Giesecke
Daniel Giesecke, West Chicago, IL US
Patent application number | Description | Published |
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20120161258 | PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE - A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate. | 06-28-2012 |
20120161259 | Package With A CMOS Die Positioned Underneath A MEMS Die - A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate. | 06-28-2012 |
20130193533 | EMBEDDED CIRCUIT IN A MEMS DEVICE - A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface. | 08-01-2013 |
20140044297 | Microphone Assembly With Barrier To Prevent Contaminant Infiltration - A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening. | 02-13-2014 |
Daniel Giesecke, St. Charles, IL US
Patent application number | Description | Published |
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20150251898 | Embedded Circuit In A MEMS Device - A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extending there through; an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB; an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via; and a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port. Sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit. The integrated circuit processes the signals and sends the processed signals to the customer pads via the electrically conductive through-hole via. | 09-10-2015 |
Heinz Giesecke, Odenthal DE
Johannes Giesecke, Freiburg DE
Patent application number | Description | Published |
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20130146787 | METHOD FOR DETERMINING MATERIAL PARAMETERS OF A DOPED SEMICONDUCTOR SUBSTRATE BY MEASURING PHOTOLUMINESCENT RADIATION - Method for determining material parameters of a doped semiconductor substrate, including: applying electromagnetic excitation radiation in order to produce luminescent radiation in the semiconductor substrate, the temporal profile of the excitation radiation intensity is periodically modulated, so that the rate of generation of charge carrier pairs in the substrate has a maximum and minimum during an excitation period, and at least the relative temporal profile of the rate of generation G(t) is determined by time-dependent measurement of the excitation radiation intensity, time-resolved measuring luminescent radiation intensity emanating from a measuring region, at least the relative temporal profile of the intensity of the luminescent radiation Φ(t) is measured during an excitation period, determining a material parameter of the semiconductor substrate based on G(t) and Φ(t). The effective lifetime of the substrate is determined from the time difference between the maximum of G(t) and a corresponding maximum of Φ(t). | 06-13-2013 |
Philipp Giesecke, Remscheid DE
Patent application number | Description | Published |
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20110101194 | LONGITUDINAL ADJUSTER WITH AT LEAST ONE END STOP - A longitudinal adjuster, in particular for a vehicle seat, has at least one first seat rail ( | 05-05-2011 |