Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Geoffrion
Bruno Geoffrion, Sunnyvale, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080202588 | METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER - A method and apparatus for delivering gases to a semiconductor processing system are provided. In one embodiment, an apparatus for delivering gases to a semiconductor processing system includes a plurality of gas input and output lines having inlet and outlet ports. Connecting lines couple respective pairs of the gas input and gas output lines. Connecting valves are arranged to control flow through the respective connecting lines. Mass gas flow controllers are arranged to control flow into respective inlet ports. In another embodiment, a method includes providing a manifold having at least a plurality of inlet that may be selectively coupled to at least one of a plurality of outlets, flowing one or more gases through the manifold to a vacuum environment by-passing the processing chamber prior to processing or to a calibration circuit, and flowing the one or more gases into the processing chamber during substrate processing. | 08-28-2008 |
| 20080202609 | METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER - A method and apparatus for delivering gases to a semiconductor processing system are provided. In one embodiment, an apparatus for delivering gases to a semiconductor processing system includes a plurality of gas input and output lines having inlet and outlet ports. Connecting lines couple respective pairs of the gas input and gas output lines. Connecting valves are arranged to control flow through the respective connecting lines. Mass gas flow controllers are arranged to control flow into respective inlet ports. In another embodiment, a method includes providing a manifold having at least a plurality of inlet that may be selectively coupled to at least one of a plurality of outlets, flowing one or more gases through the manifold to a vacuum environment by-passing the processing chamber prior to processing or to a calibration circuit, and flowing the one or more gases into the processing chamber during substrate processing. | 08-28-2008 |
| 20080202610 | METHOD AND APPARATUS FOR CONTROLLING GAS FLOW TO A PROCESSING CHAMBER - A method and apparatus for delivering gases to a semiconductor processing system are provided. In one embodiment, an apparatus for delivering gases to a semiconductor processing system includes a plurality of gas input and output lines having inlet and outlet ports. Connecting lines couple respective pairs of the gas input and gas output lines. Connecting valves are arranged to control flow through the respective connecting lines. Mass gas flow controllers are arranged to control flow into respective inlet ports. In another embodiment, a method includes providing a manifold having at least a plurality of inlet that may be selectively coupled to at least one of a plurality of outlets, flowing one or more gases through the manifold to a vacuum environment by-passing the processing chamber prior to processing or to a calibration circuit, and flowing the one or more gases into the processing chamber during substrate processing. | 08-28-2008 |
Gerald Geoffrion, Gravelbourg CA
| Patent application number | Description | Published |
|---|---|---|
| 20090110523 | Tilt deck vehicle with rear impact guard ramp - A vehicle has a frame supported on wheels. A tilt deck is pivotally attached to a rear of the frame. A deck latch locks the tilt deck to the frame in the transport position. A ramp pivotally attached to the deck moves from an inclined position, where the ramp slopes downward and a rear end of the ramp is a desired distance above the ground, to an aligned position aligned with the deck. A ramp latch locks the ramp to the tilt deck in the inclined position. The apparatus is configured such that when the deck latch is released the rear end of the tilt deck moves down until the rear end of the ramp rests on the ground. Releasing the ramp latch allows the tilt deck to move downward and the ramp can move to the aligned position in response to a downward force exerted on the ramp. | 04-30-2009 |
James W. Geoffrion, Anoka, MN US
| Patent application number | Description | Published |
|---|---|---|
| 20110020502 | CHOCOLATE AND PEANUT BUTTER SLURRY TOPICAL COATING FOR SNACK PRODUCTS - Chocolate flavored compound coating and nut butter based coated snack products are provided whose coatings are resistant to rub-off or oiling out of the nut oil constituent as well as methods for preparing such coated snack products. The present methods include a first step of providing a hot (˜32 to 44° C.), chocolate and creamy nut butter coating slurry. The methods include a second step of applying the hot coating to a food base to provide a liquid coating coated food base in a weight ratio of coating to food base ranging from ˜1:10 to ˜1:1. The methods include a third step of applying sufficient amounts of a dry particulate setting sugar to a quantity of liquid hot slurry coated food base pieces to provide a finished dry stabilized non-sticky powdered coated food base. | 01-27-2011 |
Paul A. Geoffrion, Madison, OH US
| Patent application number | Description | Published |
|---|---|---|
| 20110166953 | DYNAMIC ORDERING SYSTEM AND METHOD FOR MATERIAL USAGE AND LABOR PRICING - A system and method for calculating graphite material usage and labor pricing including the following parameters: category, material, class, dimensions, and quantity. The information is used for improved efficiency via web-based graphite purchasing. The method takes into consideration the additional labor cost when very small dimensions are entered which require special work holding containment. The process requires that the user make a selection for each of the parameters so a validation step can occur ensuring the desired product can be manufactured and an accurate labor charge or quote can be provided. During the calculation step, the labor surface area is applied to the labor cost based on the calculated surface area which is derived from a second degree equation derived by a linear regression curve that is applied to the labor cost based on the calculated surface area. After the calculation step the price each and total quantity price is returned. | 07-07-2011 |