| Patent application number | Description | Published |
|---|
| 20080290820 | LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF AND LIGHT EMITTING SYSTEM USING THE SAME - A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed. | 11-27-2008 |
| 20090092031 | OPTICAL PICKUP MODULE AND MANUFACTURING METHOD THEREOF - Disclosed are an optical pickup module and a manufacturing method thereof. The manufacturing method of an optical pickup module includes: forming a wet-etching mask layer at an outer portion of an upper surface of a silicon substrate to be used as a sub mount; etching a middle portion of the silicon substrate by using the wet-etching mask layer thereby forming a cavity, forming an inclination surface at the etched portion, and then removing the wet-etching mask layer; forming an insulating layer on an entire upper surface of the to silicon substrate; forming an electrode layer on an upper surface of the insulating layer; forming adhesive layers at a part of an upper surface of the electrode layer; and arranging a light emitting device at an upper surface of one adhesive layer and arranging an MPD at an upper surface of another adhesive layer by a fixation thereby completing an optical pickup module. | 04-09-2009 |
| 20090289272 | LIGHT EMITTING DEVICE PACKAGE - Disclosed is a light emitting device package. The light emitting device package includes a semiconductor substrate comprising a first surface at a first depth from an upper surface of the semiconductor substrate and a second surface at a second depth from the first surface; and a light emitting part on the second surface of the semiconductor substrate. | 11-26-2009 |
| 20100078668 | LIGHT EMITTING DEVICE - Provided is a light emitting device. The light emitting device comprises a body, a light emitting diode on the body, a resistor integrated on the body and configured to sense a temperature of the light emitting diode, and a plurality of metal layers on the body. | 04-01-2010 |
| 20100148205 | LENS, MANUFACTURING METHOD THEREOF AND LIGHT EMITTING DEVICE PACKAGE USING THE SAME - A lens and a light emitting device package formed by introducing surface mount technology (SMI) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion. | 06-17-2010 |
| 20100163905 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package and a method for manufacturing the same are provided. The light emitting device package comprises a package body including a cavity disposed at an upper portion. The light emitting device package includes an insulating layer disposed on a surface of the package body. The light emitting device package includes a plurality of metal layers disposed on the insulating layer. The light emitting device package includes a light emitting device disposed in the cavity. The light emitting device package includes a first metal plate disposed at a rear surface of the package body at a location corresponding to the light emitting device. | 07-01-2010 |
| 20100187556 | Light Emitting Device Package And Method For Manufacturing The Same - A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device. | 07-29-2010 |
| 20100219432 | LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME - Disclosed is a light emitting device. The light emitting device comprises a conductive substrate, an insulating layer on the conductive substrate, a plurality of light emitting device cells on the insulating layer, a connection layer electrically interconnecting the light emitting device cells, a first contact section electrically connecting the conductive substrate with at least one light emitting device cell, and a second contact section on the at least one light emitting device cell. | 09-02-2010 |
| 20100295089 | LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - Provided are a light emitting device package and a method for fabricating the same. The light emitting device package comprises a substrate; a light emitting device on the substrate; a zener diode comprising a first conductive type impurity region and two second conductive type impurity regions, the first conductive type impurity region being disposed in the substrate, the two second conductive type impurity regions being separately disposed in two areas of the first conductive type impurity region; and a first electrode layer and a second electrode layer, each of them being electrically connected to the second conductive type impurity regions and the light emitting device. | 11-25-2010 |
| 20100314647 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME - A light emitting device package comprises: a substrate; first and second conduction members on the substrate; a light emitting diode on the substrate, the light emitting diode being electrically connected with the first and second conduction members; and a phosphor layer on the light emitting diode. | 12-16-2010 |
| 20110057209 | LIGHT EMITTING DEVICE - Provided are a light emitting device. The light emitting device comprises a package body, an insulating layer on a surface of the package body, first and second electrode layers on the insulating layer, a light emitting diode disposed on the package body and electrically connected to the first and second electrode layers, a resistor layer connected to the first electrode layer, a first element part in a first doping region within the package body, a second element part in a second doping region within the package body, and a third electrode layer connected to the first element part and the second element part. | 03-10-2011 |
| 20110090711 | LIGHT EMITTING APPARATUS AND LIGHTING SYSTEM - A light emitting apparatus including a body including a first cavity; a first electrode and a second electrode on the body; a light emitting device disposed in the first cavity and being electrically connected with the first and the second electrodes; and a first molding member disposed in the first cavity, and including a fluorescent material. Further, a height ‘a’ of the light emitting device and a depth ‘y’ of the first cavity satisfy a relation 1.5a≦y≦3.0a, and the height ‘a’ and a horizontal distance ‘x’ from an upper outer edge of the light emitting device to an inner surface of the body forming the first cavity satisfy a relation 0.5a≦x≦1.5a. | 04-21-2011 |
| 20110140142 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material. | 06-16-2011 |
