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Goellner
Cristina Goellner, Chacara Santo Antonio BR
| Patent application number | Description | Published |
|---|---|---|
| 20120089491 | SYSTEM AND METHOD OF PROVIDING ENHANCED TRANSACTION DATA - A system and method is provided for processing financial transactions performed by an employee using an employer provided financial presentation device. The system includes a memory, a processor coupled to the memory; and a processing module executable by the processor. The processing module is adapted to process an authorization request from the merchant for approval of the financial transaction. The processing module receives the financial transaction data together with the related enhanced data during the authorization process, stores the financial transaction data and the related enhanced data in the memory, and sends the financial transaction data and the related enhanced data to a reporting computer so as to make them available for access by the employer on a timely, accurate and convenient basis. | 04-12-2012 |
Jesse F. Goellner, Pittsburgh, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20090192341 | Method Of Circulating Catalyst Between A Catalyst Regenerator And An External Catalyst Cooler - This invention relates to efficiently regenerating catalyst particles by minimizing the formation of localized “hot spots” and “cold spots” in a regeneration zone. Specifically this invention relates to a method for controlling regenerator temperature in an oxygenates-to-olefins system, comprising the steps of: contacting an oxygenate feed in a reactor with a catalytically effective amount of molecular sieve-containing catalyst under conditions effective for converting said oxygenate to a product containing light olefins and forming a coked catalyst; contacting a portion of the coked catalyst in a regenerator, having a catalyst bed height (H | 07-30-2009 |
Jesse Frederick Goellner, Pittsburgh, PA US
| Patent application number | Description | Published |
|---|---|---|
| 20090067198 | CONTACTLESS POWER SUPPLY - A system includes a first device configured to receive a first wireless power associated with a first electromagnetic wave from a wireless power source. The first device is configured to convert the first wireless power to a first DC power, store the first DC power, and convert the first DC power stored in the first device to a second wireless power associated with a second electromagnetic wave. The system includes a second device configured to receive the second wireless power from the first device. The second device is configured to convert the second wireless power to a second DC power. The first device can receive the first wireless power at a first location and can convert the first DC power stored in the first device to the second wireless power at a second location different from the first location. | 03-12-2009 |
Reinhard Goellner, Regensburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20100252526 | Method for Manufacturing a Device on a Substrate - A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate. | 10-07-2010 |
| 20110031625 | Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element - An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region. | 02-10-2011 |
| 20120068240 | Semiconductor Device and Method using a Sacrificial Layer - A method of manufacturing a semiconductor device is disclosed. The method includes forming a first conductive layer over a substrate. The first conductive layer has a top surface and sidewalls, wherein the first conductive layer comprises an overhang of a non-conductive material along the sidewalls. The method further includes forming an insulating layer on the first conductive layer, and forming a sacrificial layer over the insulating layer and the overhang of the first conductive layer. The sacrificial layer is partially removed wherein a residue of the sacrificial layer remains beneath the overhang, and a second conductive layer is formed on the insulating layer. | 03-22-2012 |
Reinhard Goellner, Regensdburg DE
| Patent application number | Description | Published |
|---|---|---|
| 20090115074 | Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element - In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed. | 05-07-2009 |
Willy Goellner, Rockford, IL US
| Patent application number | Description | Published |
|---|---|---|
| 20120042756 | SAW BLADE STABILIZER AND METHOD - Stabilization of a circular saw blade is provided, through use of a blade stabilizer mounted adjacent a workpiece in a fixed relationship to the workpiece and having a stabilizer contact element adapted to bear against the circular saw blade and exert a force against the saw blade in a direction substantially perpendicular to a cutting plane of the saw blade at a point on at least one of the blade faces on the working side of the blade, proximate an axis of motion passing through an axis of rotation of the saw blade and the workpiece in the cutting plane, as the circular saw blade and/or the workpiece move relative to one another along the axis of motion. The axis of motion may be linear or curved. Some embodiments include additional blade stabilizers. | 02-23-2012 |