Ghassem Azdasht, Berlin DE
Ghassem Azdasht, Berlin DE
Patent application number | Description | Published |
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20080210368 | Method and Device for Transferring a Chip to a Contact Substrate - A method and device for transferring a chip ( | 09-04-2008 |
20080260370 | Optical System - Optical system ( | 10-23-2008 |
20080282574 | Method and Device For Drying Circuit Substrates - Method and device for drying circuit substrates ( | 11-20-2008 |
20080302863 | Method and Device for Transferring a Solder Deposit Configuration - Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate ( | 12-11-2008 |
20090032296 | METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT BETWEEN A MICROELECTRONIC COMPONENT AND A CARRIER SUBSTRATE AS WELL AS AN ASSEMBLY UNIT MANUFACTURED BY THIS METHOD - The invention relates to a method for manufacturing a contact arrangement ( | 02-05-2009 |
20090249620 | METHOD AND DEVICE FOR APPLYING AN ELECTRONIC COMPONENT - The invention relates to a method for applying an electronic component ( | 10-08-2009 |
20100051589 | METHOD AND DEVICE FOR CONTACTING, POSITIONING AND IMPINGING A SOLDER BALL FORMATION WITH LASER ENERGY - The invention relates to a method and a device for contacting a solder ball formation ( | 03-04-2010 |
20100051673 | METHOD AND DEVICE FOR TRANSFERRING A SOLDER DEPOSIT CONFIGURATION - Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate ( | 03-04-2010 |
20100181295 | METHOD AND DEVICE FOR REMOVING SOLDER MATERIAL DEPOSITS FROM A SUBSTRATE - The present invention relates to a method and to a device for separating solder material deposits ( | 07-22-2010 |
20100213243 | TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT - The present invention relates to a transfer device ( | 08-26-2010 |
20110089963 | TEST CONTACT ARRANGEMENT - The invention relates to a test contact arrangement ( | 04-21-2011 |
20110235681 | Device for Positioning and Contacting Test Contacts - The present invention relates to a device for positioning and contacting test contacts ( | 09-29-2011 |
20110244651 | METHOD AND DEVICE FOR ALTERNATELY CONTACTING TWO WAFERS - A method and device for alternatively contacting two wafer-like component composite arrangements, in which two component composite arrangements, provided with contact metallizations on their opposing contact surfaces, are brought into a coverage position with their contact metallizations to form contact pairs, in which position the contact metallizations to be joined together are pressed against one another, the contact metalllizations being contacted by exposing the rear of one of the component composite arrangements to laser radiation, the wavelength of the laser radiation being selected as a function of the degree of absorption of the component composite arrangement, so that a transmission of the laser radiation through the component composite arrangement exposed to the laser radiation at the rear is essentially suppressed or an absorption of the laser radiation takes place essentially in the contact metallizations of one or both component composite arrangements. | 10-06-2011 |
20120126410 | Contact Array for Substrate Contacting - The present invention relates to a contact arrangement ( | 05-24-2012 |
20120228772 | Diode Array and Method for Producing a Diode Array - The present invention relates to a diode arrangement ( | 09-13-2012 |
20130087539 | Method and Device for Forming Solder Deposits - The invention relates to a method for forming solder deposits ( | 04-11-2013 |
20140027418 | Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium - The present invention relates to a method for electrically contacting terminal faces of two substrates ( | 01-30-2014 |