| Patent application number | Description | Published |
|---|
| 20080202792 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 08-28-2008 |
| 20080203585 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 08-28-2008 |
| 20080206979 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 08-28-2008 |
| 20120012642 | INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. With a two-layer ball-limiting composition comprising an adhesion/reaction barrier layer, wherein the adhesion/reaction barrier layer serves both as an adhesion layer and a reaction barrier layer, the adhesion/reaction barrier layer can be comprised of a material selected from the group consisting of Zr and ZrN | 01-19-2012 |
| Patent application number | Description | Published |
|---|
| 20100118830 | Mobile Intelligent Roaming Using Multi-Modal Access Point Devices - A system and method are provided in which access point (AP) devices in a wireless local area network (WLAN) are typed or configured into one of three measurement and reporting roles: Monitor-Mode AP (MMAP), Portal AP (PAP), a Border AP (BAP) or an Interior AP (IAP). APs are assigned specific link measurement requirements according to their assigned type or role. In general, MMAPs and PAPs have the greatest measurement and reporting responsibilities, BAPs have less measurement and reporting responsibilities than PAPs and IAPs have the least measurement and reporting responsibilities. The APs generate measurements that are supplied to appropriate equipment to facilitate handover decisions with respect to a dual-mode wireless client device that roams between the WLAN and another network or vice versa. As a result, link measurements are only performed by APs in locations where such measurements are necessary for handover service, thus reducing the overall processing load on the WLAN infrastructure. | 05-13-2010 |
| 20100226339 | Performance Management of Mobile Intelligent Roaming Using Mobility Detail Records - Techniques are provided herein to improve the manageability of handover performance of multi-mode wireless client devices when roaming between a wireless local area network (WLAN) and at least one other network. Signals are received at a plurality of WLAN access points from multi-mode wireless client devices. The WLAN access points generate handover data associated with handover events of wireless Voice-Over Internet Protocol (VoIP) communication sessions for the multi-mode wireless client devices between the wireless local area network and at least one other network. The WLAN access points also generate link quality data representing status and quality of a wireless link with multi-mode wireless client devices during a VoIP communication session. A controller that is provided that is configured to receive the handover data and link quality data for multi-mode wireless client devices from the plurality of access points. The controller aggregates the handover data and link quality data for a VoIP communication session for a multi-mode wireless client device into a mobility detail record and stores the mobility detail record together with an identifier of an associated call detail record. | 09-09-2010 |
| 20110002295 | INFRASTRUCTURE ASSISTED NETWORK TRANSITION - An infrastructure assisted network transition scheme is provided. In a multi-mode wireless communication device, handover threshold data is received from a management server associated with a first wireless network comprising one or more wireless access points. The multi-mode wireless communication device receives signals from the one or more wireless access point devices of the first wireless network and generates data representing the received signals. The multi-mode wireless communication device analyzes the data representing the received signals with respect to the handover threshold data to determine when the multi-mode wireless communication device should initiate hand-in to the first wireless network and when to initiate hand-out from the first wireless network to the second wireless network. Functions are provided at the management server to enable the generation of the handover threshold data from network configuration information associated with the first wireless network. | 01-06-2011 |
