| Patent application number | Description | Published |
| 20090229863 | Conductor Carrier and Arrangement Comprising a Conductor Carrier - A conductor carrier includes a base insulating film, a contact insulating film, at least one first printed conductor and one second printed conductor. The contact insulating film includes at least one first recess and one second recess. The printed conductors are embedded between the two insulating films and each forms a first overlapping region with the first or second recess of the contact insulating film. The conductor carrier also includes an insulating region which separates the first printed conductor from the second printed conductor in an insulating manner due to the contact insulating film being less raised than outside the insulating region, and extends between the first and second recesses of the contact insulating film in a meandering manner. A configuration having the conductor carrier is also provided. | 09-17-2009 |
| 20100012355 | METHOD FOR PRODUCING A FLEXIBLE CONDUCTOR CARRIER AND ARRANGEMENT COMPRISING THE FLEXIBLE CONDUCTOR CARRIER - A method for producing a first flexible conductor carrier includes applying at least one conductor track to a base insulating film. A covering layer is applied to the conductor track and the base insulating film in such a way that, in at least one conduction region of the first flexible conductor carrier, the conductor track is completely enclosed by the covering layer and the base insulating film. The base insulating film is free of the conductor track and the covering layer in at least one insulating region. The conductor track is free of the covering layer in at least one contact region of the first flexible conductor carrier. | 01-21-2010 |
| 20110017497 | ELECTRIC DEVICE - An electric device, in particular a mechatronic gear, motor, or brake control device in a motor vehicle, includes an electronic component having at least one electric contact surface for electrically contacting the component. A flexible circuit board with a conduction path structure includes at least one contact pad and conduction lines between two flexible, non-conducting films. A respective contact pad of the flexible circuit board is electrically connected, in particular by welding, to a respective contact surface of the component for creating at least one contact point. A sealing element is disposed on a side of the flexible circuit board opposite the component and an internal space is bounded by a wall. The sealing element is pressed against the flexible circuit board at an edge of the wall so that the edge surrounds at least one of the contact points. | 01-27-2011 |