Patent application number | Description | Published |
20130113358 | LAMP WITH REMOTE LED LIGHT SOURCE AND HEAT DISSIPATING ELEMENTS - LED based lamps and bulbs are disclosed that comprise an elevating element to arrange. LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements. | 05-09-2013 |
20130134445 | COMPLEX PRIMARY OPTICS AND METHODS OF FABRICATION - A light emitter package with primary optic and method of fabricating the same is disclosed that comprises a light emitter disposed on a surface. The package further comprises at least one intermediate element on the surface and at least partially surrounding the light emitter. Furthermore, an encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic. | 05-30-2013 |
20130201670 | MULTIPLE PANEL TROFFER-STYLE FIXTURE - Lighting fixtures are described utilizing a plurality of light sources, or light engines, which are mounted together in a modular fashion in the light fixture opening. In some embodiments, the plurality of light sources can comprise lighting panels that together form the overall fixture light source. The present invention is particularly applicable to troffer-style lighting fixtures that can be arranged with a plurality of lighting panels arranged in the troffer opening to illuminate the space below the troffer. Embodiments of the present invention can also utilize solid state light sources for the lighting panels, with some embodiments utilizing light emitting diodes (LEDs). | 08-08-2013 |
20130341653 | SOLID STATE LIGHTING COMPONENT - An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips. | 12-26-2013 |
20140168989 | SOLID STATE LIGHT SOURCE EMITTING WARM LIGHT WITH HIGH CRI - Solid state light sources, lighting devices and lamps arranged to provide emission with a warm temperature and high CRI. One embodiment of a solid state lighting device according to the present invention comprises a light emitting diode (LED) device capable of emitting light in an emission spectrum. A filter arranged so that at least some light from the LED light source passes through it, with the filter filtering at least some of one or more portions of the light source emission spectrum. The resulting light source light has a different temperature but substantially the same CRI after passing through the filter. | 06-19-2014 |
20140268794 | RARE EARTH OPTICAL ELEMENTS FOR LED LAMP - The present disclosure relates to optical elements and coatings comprising rare-earth element (REE) compounds for light wavelength attenuation of light emitting diode (LED) elements and lamps. More particularly, the present disclosure relates to LED elements and lamps comprising wavelength attenuating elements comprising REE compounds having at least a portion of non-crystalline, non-hydrate form, methods of preparing such elements, and LED elements, LED arrays, LED packages, optical elements, lamps and systems made with same. | 09-18-2014 |
20140268819 | ELECTRICALLY INSULATIVE COATINGS FOR LED LAMP AND ELEMENTS - The present disclosure discloses a method for providing protective coatings onto an energizable LED component coupled to an electrical path. More particularly, the present disclosure relates to LED lamps comprising transparent dielectric coatings and LED lamps and devices made thereby. | 09-18-2014 |
20150129921 | UNIFORM EMISSION LED PACKAGE - An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured. | 05-14-2015 |