Patent application number | Description | Published |
20080205495 | RF Transceiver Adapted for Signal Isolators and Proximity Sensors - A transceiver having a transmitting antenna, a receiving antenna, and a substrate having transmitter and receiver dies is disclosed. The transmitter generates an RF signal having a carrier frequency and the receiver detects and amplifies signals of the carrier frequency. The transmitting antenna and/or the receiving antenna includes a first wire antenna loop having a length greater than or equal to one tenth of a wavelength of the carrier frequency. The first wire antenna loop is connected to the transmitter die by a wire bond on a bond pad of the transmitter die. The antenna loop or loops can be encapsulated in an insulating material to protect the loops and fix the loops in space. The transceiver can be configured to operate as a galvanic isolator or a proximity detector. | 08-28-2008 |
20090137130 | Method For Forming A Multiple Layer Passivation Film And A Device Incorporating The Same - A method of forming a multiple layer passivation film on a semiconductor device surface comprises placing a semiconductor device in a chemical vapor deposition reactor, introducing a nitrogen source into the reactor, introducing a carbon source into the reactor, depositing a layer of carbon nitrogen on the semiconductor device surface, introducing a silicon source into the reactor after the carbon source, and depositing a layer of silicon carbon nitrogen on the carbon nitrogen layer. A semiconductor device incorporating the multiple layer passivation film is also described. | 05-28-2009 |
20090243782 | High Voltage Hold-Off Coil Transducer - Disclosed herein are various embodiments of coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided through and across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. A central core layer separates the transmitting and receiving coils, and has no vias disposed therethrough. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. | 10-01-2009 |
20090243783 | Minimizing Electromagnetic Interference in Coil Transducers - Disclosed herein are various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another. | 10-01-2009 |
20100139852 | METHOD FOR HIGH-VOLUME PRODUCTION OF LIGHT EMITTING DIODES WITH ATTACHED LENSES - A method for high-volume production of light emitting diodes with attached lenses involves providing pre-fabricated lenses, wherein the pre-fabricated lenses are held by a common transfer structure, simultaneously attaching the pre-fabricated lenses to respective ones of light emitting diodes, and releasing the pre-fabricated lenses from the common transfer structure. In an embodiment, the light emitting diodes are distributed in a pattern on a common substrate and the common transfer structure is configured to hold the pre-fabricated lenses in a pattern that corresponds to the pattern of the light emitting diodes on the common substrate. Further, to attach the pre-fabricated lenses to the light emitting diodes, the common transfer structure is positioned relative to the common substrate such that the pre-fabricated lenses are aligned with the light emitting diodes. | 06-10-2010 |
20100176660 | GALVANIC ISOLATOR - A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being disposed on a first surface of the substrate and the second portion being disposed a second surface of the substrate. The transmitter receives an input signal and couples a signal derived from the input signal to the first portion. The receiver is connected to the second portion of the circuit element and generates an output signal that is coupled to an external circuit. The galvanic isolator can be economically fabricated on conventional printed circuit board substrates and flexible circuit substrates. | 07-15-2010 |
20100322550 | OPTICAL FINGERPRINT NAVIGATION DEVICE WITH LIGHT GUIDE FILM - An optical finger navigation device. Embodiments of the optical finger navigation device include a light guide film (LGF) including a finger interface surface, a light source in optical communication with the LGF to provide light from the light source to the finger interface surface, a sensor, and a navigation engine. At least a portion of the LGF exhibits total internal reflection (TIR). The sensor detects light from the LGF in response to contact between a finger and the finger interface surface which modifies reflection of light out of the LGF to the sensor. The light detected by the sensor is changed over at least a portion of the sensor in response to the contact between the finger and the finger interface surface. The navigation engine is configured to generate lateral movement information indicative of lateral movement of the finger relative to the sensor, in response to the detected light. | 12-23-2010 |
20110095620 | Galvanic Isolators and Coil Transducers - Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes. | 04-28-2011 |
