and a trench capacitor is formed in the trench. Conductivity determining impurities are implanted into the semiconductor structure to create a well region in the semiconductor layer that is directly coupled to the trench capacitor. A gate structure is formed overlying a portion of the well region. Conductivity determining ions are then implanted into other portions of the well region to form a source region and a drain region, and to define an active body region between the source region and the drain region. The active body region directly contacts the trench capacitor. | 06-10-2010 |
| 20110086484 | BODY TIE TEST STRUCTURE FOR ACCURATE BODY EFFECT MEASUREMENT - A body tie test structure and methods for its manufacture are provided. The transistor comprises a body-tied semiconductor on insulator (SOI) transistor formed in a layer of semiconductor material, the transistor comprising a cross-shaped gate structure with a substantially constant gate length L. An insulating blocking layer enables formation of a spacer region in the layer of semiconductor material separating the source and drain regions from the body tie region. A conductive channel with substantially the same inversion characteristics as the intrinsic transistor body connects the body tie to the intrinsic transistor body through the spacer region. | 04-14-2011 |
