| Patent application number | Description | Published |
|---|
| 20090135882 | Sensor Arrangement - A sensor arrangement includes a tube, a measurement head and a holder. The measurement head includes a composite of at least two flexible plastic films and a sensing element arranged between the plastic films. The sensing element is electrically contacted via metallic conductor traces. The measurement head contacts a circumference of the tube and is arranged between the holder and the tube and is pressed by the holder onto the tube. | 05-28-2009 |
| 20090173526 | Electrical Component with a Sensor Element, Method for the Encapsulation of a Sensor Element, and Method for Production of a Plate Arrangement - An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified. | 07-09-2009 |
| 20090184232 | Solar Sensor - The invention pertains to a solar sensor that includes a first modulator that is transparent to electromagnetic waves within a spectrum, and an additional modulator that is at best slightly transparent to the electromagnetic waves within the spectrum. The additional modulator features a belt-shaped region of varying widths that is arranged on the outside of the first modulator and partially covers the first modulator, and a photodetector that receives the electromagnetic waves and is covered by the first modulator. | 07-23-2009 |
| 20100123543 | SENSOR ELEMENT AND PROCESS FOR ASSEMBLING A SENSOR ELEMENT - A high-temperature sensor element includes at least one thermistor element having at least two contact areas and one contacting element including an isolating ceramic base body and at least two conductor lines. The contact areas of the thermistor element are connected to the conductor lines of the contacting element by an electro conductive bridge. A process for assembling a sensor element is also described in which an thermistor element is connected by a temperature resistant junction to a contacting element, and in which the thermistor element and part of the contacting element adjacent to the thermistor element are sealed by a encapsulation compound. | 05-20-2010 |
| 20110042774 | Film Sensor and Method for Producing a Film Sensor - A film sensor having a first carrier film with at least one first conductor track is disclosed. The film sensor has a second carrier film which has at least one second conductor track. At least one electrical component is arranged between the first carrier film and the second carrier film. The electrical component has the properties of a functional ceramic. The electrical component is electrically contact-connected by means of at least one first conductor track and at least one second conductor track. | 02-24-2011 |
| 20110044375 | SENSING DEVICE FOR DETECTING A PHYSICAL QUANTITY AND METHOD FOR PRODUCING SAID SENSOR - A sensing device for detecting a physical quantity includes a molded part and a sensor element in the molded part. The sensor element includes an enclosure that is formed from the molded part and an injection-molding compound. A connection element may be connected to the sensor element. An interface may be between the sensor element and the connection element. | 02-24-2011 |
| 20110051778 | Composite Material for Temperature Measurement, Temperature Sensor Comprising the Composite Material, and Method for Producing the Composite Material and the Temperature Sensor - A composite material | 03-03-2011 |
| 20110170272 | Sensor Device and Method for Manufacture - A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in. | 07-14-2011 |
