| Patent application number | Description | Published |
|---|
| 20090281229 | PORTABLE ELECTRONIC DEVICE COVER COMPRISING RENEWABLE POLYAMIDE RESIN COMPOSITION - The invention discloses a portable electronic device cover comprising renewable thermoplastic polyamide compositions having a carbon content, wherein the carbon content comprises at least 50 percent modern carbon, as determined with ASTM-D6866 method. | 11-12-2009 |
| 20100028580 | HEAT RESISTANT THERMOPLASTIC ARTICLES - Disclosed is a molded or extruded thermoplastic article including a polyamide composition including (a) a polyamide resin (b) 0.1 to 10 weight percent of one or more polyhydric alcohols (c) 0 to 3 weight percent of a co-stabilizer selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof; (d) 0 to less than 10 weight percent of one or more reinforcement agents; and (e) 0 to 50 weight percent polymeric toughener including a reactive functional group and/or a metal salt of a carboxylic acid; and wherein 4 mm test bars prepared from the polyamide composition, and exposed at an test temperature of 150° C. for a test period of about 1000 hours, have, on average, a retention of strain at break of greater than 80 percent compared with a control exposed at the said test temperature for 72 hours. | 02-04-2010 |
| 20100029819 | HEAT RESISTANT MOLDED OR EXTRUDED THERMOPLASTIC ARTICLES - Disclosed is a molded or extruded thermoplastic article having high heat stability over at least 500 hours at least 170° C. including a thermoplastic composition including a thermoplastic resin; one or more polyhydric alcohols having more than two hydroxyl groups and a having a number average molecular weight (M | 02-04-2010 |
| 20100160008 | LOW SINK MARKS AND EXCELLENT SURFACE APPEARANCE REINFORCED POLYAMIDE COMPOSITIONS - The invention relates to resin compositions comprising a) at least one amorphous semi-aromatic polyamide; b) at least two semi-crystalline polyamides, b1) and b2) and c) at least one glass reinforcement agent and shaped articles thereof showing a good balance of properties in terms of good mechanical properties, excellent surface appearance and reduced sink marks. | 06-24-2010 |
| 20100249282 | ENVIRONMENTALLY FRIENDLY ELECTRONIC DEVICE HOUSINGS - The present invention relates to the field of natural fiber reinforced polyamide compositions, particularly it relates to natural fiber reinforced polyamide compositions for manufacturing environmentally friendly electronic device housings that exhibit good mechanical properties. | 09-30-2010 |
| 20100307626 | MULTI-LAYERED COEXTRUDED TUBE - Multi-layered co-extruded tubes are provided that include an outer layer including a first semiaromatic semicrystalline polyamide having a melt temperature of about 240° C. to 280° C., and a thermal stabilizer; and an inner layer including a second semiaromatic semicrystalline polyamide having a glass transition equal to or greater than 100° C. | 12-09-2010 |
