Patent application number | Description | Published |
20140043765 | SEMICONDUCTOR MODULE COOLER AND SEMICONDUCTOR MODULE - A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel arranged inside the water jacket in parallel to the first flow channel and extending to a coolant outlet; and a third flow channel formed inside the water jacket at a position connecting the first flow channel and the second flow channel. The coolant inlet and the coolant outlet are formed on a same wall surface of the water jacket, and the heat sink is arranged in the third flow channel. | 02-13-2014 |
20140239486 | COOLING DEVICE FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE - A cooling device for a semiconductor module supplying a coolant from outside into a water jacket and cooling a semiconductor element, includes a heat sink thermally connected to the semiconductor element; a first flow channel extending from a coolant introducing port and including a guide section having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel disposed parallel to the first flow channel and extending toward a coolant discharge port; a flow velocity adjusting plate disposed in the second flow channel and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow channel formed to communicate the first flow channel and the second flow channel. The heat sink is disposed in the third flow channel. | 08-28-2014 |
20140252590 | SEMICONDUCTOR MODULE COOLER AND SEMICONDUCTOR MODULE - A semiconductor module cooler for supplying a refrigerant from exterior into a water jacket and cooling a semiconductor device disposed on an outer surface of the cooler, includes a heat sink thermally connected to the semiconductor device; a first flow path extending from a refrigerant inlet and arranged with a guide portion having an inclined surface for guiding the refrigerant toward one side surface of the heat sink; a second flow path extending toward a refrigerant outlet and formed with a sidewall parallel to the other side surface of the heat sink; a flow velocity adjustment plate disposed in the second flow path and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow path formed at a position communicating the first flow path and the second flow path. The heat sink is disposed in the third flow path. | 09-11-2014 |
20140376184 | SEMICONDUCTOR DEVICE AND COOLER THEREOF - A semiconductor device exhibits low pressure loss and is capable of cooling a plurality of power semiconductor chips evenly. This semiconductor device includes a semiconductor module and a cooler for cooling a power semiconductor element mounted in the semiconductor module. A cooling unit of the cooler has a first header part that has a first bottom surface disposed between a coolant inlet and an end portion of a first substrate on the coolant outlet side and inclined toward a bottom plane of cooling fins so that a coolant supplied from the coolant inlet flows toward the cooling fins; and a second header part that has a second bottom surface inclined from an end portion of the bottom plane of the cooling fins on the coolant outlet side so that the coolant discharged from the cooling fins flows to the coolant outlet. | 12-25-2014 |
20150380338 | SEMICONDUCTOR DEVICE - In a semiconductor device, an insulated substrate is bonded with a cooling body with lowered thermal resistance without a holding unit. The semiconductor device includes an insulated substrate where a wiring pattern copper plate unit for forming a plurality of wiring patterns is disposed on one side of an insulating plate unit, and a heat radiation copper plate unit disposed on the other side of the insulating plate unit; a semiconductor chip mounted on the wiring pattern copper plate unit; a cooling body contacted with the heat radiation copper plate unit; and a wiring conductor plate connected between the semiconductor chip and the wiring pattern copper plate unit. The heat radiation copper plate unit and the cooling body are bonded with a metal sintered material, and thicknesses of the wiring pattern copper plate unit and the heat radiation copper plate unit are set to such thermal stress is relaxed. | 12-31-2015 |
20150382506 | POWER SEMICONDUCTOR MODULE - A power semiconductor module includes an insulated wiring board; semiconductor elements mounted on one main surface of the insulated wiring board; a heat radiation board bonded to another main surface of the insulated wiring board; a plurality of fins including a first group of fins each having one end fixed to the another main surface of the heat radiation board and another end with a free end; and a water jacket housing the plurality of fins and allowing coolant to flow among the plurality of fins. The plurality of fins further includes a second group of fins as reinforced fins each having one end fixed to the another main surface of the heat radiation board and another end bonded to the water jacket. | 12-31-2015 |
20160099194 | SEMICONDUCTOR MODULE AND ELECTRICALLY-DRIVEN VEHICLE - A semiconductor module includes a first semiconductor element, a second semiconductor element, a first heat spreader electrically and thermally connected to the first semiconductor element, a second heat spreader electrically and thermally connected to the second semiconductor element, a DCB substrate including a first metal foil on a top surface of a ceramic insulating substrate and including a second metal foil on a bottom surface, the first metal foil being electrically and thermally joined to the first heat spreader and the second heat spreader, and a cooler thermally connected to the second metal foil of the DCB substrate. The first semiconductor element is disposed on an upstream side, and the second semiconductor element is disposed on a downstream side with respect to a flowing direction of a refrigerant of the cooler. An area of the second heat spreader is greater than an area of the first heat spreader. | 04-07-2016 |
Patent application number | Description | Published |
