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Gereon Vogtmeier, Aachen DE

Gereon Vogtmeier, Aachen DE

Patent application numberDescriptionPublished
20080217546Pixel Implemented Current to Frequency Converter - The present invention provides a radiation sensor (09-11-2008
20080230706Modular Device For the Detection and/or Transmission of Radiation - The invention relates to a device for the detection and/or transmission of radiation, particularly an X-ray detector 09-25-2008
20080258067Microelectronic System with a Passivation Layer - The invention relates to a microelectronic system, particularly for an X-ray detector, comprising a semiconductor layer (10-23-2008
20080272296Data Processing Device, Tomography Apparatus for Examination of an Object of Interest, Method of Examining an Object of Interest, Computer-Readable Medium and Program Element - A data processing device, comprising a plurality of emitter antennas (11-06-2008
20080272309X-Ray Detector With Correction for Scattered Radiation - The invention refers to X-ray devices, an X-ray detector and a method of correcting intensity signals. An X-ray detector then comprises for determining the intensity of X-rays, which comprise a proportion of primary radiation having an irradiation direction and a proportion of scattered radiation, at least a first sensor elements, which are each provided for converting the X-rays into first and second intensity signals, and a filter element, which is provided for decreasing the proportion of scattered radiation in the intensity of the X-rays, wherein the second sensor elements are arranged in irradiation direction behind the filter element and wherein the first sensor element fastened to the filter element is provided for determining the intensity of the X-rays before leaving the filter element. The proportion of the scattered radiation calculated from the measuring data of the first and second sensor elements is provided for correcting the second intensity signals for the following image generation.11-06-2008
20080277588X-Ray Detector with In-Pixel Processing Circuits - The invention relates to an X-ray detector with an array of pixels (11-13-2008
20090079021LOW OHMIC THROUGH SUBSTRATE INTERCONNECTION FOR SEMICONDUCTOR CARRIERS - It is described a low ohmic Through Wafer Interconnection (TWI) for electronic chips formed on a semiconductor substrate (03-26-2009
20090323899GRID FOR SELECTIVE ABSORPTION OF ELECTROMAGNETIC RADIATION AND METHOD FOR ITS MANUFACTURE12-31-2009
20100008558SPECTRALLY RESOLVING X-RAY IMAGING DEVICE - The invention relates to an X-ray imaging device (01-14-2010
20100061520GRID FOR SELECTIVE TRANSMISSION OF ELECTROMAGNETIC RADIATION WITH STRUCTURAL ELEMENT BUILT BY SELECTIVE LASER SINTERING - The present disclosure concerns a grid for selective transmission of electromagnetic radiation, particularly X-ray radiation, that has at least one structural element (03-11-2010
20100171196ELECTRICALLY SHIELDED THROUGH-WAFER INTERCONNECT - Through-Wafer Interconnections allow for the usage of cost-effective substrates for detector chips. According to an exemplary embodiment of the present invention, detecting element for application in an examination apparatus may be provided, comprising a wafer with a sensitive region and a coaxial through-wafer interconnect structure. This may reduce the susceptibility of the interconnection by providing an effective shielding.07-08-2010
20100295066SEMICONDUCTOR SUBSTRATE AND METHODS FOR THE PRODUCTION THEREOF - The invention relates to semiconductor substrates and methods for producing such semiconductor substrates. In this connection, it is the object of the invention to provide semiconductor substrates which can be produced more cost-effectively and with which a high arrangement density as well as good electrical conductivity and closed surfaces can be achieved. In accordance with the invention, an electrically conductive connection is guided from its front side through the substrate up to the rear side. The electrically conductive connection is completely surrounded from the outside. The insulator is formed by an opening which is filled with material. The inner wall is provided with a dielectric coating and/or filled with an electrically insulating or conductive material. The electrically conductive connection is formed with a further opening which is filled with an electrically conductive material and is arranged in the interior of the insulator. The openings are formed with step-free inner walls aligned orthogonally to the front side or tapering continuously in the direction of the rear side.11-25-2010
20100322498MULTIPLE-SOURCE IMAGING SYSTEM WITH FLAT-PANEL DETECTOR - When performing nuclear (e.g., SPECT or PET) and CT scans on a patient, an imaging system (12-23-2010
20110002441HIGH-RESOLUTION QUASI-STATIC SETUP FOR X-RAY IMAGING WITH DISTRIBUTED SOURCES - A method for acquiring X-ray image data of an imaging volume is disclosed, the method using a detector and a distributed X-ray source structure having a plurality of single source elements, which are uniformly distributed with a common pitch to each other, the method comprises moving the distributed X-ray source structure and/or the detector with respect to the imaging volume, importantly, the maximum moving distance d01-06-2011
20110005830CONNECTOR FOR ESTABLISHING AN ELECTRICAL CONNECTION WITH CONDUCTIVE TAPE - Provided is a connector (01-13-2011
20110007874MULTIPLE ENERGY X-RAY SOURCE01-13-2011
20110051895X-RAY SYSTEM WITH EFFICIENT ANODE HEAT DISSIPATION - X-ray systems for use in high-resolution imaging applications with an improved power rating are provided. An X-ray source comprises at least one integrated actuator unit (03-03-2011
20110079865RADIATION DETECTION AND A METHOD OF MANUFACTURING A RADIATION DETECTOR - The invention relates to a radiation detector (04-07-2011
20110122999GRID AND METHOD OF MANUFACTURING A GRID FOR SELECTIVE TRANSMISSION OF ELECTROMAGNETIC RADIATION, PARTICULARLY X-RAY RADIATION05-26-2011

Patent applications by Gereon Vogtmeier, Aachen DE