Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Gerber, TX
Mark Gerber, Lucas, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20090115026 | SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON VIAS FOR HIGH CURRENT,HIGH FREQUENCY, AND HEAT DISSIPATION - An integrated circuit device ( | 05-07-2009 |
| 20090166889 | PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS - Packaged integrated circuits having surface mount devices and methods to form the same are disclosed. A disclosed method comprises attaching an integrated circuit to a first side of a substrate, forming one or more first conductive elements on the substrate, attaching a surface mount device to a second side of the substrate via the first conductive elements, forming one or more second conductive elements on the second side of the substrate. | 07-02-2009 |
Mark A. Gerber, Plano, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20080258286 | High Input/Output, Low Profile Package-On-Package Semiconductor System - A package-on-package system ( | 10-23-2008 |
| 20080284045 | Method for Fabricating Array-Molded Package-On-Package - A method and apparatus for fabricating a semiconductor device are disclosed. The method attaches semiconductor chips ( | 11-20-2008 |
| 20080315385 | Array molded package-on-package having redistribution lines - A semiconductor device with a sheet-like insulating substrate ( | 12-25-2008 |
| 20110165731 | Method for Fabricating Array-Molded Package-on-Package - An improved semiconductor device package is manufactured by attaching semiconductor chips ( | 07-07-2011 |
Mark Allen Gerber, Lucas, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20090309236 | Package on Package Structure with thin film Interposing Layer - The invention relates to microelectronic semiconductor device assemblies having vertically stacked semiconductor device layers. In a disclosed example of a preferred embodiment, a semiconductor device includes a base substrate, an interposing layer, and a second semiconductor device. The interposing layer features a thin insulating film with numerous electrical contacts on its surfaces for electrically coupling with electrical contacts on the adjacent layers. The interposing layer further includes electrical contacts for coupling with one or more non-adjacent layers. Particular examples of preferred embodiments of the invention disclose the use of polyimide film for the interposing layer material and metal studs for non-adjacent layer contacts. | 12-17-2009 |
| 20100084755 | Semiconductor Chip Package System Vertical Interconnect - Stacked semiconductor chip package system vertical interconnects and related methods are disclosed. A preferred embodiment of the invention includes a first semiconductor chip with a surface bearing a plurality of first fusible metallic coupling elements. A second semiconductor chip has a plurality of second fusible metallic coupling elements. The first and second fusible metallic coupling elements correspond at the adjoining surfaces of the first and second semiconductor chips when stacked, and are fused to form a gold-tin eutectic alloy fused metallic coupling vertically interconnecting the stacked chips. | 04-08-2010 |
| 20110011424 | Method for Cleaning Insulating Coats from Metal Contact Surfaces - A process flow employing a liquid cleaning agent ( | 01-20-2011 |
Stephen C. Gerber, Austin, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20110019205 | Apparatus and method for implementing a touchless slider - A method for gesture recognition in an optical system using a touchless slider is shown. The touchless slider has first and second reference points positioned along an axis in an optical system. The method includes obtaining a plurality of first and second reflectance values by measuring an amplitude of light reflected from an object relative to the first and second reference points, respectively, wherein each first and second reflectance value corresponds to a different point in time. The plurality of first and second reflectance values are compared to identify a plurality of ratio values between the first and second reflectance values, wherein each of the plurality of ratio values corresponds to one of the points in time. At least one of a position and a direction of movement of the object relative to the first and second reference points is determined based on the identified plurality of ratio values. | 01-27-2011 |
| 20110157068 | TOUCH SCREEN POWER-SAVING SCREEN SCANNING ALGORITHM - A method for detecting touch locations on a capacitive array includes the steps of scanning for at least one touch location on an entire capacitive array using a first sensing circuitry and detecting the at least one touch location with the first sensing circuitry. A smaller portion of the capacitive array is determined responsive to the detection of the at least one touch location. The at least one touch location is scanned only within smaller portion of the capacitive array using a second sensing circuitry. The at least one touch location is detected with the second sensing circuitry and output for use. | 06-30-2011 |
Steve Gerber, Austin, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20100283760 | METHOD AND APPARATUS FOR SCANNING A TOUCHSCREEN WITH MULTI-TOUCH DETECTION USING MASTER/SLAVE DEVICES - A touch panel scan system is disclosed for detecting a change in mutual capacitance on the surface of a touch panel. A first touch detect device is provided having a transmitter for transmitting a transmit signal to a select one of a plurality of first lines on a first edge of a touch panel to facilitate a single line scan operation. A second touch detect device is interfaced with a select one or ones of second lines on a second edge of the touch panel having a receiver for receiving therefrom and processing thereof transmit signals coupled thereto from the select one or ones of the first lines to detect changes in a mutual capacitance associated with the select one or ones of the second lines and the first line. At least one of the first or second touch detect devices functions as a master and the other functions as a slave, with the master coupled to the slave and generating a SYNC signal to initiate a single scan operation of a select one of the first lines. | 11-11-2010 |