| Patent application number | Description | Published |
|---|
| 20090051930 | METHOD FOR DETECTING SURFACE DEFECTS ON A SUBSTRATE AND DEVICE USING SAID METHOD - A method for detecting surface defects, such as slip line type defects, on a substrate designed to be used in electronics, optoelectronics or analogue, including projection of a pattern of light fringes and dark bands onto the substrate, relative displacement of the substrate relative to the pattern, acquisition of a sequence of at least three images of the pattern reflected by the substrate to a sensor, the images corresponding to displacement of the fringes of the pattern, determination of the gradient of the surface of the substrate using displacements of fringes of the pattern, and determination of the presence of a surface defect on the substrate using variations in the gradient of the surface of the substrate. Another embodiment comprises a device using said method. | 02-26-2009 |
| 20090195786 | DEVICE FOR INSPECTING SEMI-CONDUCTOR WAFERS - Device for inspecting semi-conductor wafers in motion, including a light source for at least one wafer supported by a transfer element, the said light source being configured to transmit two incident beams on to a surface of the wafer, the incident beams being inclined relative to the normal to the surface, the device also including a unit for detecting interference fringes in the beam reflected by the surface of the wafer. | 08-06-2009 |
| 20110128371 | DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS - Semiconductor wafer inspection device comprising a wager transport arm provided with at least one wafer support element, a wafer gripper, the gripper having two distant branches designed to take hold of the opposed edges of the wafer, the gripper being mounted so as to rotate on a shaft in order to be able to rotate the wafer between an approximately horizontal position and an approximately vertical position, and at least two inspection systems placed on one side of the wafer and on the other, in an approximately vertical position symmetrically with respect to the plane passing through the wafer. | 06-02-2011 |
