Going Sik
Going Sik Kim, Busan I KR
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20080257742 | Method of manufacturing printed circuit board for semiconductor package - Disclosed is a method of manufacturing a printed circuit board for a semiconductor package, which minimizes or completely obviates masking work upon the plating of each pad for the surface treatment of a printed circuit board for a semiconductor package, thereby simplifying the overall process and increasing the mounting reliability. | 10-23-2008 |
Going Sik Kim, Gyunggi-Do KR
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20120138336 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board and a method of manufacturing the same, in which a circuit pattern one end of which is embedded in a trench and the other end of which protrudes from an insulating layer is formed, so that the circuit pattern is not easily separated from the insulating layer and the separation problems of the circuit pattern due to undercutting are solved. Also, the adhesion between the insulating layer and the circuit pattern is enhanced, more stably forming a fine circuit pattern. Even when a plating resist is formed thin, it is possible to form the circuit pattern, resulting in a high-solution circuit pattern. | 06-07-2012 |
20120168960 | MULTI CHIP PACKAGE - The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate. | 07-05-2012 |
20140041902 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials. | 02-13-2014 |
Going Sik Kim, Yongin-Si KR
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20130153280 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board including: a substrate; first upper and lower insulating layers covering upper and lower sides of the substrate; a via penetrating the substrate and the first upper and lower insulating layers to form an electrical connection; and second upper and lower insulating layers covering or surrounding the via, wherein the first upper and lower insulating layers or the second upper and lower insulating layers include a general circuit region including general circuit patterns and circuit patterns connected to the via and a microcircuit region including microcircuit patterns having a smaller circuit line width than that of the general circuit region. | 06-20-2013 |
Going Sik Kim, Yongin KR
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20140105712 | JIG UNIT FOR FIXING SUBSTRATE AND SUBSTRATE TRANSFER APPARATUS INCLUDING THE SAME - The present invention relates to a jig unit for fixing a substrate and a substrate transfer apparatus including the same. In accordance with an embodiment of the present invention, a jig unit for fixing a substrate including: a support part for supporting an edge-side lower portion of a substrate; a hinge part having a hinge formed at a predetermined height from an upper surface of the substrate supported to the support part and rotating so that a rotation range by the hinge applies a force to the edge side of the substrate beyond the range that vertically presses the upper surface of the substrate; and a substrate fixing part for fixing the substrate to the support unit flatly by applying tension to the edge side of the substrate simultaneously with pressing the upper surface of the substrate is provided. | 04-17-2014 |
Going Sik Kim, Cheongju-Si KR
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20140096383 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays. | 04-10-2014 |
Going Sik Kim, Suwon KR
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20140034359 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board including a base substrate, a photosensitive insulating layer formed on an upper portion of the base substrate, and a circuit pattern formed to be buried within the photosensitive insulating film. | 02-06-2014 |
Going Sik Kim, Suwon-Si KR
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20150177621 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials. | 06-25-2015 |