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Georg Meyer-Berg
Georg Meyer-Berg, Muenchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100127386 | DEVICE INCLUDING A SEMICONDUCTOR CHIP - A device including a semiconductor chip. One embodiment provides a device, including a metal layer having a first layer face. A semiconductor chip includes a first chip face. The semiconductor chip is electrically coupled to and placed over the metal layer with the first chip face facing the first layer face. An encapsulation material covers the first layer face and the semiconductor chip. At least one through-hole extends from the first layer face through the encapsulation material. The at least one through-hole is accessible from outside the device. | 05-27-2010 |
| 20100133666 | DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS - A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner. | 06-03-2010 |
| 20100207227 | Electronic Device and Method of Manufacturing Same - This application relates to a method of manufacturing a semiconductor device comprising providing a semiconductor wafer with the semiconductor wafer defining a first main face and a second main face opposite to the first main face; forming trenches in the first main face of the semiconductor wafer; forming a dielectric layer over the first main face and in the trenches; thinning the semiconductor wafer by removing semiconductor material from the second main face of the semiconductor wafer after the forming of the dielectric layer; and singulating at least one semiconductor chip from the semiconductor wafer along lines defined by the trenches. | 08-19-2010 |
| 20100230766 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 09-16-2010 |
Georg Meyer-Berg, Munich DE
| Patent application number | Description | Published |
|---|---|---|
| 20090166843 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip including a first conducting element, and a second conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a first location. It further includes a third conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a second location, and a fourth conducting element arranged outside the semiconductor chip. A vertical projection of the fourth conducting element on the chip crosses the first conducting element between the first location and the second location. | 07-02-2009 |
| 20090273075 | SEMICONDUCTOR DEVICE AND MANUFACTURING OF THE SEMICONDUCTOR DEVICE - A semiconductor device. In one embodiment the device includes a carrier. A first material is deposited on the carrier. The first material has an elastic modulus of less than 100 MPa. A semiconductor chip is placed over the first material. A second material is deposited on the semiconductor chip, the second material being electrically insulating. A metal layer is placed over the second material. | 11-05-2009 |
| 20100078811 | METHOD OF PRODUCING SEMICONDUCTOR DEVICES - A method of producing semiconductor devices. One embodiment provides producing at least two semiconductor chips. An encapsulation material is applied to the at least two semiconductor chips to form an encapsulation layer. The at least two semiconductor chips are separated from each other to obtain at least two separated semiconductor devices. The outline of each one of the semiconductor devices includes three corners in total or more than four corners. | 04-01-2010 |
| 20100203676 | CHIP ASSEMBLY - A method of manufacturing an array of semiconductor devices comprises providing a first carrier having multiple chip alignment regions. Multiple chips are placed over the multiple chip alignment regions. Then, alignment of the chips to the multiple chip alignment regions is obtained. The multiple chips are then placed on a second carrier. The first carrier is detached from the multiple chips. An encapsulation material is applied to the multiple chips to form an encapsulated array of semiconductor chips. The second carrier is then detached from the encapsulated array of semiconductor devices. | 08-12-2010 |