| Patent application number | Description | Published |
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| 20090031735 | SYSTEM AND METHOD OF CONTROLLING FLUID FLOW THROUGH A FLUID COOLED HEAT EXCHANGER - A vapor compression cooling system having a control unit adapted to receive working fluid pressure or temperature information to control a condenser cooling fluid control valve to minimize flow changes through the valve. | 02-05-2009 |
| 20090056348 | MOTORIZED BALL VALVE CONTROL SYSTEM FOR FLUID COOLED HEAT EXCHANGER - A vapor compression cooling system having a control unit adapted to receive working fluid pressure or temperature, environment temperature or relative humidity, compressor digital output, or other cooling system information to control a condenser cooling fluid control valve to minimize flow changes through the valve. | 03-05-2009 |
| 20110146965 | COOLING SYSTEM WITH INDIRECT HUMIDITY DETERMINATION - A cooling system for a data center in which equipment racks are disposed has a cooling unit and a controller coupled to the cooling unit. The cooling system includes temperature sensors at or near the cooling unit's air return inlet, at or near the cooling unit's air supply outlet, and at or near the equipment racks air inlet(s). The controller measures these temperatures. A relative humidity sensor is located at or near the air return inlet of the cooling unit. The relative humidity where the relative humidity sensor is located is measured by the controller using the relative humidity sensor. The controller calculates the dew point temperature from the temperature sensor and relative humidity. Using this dew point, which is essentially constant throughout the space being conditioned, and the temperatures from the other locations, the controller then calculates the relative humidity at each location. | 06-23-2011 |
| Patent application number | Description | Published |
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| 20090022500 | METHOD AND SYSTEM FOR OPTOELECTRONICS TRANSCEIVERS INTEGRATED ON A CMOS CHIP - Methods and systems for optoelectronics transceivers integrated on a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers on a top surface of a CMOS chip, which may include a guard ring. Photodetectors may be integrated in the CMOS chip. A CW optical signal may be received from a laser source via grating couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the top surface of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser. | 01-22-2009 |
| 20100006784 | METHOD AND SYSTEM FOR A LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT - Methods and systems for a light source assembly supporting direct coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The assembly may include a laser, a microlens, a turning mirror, reciprocal and/or non-reciprocal polarization rotators, and an optical bench. The laser may generate an optical signal that may be focused utilizing the microlens. The optical signal may be reflected at an angle defined by the turning mirror, and may be transmitted out of the light source assembly to one or more grating couplers in the chip. The laser may include a feedback insensitive laser. The light source assembly may include two electro-thermal interfaces between the optical bench, the laser, and a lid affixed to the optical bench. The turning mirror may be integrated in a lid affixed to the optical bench or may be integrated in the optical bench. | 01-14-2010 |
| 20100059822 | METHOD AND SYSTEM FOR MONOLITHIC INTEGRATION OF PHOTONICS AND ELECTRONICS IN CMOS PROCESSES - Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on a single CMOS wafer with different silicon layer thicknesses. The devices may be fabricated on a semiconductor-on-insulator (SOI) wafer utilizing a bulk CMOS process and/or on a SOI wafer utilizing a SOI CMOS process. The different thicknesses may be fabricated utilizing a double SOI process and/or a selective area growth process. Cladding layers may be fabricated utilizing one or more oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafer. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. Silicon dioxide or silicon germanium integrated in the CMOS wafer may be utilized as an etch stop layer. | 03-11-2010 |
| 20100111473 | Method and System For Coupling Optical Signals Into Silicon Optoelectronic Chips - A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more grating couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip. | 05-06-2010 |
| 20100209114 | Method and System for Single Laser Bidirectional Links - A method and system for single laser bidirectional links are disclosed and may include communicating a high speed optical signal from a transmit CMOS photonics chip to a receive CMOS photonics chip and communicating a low-speed optical signal from the receive CMOS photonics chip to the transmit CMOS photonics chip via one or more optical fibers. The optical signals may be coupled to and from the CMOS photonics chips utilizing single-polarization grating couplers. The optical signals may be coupled to and from the CMOS photonics chips utilizing polarization-splitting grating couplers. The optical signals may be amplitude or phase modulated. The optical fibers may comprise single-mode or polarization-maintaining fibers. A polarization of the high-speed optical signal may be configured before communicating it over the single-mode fibers. The low-speed optical signal may be generated by modulating the received high-speed optical signal or from a portion of the received high-speed optical signal. | 08-19-2010 |