20090136663 | VACUUM VAPOR DEPOSITION APPARATUS AND METHOD, AND VAPOR DEPOSITED ARTICLE FORMED THEREWITH - When the ratio of a guest material to a host material is extremely small, it is difficult to maintain, with good accuracy, the ratio of the guest material to be vapor-deposited on the work surface and the distribution state of the guest material. The vacuum vapor deposition apparatus and method includes providing a shielding member, positioned between a first vapor deposition source and a substrate to be coated so that the vapor deposition amount of the guest material on the substrate surface is significantly less than the vapor deposition amount of the host material. A shielding member drive mechanism rotates the shielding member about a first axis while rotating the shielding member about a second axis, which is spaced from and parallel to the first axis. | 05-28-2009 |
20120139096 | SEMICONDUCTOR MODULE AND COOLING UNIT - A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths ( | 06-07-2012 |
20130058041 | SEMICONDUCTOR MODULE AND COOLER - A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to the circuit element part; a refrigerant introducing passage in the water jacket, which has a guide part that has one surface and another surface inclined to guide the refrigerant toward one side surface of the fin; a refrigerant discharge passage disposed in the water jacket to be parallel to the refrigerant introducing passage, which has a side wall parallel to another side surface of the fin; and a cooling passage formed in a position for communicating the refrigerant introducing passage and the refrigerant discharge passage with each other in the water jacket. The fin is disposed in the cooling passage. | 03-07-2013 |
Patent application number | Description | Published |
20110050942 | IMAGE FILE DATA STRUCTURE, IMAGE FILE GENERATION DEVICE, IMAGE FILE GENERATION METHOD, AND ELECTRONIC CAMERA - In an electronic camera that captures still images when capturing a moving image records associated images in a moving image file, the data structure of which includes metadata for both of the moving image and the still images captured when the moving image is being captured. The metadata includes identification data, which unambiguously identifies a still image that is associated with the moving image. | 03-03-2011 |
20110102616 | DATA STRUCTURE FOR STILL IMAGE FILE, IMAGE FILE GENERATION DEVICE, IMAGE REPRODUCTION DEVICE, AND ELECTRONIC CAMERA - A moving image generation unit generates moving image data of a predetermined resolution based on a pixel signal from an imaging element and stores the moving image data in a RAM. For example, when a still image is captured while a moving image is being captured, a still image generation unit generates still image data of, for example, full resolution based on the pixel signal from the imaging element. Then, an image extraction processing unit extracts moving image data for n seconds before and after the time the still image is captured from the moving image data stored in the RAM. A file generation unit incorporates the extracted moving image file in a header of the still image file to generate a moving image-added still image file. | 05-05-2011 |
20120307094 | IMAGE FILE DATA STRUCTURE, IMAGE FILE GENERATION DEVICE, IMAGE FILE GENERATION METHOD, AND ELECTRONIC CAMERA - In an electronic camera that captures still images when capturing a moving image records associated images in a moving image file, the data structure of which includes metadata for both of the moving image and the still images captured when the moving image is being captured. The metadata includes identification data, which unambiguously identifies a still image that is associated with the moving image. | 12-06-2012 |
Patent application number | Description | Published |
20080218246 | RELAY CONNECTOR UNIT AND ELECTRONIC DEVICE CONTROL SYSTEM - A relay connector unit for communicating an electronic control unit with a plurality of electronic devices includes: a first connecting unit connected to the electronic control unit; a second connecting unit having a plurality of circuits connected to the electronic devices respectively; and a transferring unit connected to the first connecting unit and the second connecting unit. The transferring unit transmits first information received by the first connecting unit from the electronic control unit to at least one of the electronic devices through a corresponding circuit, on the basis of circuit identifying data included in first information, the circuit identifying data indicating the corresponding circuit to be transferred to or from. The transferring unit appends the circuit identifying data to second information received from one of the electronic devices through the corresponding circuit to transmit the second information to the electronic control unit through the first connecting unit. | 09-11-2008 |
20080293266 | COMMUNICATION RELAY APPARATUS AND RELAY CONNECTOR UNIT - A communication relay apparatus includes a first connecting section for connecting to a first wire harness connected to an electronic control device, a second connecting section for connecting to a second wire harness connected to a plurality of electronic equipments, a communication address setting section which has a plurality of connection portions and sets a communication address for the electronic control device with a conducting pattern based on presence or absence of conduction at the connection portions, and a communication relay section which is electrically connected to the first connecting section and the second connecting section, and relays communication between the electronic control device and the electronic equipments on the basis of the communication address. The communication address setting section is formed so that the presence or absence of the conduction of the connection portions can be viewed from the exterior and that the conducting pattern can be set from the exterior. | 11-27-2008 |
