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Gerben Doornbos

Gerben Doornbos, Kessel-Lo BE

Patent application numberDescriptionPublished
20100028809DOUBLE PATTERNING FOR LITHOGRAPHY TO INCREASE FEATURE SPATIAL DENSITY - A method of forming a pattern in at least one device layer in or on a substrate comprises: coating the device layer with a first photoresist layer; exposing the first photoresist using a first mask; developing the first photoresist layer to form a first pattern on the substrate; coating the substrate with a protection layer; treating the protection layer to cause a change therein where it is in contact with the first photoresist, to render the changed protection layer substantially immune to a subsequent exposure and/or developing step; coating the substrate with a second photoresist layer; exposing the second photoresist layer using a second mask; and developing the second photoresist layer to form a second pattern on the substrate without significantly affecting the first pattern in the first photoresist layer, wherein the first and second patterns together define interspersed features having a spartial frequency greater than that of the features defined in each of the first and second patterns separately. The process has particular utility in defining source, drain and fin features of finFET devices with a smaller feature size than otherwise achievable with the prevailing lithography tools.02-04-2010
20100264492Semiconductor on Insulator Semiconductor Device and Method of Manufacture - A semiconductor on insulator semiconductor device has metal or silicide source and drain contact regions (10-21-2010
20110018064SRAM CELL COMPRISING FINFETS - An SRAM finFET cell includes fins (01-27-2011
20110049639INTEGRATED CIRCUIT MANUFACTURING METHOD AND INTEGRATED CIRCUIT - A method is disclosed of manufacturing an integrated circuit. The method comprises providing a substrate (03-03-2011

Gerben Doornbos, Kessel-L9 BE

Patent application numberDescriptionPublished
20100068859METHOD OF MANUFACTURING A FET GATE - A method of manufacturing a FET gate with a plurality of materials includes depositing a dummy region 03-18-2010

Gerben Doornbos, Leuven BE

Patent application numberDescriptionPublished
20090114950Semiconductor Device and Method of Manufacturing such a Device - The invention relates to a semiconductor device (05-07-2009
20100006945FINFET DRIVE STRENGTH MODIFICATION - A method and circuit in which the drive strength of a FinFET transistor can be selectively modified, and in particular can be selectively reduced, by omitting the LDD extension formation in the source and/or in the drain of the FinFET.01-14-2010

Patent applications by Gerben Doornbos, Leuven BE

Gerben Doornbos, Heverlee BE

Patent application numberDescriptionPublished
20080230824Double Gate Non-Volatile Memory Device and Method of Manufacturing - The present invention relates to a non-volatile memory device on a substrate layer comprising semiconductor source and drain regions, a semiconductor channel region, a charge storage stack and a control gate; the channel region being fin-shaped having two sidewall portions and a top portion, and extending between the source region and the drain region; the charge storage stack being positioned between the source and drain regions and extending over the fin-shaped channel, substantially perpendicularly to the length direction of the fin-shaped channel; the control gate being in contact with the charge storage stack, wherein—an access gate is provided adjacent to one sidewall portion and separated therefrom by an intermediate gate oxide layer, and—the charge storage stack contacts the fin-shaped channel on the other sidewall portion and is separated from the channel by the intermediate gate oxide layer.09-25-2008
20090073746STATIC RANDOM ACCESS MEMORY CELL - A static random access memory means is provided. The SRAM memory means comprises a first pass-gate FET (T03-19-2009
20090209092SEIMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF - A FinFET and methods for its manufacture are provided. The method of the invention provides an elegant process for manufacturing FinFETs with separated gates. It is compatible with a wide range of dielectric materials and gate electrode materials, providing that the gate electrode material(s) can be deposited conformally. Provision of at least one upstanding structure (or “dummy fin”) (08-20-2009

Gerben Doornbos, Kessel BE

Patent application numberDescriptionPublished
20110169101Fin Field Effect Transistor (FINFET) - A Fin FET whose fin (07-14-2011