| Patent application number | Description | Published |
|---|
| 20090166838 | LAMINATED MOUNTING STRUCTURE AND MEMORY CARD - To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other. | 07-02-2009 |
| 20090166839 | SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD - A semiconductor stack device having semiconductor chips stacked therein, wherein pads | 07-02-2009 |
| 20090314528 | WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD - A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate. | 12-24-2009 |
| 20100230147 | LAYERED ELECTRONIC CIRCUIT DEVICE - Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate ( | 09-16-2010 |