20130307645 | WAVEGUIDE AND IN-VEHICLE COMMUNICATION SYSTEM - A waveguide includes a waveguide body which is hollow inside and made from a shape-retentive material, and a conductive inner coating layer which is electrically conductive and provided on an inner surface of the waveguide body. The waveguide uses an inner space of the conductive inner coating layer as a transmission path to transmit electromagnetic waves as signals. Two electric wires provided along the outer surface of the waveguide body serve respectively as a power line and a ground line to transmit electric power. | 11-21-2013 |
Patent application number | Description | Published |
20130241010 | Production Method for High-Purity Lanthanum, High-Purity Lanthanum, Sputtering Target Composed of High-Purity Lanthanum, and Metal Gate Film Containing High-Purity Lanthanum as Main Component - A method for producing high-purity lanthanum having a purity of 4N or more excluding rare earth elements other than lanthanum and gas components, wherein lanthanum having a purity of 4N or more is produced by reducing, with distilled calcium, a lanthanum fluoride starting material that has a purity of 4N or more excluding rare earth elements other than lanthanum and gas components, and the obtained lanthanum is subjected to electron beam melting to remove volatile substances. The method for producing high-purity lanthanum, in which Al, Fe, and Cu are respectively contained in the amount of 10 wtppm or less. The method for producing high-purity lanthanum, in which total content of gas components is 1000 wtppm or less. The present invention aims to provide a technique capable of efficiently and stably providing high-purity lanthanum, a sputtering target composed of high-purity lanthanum, and a thin film for metal gate that contains high-purity lanthanum as a main component. | 09-19-2013 |
20130313659 | Method for Producing High-Purity Lanthanum, High-Purity Lanthanum, Sputtering Target Formed from High-Purity Lanthanum, and Metal Gate Film Having Highy-Purity Lanthanum as Main Component - The present invention addresses the problem of providing a technique capable of efficiently and stably providing a method for producing high-purity lanthanum, the method characterized in that: a crude lanthanum oxide starting material having a purity of 2N-5N, excluding gas components, is used; the material is subjected to molten salt electrolysis at a bath temperature of 450-700° C. to produce lanthanum crystals; the lanthanum crystals are subsequently desalted: and electron beam melting is then performed to remove volatile substances. The present invention also addresses the problem of providing a technique capable of efficiently and stably providing high-purity lanthanum, high-purity lanthanum itself, a sputtering target formed from high-purity material lanthanum; and a thin film for metal gates that has high purity lanthanum as the main component. | 11-28-2013 |
20140199203 | HIGH-PURITY LANTHANUM, METHOD FOR PRODUCING SAME, SPUTTERING TARGET COMPRISING HIGH-PURITY LANTHANUM, AND METAL GATE FILM COMPRISING HIGH-PURITY LANTHANUM AS MAIN COMPONENT - A high-purity lanthanum, characterized by having a purity of 5N or more excluding rare earth elements and gas components, and α-ray count number of 0.001 cph/cm | 07-17-2014 |
Patent application number | Description | Published |
20140152216 | DRIVING APPARATUS FOR SENSORLESS FAN MOTOR - According to the voltage V | 06-05-2014 |
20150326153 | Motor Driving Circuit, Cooling Apparatus and Electronic Device Using the Same - A driving circuit of an electric motor includes: a PWM input pin for externally receiving an input pulse modulation signal with an input duty cycle; a duty cycle to digital converter for receiving and converting the input pulse modulation signal into a first digital value; a slope setting pin for receiving information indicative of a slope of an output duty cycle corresponding to the input duty cycle; a slope acquisition unit for acquiring a second digital value corresponding to the information indicative of the slope; a duty cycle computation unit for generating a linearly increased duty cycle instruction value corresponding to the first digital value by referring to the slope; a digital pulse width modulator for generating a controlling pulse having the output duty cycle corresponding to the duty cycle instruction value; and an output circuit for driving the electric fan motor in accordance with the controlling pulse. | 11-12-2015 |
20160111989 | FAN MOTOR DRIVING MEANS, DRIVING METHOD, AND COOLING DEVICE AND ELECTRONIC EQUIPMENT USING THE SAME - The present invention inhibits the voltage jump of a source voltage or an output voltage by an approach which is different from a conventional one. A logic circuit allows an H bridge circuit to be shifted among a plurality of states in a specific sequence. A compulsory regenerating circuit is configured to be switched between an enabled state and a disabled state; while being in the enabled state, the current that flows in from a ground line via the H bridge circuit and a motor coil to a power line back-flows to the ground line. | 04-21-2016 |
20160118916 | FAN MOTOR DRIVING APPARATUS AND METHOD, COOLING SYSTEM INCLUDING THE SAME, AND ELECTRONIC EQUIPMENT - A motor driving apparatus comprises an H bridge circuit having outputs coupled with a motor coil of a single-phase motor, a hall comparator configured to generate a hall detection signal indicating a position of a rotor of the motor, an electric angle generator configured to generate a pulse signal indicating that the motor rotates by a predetermined electric angle, a current monitoring circuit configured to asserts a zero current detection signal upon detecting a reversed direction of a coil current; a transition trigger circuit configured to assert a transition pulse when a count value of the first counter matches an lead angle set value; a logic circuit configured to transition the H bridge circuit according to a predetermined sequence of states; and a lead angle controller configured to adjust the lead angle set value based on a timing of assertion of the zero current detection signal. | 04-28-2016 |