| Patent application number | Description | Published |
|---|
| 20080251900 | Conductor Frame For an Electronic Component and Method For the Production Thereof - Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab. | 10-16-2008 |
| 20080265266 | Housing for an Optoelectronic Component, Optoelectronic Component and Method for the Production of an Optoelectronic Component - A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type. | 10-30-2008 |
| 20080266884 | Cooling Device for Cooling a Semiconductor Component, in Particular, an Optoelectronic Semiconductor Component - The invention relates to a cooling device for cooling a semiconductor component ( | 10-30-2008 |
| 20080315227 | Light-Emitting Diode Arrangement - A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras. | 12-25-2008 |
| 20090001490 | Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module - An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from one another which is less than or equal to one-and-a-half lateral edge lengths of the semiconductor chips and greater than or equal to 0 μm. In addition, an illumination module comprising such a component is disclosed. | 01-01-2009 |
| 20090026482 | Optoelectronic Component - An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector. | 01-29-2009 |
| 20090103297 | LED ARRAY - In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips. | 04-23-2009 |
| 20090109699 | LIGHT SOURCE - A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone. | 04-30-2009 |
| 20090201698 | Illumination device - An illumination device is specified which has a light source ( | 08-13-2009 |
| 20090212306 | DEVICE FOR AN OPTOELECTRONIC COMPONENT AND MODULE WITH AN OPTOELECTRONIC COMPONENT AND A DEVICE - An apparatus having at least one fixing element is specified, the fixing dement being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element. | 08-27-2009 |
| 20090218584 | Housing for an Optoelectronic Component, Optoelectronic Component, and Method for Producing a Housing for an Optoelectronic Component - A housing for an optoelectronic component is disclosed, having a plastic base body that has a front side with an assembly region for at least one radiation emitting or radiation detecting body, wherein the plastic base body is formed from at least one first plastic component and at least one second plastic component. The second plastic component is disposed on the front side of the plastic base body, and is formed from a material that differs from the first plastic component in at least one optical property, and forms an optically functional region of the plastic base body. Further, a method for producing a housing for an optoelectronic component and a light emitting diode component is disclosed. | 09-03-2009 |
| 20090230420 | Housing Body and Method for Production Thereof - A package body ( | 09-17-2009 |
| 20090297090 | Illumination Unit Comprising Luminescence Diode Chip and Optical Waveguide, Method for Producing an Illumination Unit and LCD Display - An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified. | 12-03-2009 |
| 20100084964 | Arrangement and Method for Generating Mixed Light - At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path. | 04-08-2010 |
| 20100103696 | OPTICAL WAVEGUIDE AND OPTICAL APPARATUS - Described is an optical waveguide having a main direction of extension, at least one radiation entrance face, and a radiation exit face that extends longitudinally to the main direction of extension, wherein at least one radiation entrance face extends transversely to the main direction of extension, and the at least one radiation entrance face has two convexly curved subregions that are connected to each other by a kink-like or concavely shaped indentation. An optical device formed with such a waveguide is also described, as is a display device. | 04-29-2010 |
| 20100270578 | Light Emitting Diode Chip with Overvoltage Protection - A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure. | 10-28-2010 |
| 20100327307 | Optoelectronic Component - An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector. | 12-30-2010 |
| 20110002587 | Housing for an Optoelectronic Component and Arrangement of an Optoelectronic Component in a Housing - A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component. | 01-06-2011 |
| 20110121336 | Arrangement Comprising at Least one Optoelectronics Semiconductor Component - The invention relates to an arrangement comprising at least one optoelectronic semiconductor component ( | 05-26-2011 |