20110102346 | METHODS AND APPARATUS FOR PROVIDING TOUCH SENSITIVE DISPLAYS - Methods and apparatus provide for a touch sensitive display, which may include: a display layer; a cover glass layer formed from ion exchanged glass; and an optional touch glass layer, where, either on a first side of the touch glass or on a first side of the cover glass, a grid of electrode traces is disposed, which is sensitive to distortions of a local electrostatic field caused by a touching event, and the grid may be positioned between the display layer and the cover glass layer. | 05-05-2011 |
20110141048 | OPTICAL FINGERPRINT NAVIGATION DEVICE WITH LIGHT GUIDE FILM - Embodiments of a finger navigation device are described. In one embodiment, the finger navigation device includes a light guide film (LGF), a light source, a sensor, and a navigation engine. At least a portion of the LGF exhibits total internal reflection (TIR) and the light source is in optical communication with the LGF and configured to inject light into the LGF. The sensor is configured to detect light that exits from the LGF after being reflected from a finger that is proximate the LGF and the navigation engine is configured to generate lateral movement information, which is indicative of lateral movement of the finger relative to the sensor, in response to light that is reflected from the finger and detected by the sensor. Other embodiments of the finger navigation device are also described. | 06-16-2011 |
20130084043 | FERRULE-BASED OPTICAL COMPONENT ASSEMBLIES - In one embodiment, an optical transceiver assembly includes an active component substrate, first and second fiber securing devices, and a holder device coupled to the active component substrate. The holder device includes an active optical component recess that encloses a first and second active optical component of the active component assembly, and first and second fiber-locating holes having an engagement feature at the active optical component recess such that an end of first and second fibers inserted into the first and second fiber-locating holes are aligned with the first and second active optical components along the x-, y-, and z-axes. In another embodiment, an optical component assembly includes an active component substrate having a solder ring, a fiber securing device, and an active optical component on the active component substrate. The fiber securing device is aligned with the active optical component by the solder ring. | 04-04-2013 |
20130084044 | OPTICAL COMPONENT ASSEMBLIES - In one embodiment, an optical component assembly includes an active component substrate, an active component positioned on the active component substrate, a collar and a fiber securing device. The collar is coupled to the active component substrate, and the fiber securing device is configured to mate with the collar such that a signal surface of the fiber securing device is located at a predetermined distance from the surface of the active component substrate, and a signal aperture of the fiber securing device is substantially located at a predetermined optical coupling location with respect to the active optical component. In another embodiment, an optical transceiver assembly includes an optically transmissive fiber securing device coupled to and aligned with a surface of the active component substrate using first and second alignment apertures that are aligned with first and second alignment locations of the active component substrate, respectively. | 04-04-2013 |
20130259431 | TOTAL-INTERNAL-REFLECTION FIBER OPTIC INTERFACE MODULES AND ASSEMBLIES - A fiber optic interface module and assemblies using same are disclosed, wherein the modules have at least one lens that defines a folded optical path through the module body. The module operably supports one or more optical fibers adjacent an end wall. The module includes one or more lenses formed therein for coupling light from one or more light sources to the corresponding one or more optical fibers. The one or more lenses each have a folded optical path formed by total internal reflection within the module body. The one or more lenses each include a lens surface configured to define a back focus that resides within a corresponding one of the optical fibers. | 10-03-2013 |
20130269867 | OPTICAL FINGERPRINT NAVIGATION DEVICE WITH LIGHT GUIDE FILM - An optical finger navigation device. Embodiments of the optical finger navigation device include a light guide film (LGF) including a finger interface surface, a light source in optical communication with the LGF to provide light from the light source to the finger interface surface, a sensor, and a navigation engine. At least a portion of the LGF exhibits total internal reflection (TIR). The sensor detects light from the LGF in response to contact between a finger and the finger interface surface which modifies reflection of light out of the LGF to the sensor. The light detected by the sensor is changed over at least a portion of the sensor in response to the contact between the finger and the finger interface surface. The navigation engine is configured to generate lateral movement information indicative of lateral movement of the finger relative to the sensor, in response to the detected light. | 10-17-2013 |