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Gervasi
David Gervasi, Pittsford, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080239022 | SELF ALIGNED PORT HOLE OPENING PROCESS FOR INK JET PRINT HEADS - In accordance with the invention, there are jet stacks, ink jet print heads, and methods of making jet stacks and ink jet print heads. The method of making an ink jet print head can include providing a partial jet stack including a diaphragm, a plurality of port holes, and having an ink outlet side and providing a polymer planarized piezoelectric array. The method can also include bonding the polymer planarized piezoelectric array to a side opposite to the ink outlet side of the partial jet stack using an adhesive, wherein the partial jet stack is aligned such that the planarized polymer covers the plurality of port holes, and using the partial jet stack as a mask to extend the port holes through the polymer by ablating the polymer and an excess portion of the adhesive from the ink outlet side using a laser. | 10-02-2008 |
David J. Gervasi, Penfield, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20090111953 | RELEASE FLUID COMPOSITIONS - Use of release fluids or agents constituting hyperbranched polymers. The three-dimensional structure imparts characteristics that make the hyperbranched polymers useful in xerographic processes. The hyperbranched polymer release fluids or agents may be used with a fuser member having a substrate, an outer layer covering the substrate, and a release coating on the outer layer, wherein the release coating includes a hyperbranched polymer. | 04-30-2009 |
Louis R. Gervasi, Lakewood, CO US
| Patent application number | Description | Published |
|---|---|---|
| 20110247378 | Low-Carbon Fertilizers and Processes for Producing the Same - Novel low-carbon fertilizers and processes useful for the production of the novel low-carbon fertilizers are disclosed. | 10-13-2011 |
William M. Gervasi, Ladera Ranch, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080316712 | HIGH DENSITY MODULE HAVING AT LEAST TWO SUBSTRATES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN - A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and a first set of the plurality of electrical contacts. | 12-25-2008 |
| 20100110642 | MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN - A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts. | 05-06-2010 |
| 20110110047 | MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN - A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages. | 05-12-2011 |