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Gilberto Curatola

Gilberto Curatola, Korbek-Lo BE

Patent application numberDescriptionPublished
20080277739Finfet Transistors - A fin FET array includes a number of fins 11-13-2008
20090289298SELF-ALIGNED IMPACT-IONIZATION FIELD EFFECT TRANSISTOR - An impact ionisation MOSFET is formed with the offset from the gate to one of the source/drain regions disposed vertically within the device structure rather than horizontally. The semiconductor device comprises a first source/drain region having a first doping level; a second source/drain region having a second doping level and of opposite dopant type to the first source/drain region, the first and second source/drain regions being laterally separated by a silicon-germanium intermediate region having a doping level less than either of the first and second doping levels; a gate electrode electrically insulated from, and disposed over, the intermediate region, the first and second source/drain regions being laterally aligned with the gate electrode; where the entire portion of the first source/drain region that forms a boundary with the intermediate region is separated vertically from the top of the intermediate region.11-26-2009
20100025766TRANSISTOR DEVICE AND METHOD OF MANUFACTURING SUCH A TRANSISTOR DEVICE - A transistor device (02-04-2010
20100044760SELF-ALIGNED IMPACT-IONIZATION FIELD EFFECT TRANSISTOR - An impact ionisation MOSFET is formed with the offset from the gate to one of the source/drain regions disposed vertically within the device structure rather than horizontally. The semiconductor device comprises a first source/drain region having a first doping level; a second source/drain region having a second doping level and of opposite dopant type to the first source/drain region, the first and second source/drain regions being laterally separated by an intermediate region having a doping level less than either of the first and second doping levels; a gate electrode electrically insulated from, and disposed over, the intermediate region, the first and second source/drain regions being laterally aligned with the gate electrode; where the entire portion of the first source/drain region that forms a boundary with the intermediate region is separated vertically from the top of the intermediate region.02-25-2010
20100066348APPARATUS AND METHOD FOR MOLECULE DETECTION USING NANOPORES - A detector device comprises a substrate (03-18-2010
20100097135TUNNEL FIELD EFFECT TRANSISTOR - A tunnel transistor includes source diffusion (04-22-2010
20110018065METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device is disclosed comprising providing an insulating carrier (01-27-2011

Patent applications by Gilberto Curatola, Korbek-Lo BE

Gilberto Curatola, Leuven BE

Patent application numberDescriptionPublished
20090297938STACKED MULTI-CELL BATTERY CONCEPT - A device is provided that includes a battery layer on a substrate, where a first battery cell is formed in the battery layer. The first battery cell includes a first anode, a first cathode, and a first electrolyte arranged between the first anode and the first cathode, where the first anode, the first cathode, and the first electrolyte are arranged in the battery layer such that perpendicular projections onto the substrate of each of the first anode and the first cathode are non-overlapping. A method of manufacturing such device is also provided. A system is also provide that includes such device for supplying power to an electronic device.12-03-2009

Gilberto Curatola, Korbek-Lo FR

Patent application numberDescriptionPublished
20090159938METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD - The invention relates to a method of manufacturing a semiconductor device (06-25-2009