Patent application number | Description | Published |
20090166843 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip including a first conducting element, and a second conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a first location. It further includes a third conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a second location, and a fourth conducting element arranged outside the semiconductor chip. A vertical projection of the fourth conducting element on the chip crosses the first conducting element between the first location and the second location. | 07-02-2009 |
20090273075 | SEMICONDUCTOR DEVICE AND MANUFACTURING OF THE SEMICONDUCTOR DEVICE - A semiconductor device. In one embodiment the device includes a carrier. A first material is deposited on the carrier. The first material has an elastic modulus of less than 100 MPa. A semiconductor chip is placed over the first material. A second material is deposited on the semiconductor chip, the second material being electrically insulating. A metal layer is placed over the second material. | 11-05-2009 |
20100078811 | METHOD OF PRODUCING SEMICONDUCTOR DEVICES - A method of producing semiconductor devices. One embodiment provides producing at least two semiconductor chips. An encapsulation material is applied to the at least two semiconductor chips to form an encapsulation layer. The at least two semiconductor chips are separated from each other to obtain at least two separated semiconductor devices. The outline of each one of the semiconductor devices includes three corners in total or more than four corners. | 04-01-2010 |
20100203676 | CHIP ASSEMBLY - A method of manufacturing an array of semiconductor devices comprises providing a first carrier having multiple chip alignment regions. Multiple chips are placed over the multiple chip alignment regions. Then, alignment of the chips to the multiple chip alignment regions is obtained. The multiple chips are then placed on a second carrier. The first carrier is detached from the multiple chips. An encapsulation material is applied to the multiple chips to form an encapsulated array of semiconductor chips. The second carrier is then detached from the encapsulated array of semiconductor devices. | 08-12-2010 |
20110227204 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip including a first conducting element, and a second conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a first location. It further includes a third conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a second location, and a fourth conducting element arranged outside the semiconductor chip. An encapsulating body encapsulates the semiconductor chip. A vertical projection of the fourth conducting element on the chip crosses the first conducting element between the first location and the second location. At least one of the second conducting element, third conducting element, and fourth conducting element extend over the semiconductor chip and the encapsulating body. | 09-22-2011 |
20110233754 | Encapsulated Semiconductor Chip with External Contact Pads and Manufacturing Method Thereof - A method includes providing a carrier; applying a dielectric layer to the carrier; applying a metal layer to the dielectric layer; placing a first semiconductor chip on the metal layer with contact pads of the first semiconductor chip facing the metal layer; covering the first semiconductor chip with an encapsulation material; and removing the carrier. | 09-29-2011 |
20120322210 | SEMICONDUCTOR DEVICE AND MANUFACTURING OF THE SEMICONDUCTOR DEVICE - A semiconductor device. In one embodiment the device includes a carrier. A first material is deposited on the carrier. The first material has an elastic modulus of less than 100 MPa. A semiconductor chip is placed over the first material. A second material is deposited on the semiconductor chip, the second material being electrically insulating. A metal layer is placed over the second material. | 12-20-2012 |
20150028448 | Chip Package with Embedded Passive Component - A chip package includes an electrically conducting chip carrier and at least one first semiconductor chip attached to the electrically conducting chip carrier. The chip package further includes a passive component. The electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component are embedded in an insulating laminate structure. | 01-29-2015 |
20150028487 | Chip Package with Passives - A chip package device includes an electrically conducting chip carrier, at least one semiconductor chip attached to the electrically conducting chip carrier, and an insulating laminate structure embedding the chip carrier, the at least one semiconductor chip and a passive electronic device. The passive electronic device includes a first structured electrically conducting layer, the first structured electrically conducting layer extending over a surface of the laminate structure. | 01-29-2015 |