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Geun Young
Geun Young Kim, Suwon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110096528 | BACKLIGHT UNIT - There is provided a backlight unit. | 04-28-2011 |
| 20110292683 | BACKLIGHT UNIT - There is provided a backlight unit. The backlight unit includes a light guiding plate, a light source module including a substrate provided with a circuit wiring and a plurality of light emitting diode (LED) blocks each including one or more LED mounted on the substrate to be positioned vertically with respect to the substrate, the one or more LED being disposed to face a side surface of the light guiding plate, a bottom chassis including a base and a sidewall upwardly extending from a circumference of the base, and accommodating the light source module and the light guiding plate in such a manner that the one or more LED is disposed to be adjacent to the sidewall, and a driving unit controlling a current signal applied to each of the plurality of LED blocks to thereby control brightness for each LED block. | 12-01-2011 |
Geun Young Kim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20100073903 | BACKLIGHT UNIT - Provided is a backlight unit including a plurality of light guide plates that each include a first side surface having a housing groove, an upper surface extending from an edge of the first side surface, a flat lower surface facing the upper surface, and a second side surface facing the first side surface of an adjacent light guide plate, and are disposed in parallel; a plurality of light source units that are disposed in the housing grooves of the respective light guide plates; and a bottom case that houses the light guide plates and the light source units. | 03-25-2010 |
| 20110199787 | LED PACKAGE AND A BACKLIGHT UNIT UNIT COMPRISING SAID LED PACKAGE - A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate. | 08-18-2011 |
Geun Young Kim, Gyeonggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110306924 | ATMOSPHERIC LOW-TEMPERATURE MICRO PLASMA JET DEVICE FOR BIO-MEDICAL APPLICATION - There are provided an atmospheric low-temperature micro plasma jet device for bio-medical application comprising an electrode used as an anode, a gas injection pipe used as a cathode, a porous insulating material, a protection pipe, and an insulating case and manufacturing method therefor using micromachining such as microelectromechanical systems (MEMS) in such a way that a diameter of micro electrodes where plasma is jetted is several tens micrometers or less. | 12-15-2011 |
Geun Young Park, Suwon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100214049 | TRANSFORMER - The present invention provides a transformer capable of driving a plurality of lamps with one transformer by increasing the number of outer bobbins wrapping an outer circumferential surface of an inner bobbin wound by a coil and the number of output terminals by winding other coils around the outer bobbins. | 08-26-2010 |
Geun Young Yeom, Dublin, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100117096 | VERTICAL STRUCTURE SEMICONDUCTOR DEVICES WITH IMPROVED LIGHT OUTPUT - The invention provides a reliable technique to fabricate a new vertical structure compound semiconductor devices with highly improved light output. An exemplary embodiment of a method of fabricating light emitting semiconductor devices comprising the steps of forming a light emitting layer, and forming an undulated surface over light emitting layer to improve light output. In one embodiment, the method further comprises the step of forming a lens over the undulated surface of each of the semiconductor devices. In one embodiment, the method of claim further comprises the steps of forming a contact pad over the semiconductor structure to contact with the light emitting layer, and packaging each of the semiconductor devices in a package including an upper lead frame and lower lead frame. Advantages of the invention include an improved technique for fabricating semiconductor devices with great yield, reliability and light output. | 05-13-2010 |