Patent application number | Description | Published |
20120070926 | METHOD FOR PRODUCING A LIGHT-EMITTING DIODE - A method for producing a light-emitting diode includes providing a light-emitting diode chip including a semiconductor body, and applying a luminescence conversion material to an outer area of the semiconductor body by thermal spraying such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material, or providing a radiation-transmissive carrier, applying a luminescence conversion material to an outer area of the carrier by thermal spraying, and arranging the carrier at a radiation exit area of the light-emitting diode chip such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material. | 03-22-2012 |
20120091491 | Radiation-Emitting Optical Component - A radiation-emitting semiconductor component, having a layer structure which includes an active layer which, in operation, emits radiation with a spectral distribution, and electrical contacts for applying a current to the layer structure, includes a coating layer which at least partially surrounds the active layer and holds back a short-wave component of the emitted radiation. | 04-19-2012 |
20120098015 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semiconductor component includes a housing main body and at least one optoelectronic semiconductor chip mounted on the housing main body. In operation, the optoelectronic semiconductor chip emits primary radiation including an ultraviolet radiation fraction. The semiconductor component also includes a filter medium that absorbs the ultraviolet radiation fraction and is located at least in part between the semiconductor chip and the housing main body and/or between the semiconductor chip and an optical component. | 04-26-2012 |
20120132947 | LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE - A light-emitting diode includes a carrier having a mounting surface; at least one light-emitting diode chip fixed to the mounting surface; and a reflective element provided for reflecting electromagnetic radiation, wherein the reflecting element is fixed to the carrier and includes porous polytetrafluoroethylene. | 05-31-2012 |
20120273811 | HOUSING FOR AN OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A HOUSING - A housing for an optoelectronic component including a main housing body formed by a first plastics material, and which has a recess, and a coating formed by a second plastics material, and which, at least in a region of the recess, connects at least in places to the main housing body and is in direct contact with the main housing body, wherein the first plastics material is different from the second plastics material, and the first plastics material and the second plastics material differ from one another with regard to at least one of the following material properties: temperature resistance with regard to discoloration, temperature resistance with regard to deformation, temperature resistance with regard to destruction, and resistance to electromagnetic radiation. | 11-01-2012 |
20120280116 | Method for Producing a Housing for an Optoelectronic Semiconductor Device, Housing, and Optoelectronic Semiconductor Device - A method can be used to produce a housing for an optoelectronic semiconductor device. A reflector part, which has an inner area configured to reflect electromagnetic radiation, is encased in places with a housing material using an injection molding method. The inner area of the reflector part remains free of the housing material at least in places. The reflector part is formed with a first plastic material and the housing material is formed with a second plastic material that is different than the first plastic material. The first plastic material and the second plastic material differ from one another with regard to at least thermal stability or resistance to electromagnetic radiation. | 11-08-2012 |
20120299041 | Optoelectronic Semiconductor Component - An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation. | 11-29-2012 |
20130155696 | OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - An optoelectronic component includes a housing which includes a first partial region having a first thermoplastic material crosslinked by irradiation and a second partial region having a second thermoplastic material, a recess in the housing, and a radiation-emitting device disposed in the recess. | 06-20-2013 |
20130207148 | RADIATION-EMITTING COMPONENT WITH A CONVERTER MATERIAL, WITH A THERMALLY CONDUCTIVE CONTACT AND METHOD FOR THE PRODUCTION THEREOF - A radiation-emitting component includes:
| 08-15-2013 |