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Goerlich, DE
Dirk Goerlich, Goettingen DE
| Patent application number | Description | Published |
|---|---|---|
| 20110071274 | IMMOBILISATION OF CHELATING GROUPS FOR IMMOBILISED METAL ION CHROMATOGRAPHY (IMAC) - The present invention refers to a method for binding a polycarboxylic acid to a solid phase. Further, the invention refers to a solid phase having a polycarboxylic acid immobilized thereto and methods of using the solid phase, e.g. for purifying His-tagged recombinant polypeptides. | 03-24-2011 |
Jens Goerlich, Bueren DE
| Patent application number | Description | Published |
|---|---|---|
| 20100068552 | MODULE INCLUDING A STABLE SOLDER JOINT - A solder includes a soft solder having a melting point less than 450° C. and particles embedded in the soft solder. Each particle has a maximum length greater than 50 μm. The particles comprise greater than 10 Vol % and less than 60 Vol % of the solder. | 03-18-2010 |
| 20110053319 | Method for Fabricating a Circuit Substrate Assembly and a Power Electronics Module Comprising an Anchoring Structure for Producing a Changing Temperature-Stable Solder Bond - A power semiconductor module is fabricated by providing a circuit substrate with a metal surface and an insulating substrate comprising an insulation carrier featuring a bottom side provided with a bottom metallization layer. An anchoring structure is provided comprising a plurality of oblong pillars each featuring a first end facing away from the insulation carrier, at least a subset of the pillars being distributed over the anchoring structure in its entirety, it applying for each of the pillars of the subset that from a sidewall thereof no or a maximum of three elongated bonding webs each extend to a sidewall of another pillar where they are bonded thereto. The anchoring structure is positioned between the insulation carrier and metal surface, after which the metal surface is soldered to the bottom metallization layer and anchoring structure by means of a solder packing all interstices between the metal surface and bottom metallization layer with the solder. | 03-03-2011 |
| 20110084369 | DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION METHOD - A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier. | 04-14-2011 |
Leszek Goerlich, Leonberg DE
| Patent application number | Description | Published |
|---|---|---|
| 20100006075 | DEVICE FOR VENTILATING A CRANK SPACE - The present invention relates to a device for venting a crank space in an internal combustion engine ( | 01-14-2010 |
| 20100307466 | OIL MIST SEPARATOR - A crankcase ventilation oil mist separator system, comprising: a first separator unit, which has at least one filter body arranged in a blow-by gas path such that blow-by gas flows through the body; a second separator unit which is arranged in a bypass path that bypasses the first separator unit; and a bypass valve which opens the bypass path when a differential pressure in the first separator unit exceeds a predefined value, wherein the second separator unit is an impactor separator. | 12-09-2010 |
Leszek Goerlich, Bundesland DE
| Patent application number | Description | Published |
|---|---|---|
| 20110174397 | PRESSURE CONTROL VALVE - A pressure control valve including a valve housing having a first opening and second opening. The valve housing including a valve member configured to control gas flow between the first opening and the second opening. The valve member is supported by a first membrane and a second membrane, both of which are formed on a single-piece membrane body. | 07-21-2011 |
Patrick Goerlich, Reutlingen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100138576 | DATA TRANSMISSION METHOD BETWEEN MASTER AND SLAVE DEVICES - A method for transmitting data frames between a master device and one or more slave devices via a bus system having at least one request line for transmitting request data frames from the master device to the slave devices, a response line for transmitting response data frames from the slave devices to the master device and at least one selection line for activating the slave devices, the request data frames and the response data frames being transmitted together with at least one address bit for addressing one of the slave devices, the useful data bits and at least one length-indicating bit for indicating the data frame length. | 06-03-2010 |
| 20110066396 | Sensor device and manufacturing method for a sensor device - A sensor device includes: a sensor module mounted on a conductor board; a sensitive element which is sensitive to a variable; a self-test control unit implementing a self-test program, the self-test control unit applying a self-test variable to the sensitive element, taking the self-test program into account; a detection unit detecting a characteristic of the sensitive element which is altered as a result of the applied self-test variable and providing an actual self-test response, taking the altered characteristic into account; and a comparator unit provided on or in the sensor module, the comparator unit comparing the actual self-test response to at least one specified setpoint self-test response and providing comparative information. | 03-17-2011 |