Patent application number | Description | Published |
20090258491 | Method of inhibiting background plating - Methods of inhibiting background plating on semiconductor substrates using oxidizing agents are disclosed. | 10-15-2009 |
20100003817 | Method of light induced plating on semiconductors - Methods of light induced plating of nickel onto semiconductors are disclosed. The methods involve applying light at an initial intensity for a limited amount of time followed by reducing the intensity of the light for the remainder of the plating period to deposit nickel on a semiconductor. | 01-07-2010 |
20110065274 | ENHANCED METHOD OF FORMING NICKEL SILICIDES - Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments. | 03-17-2011 |
20120184098 | ELECTROCHEMICAL ETCHING OF SEMICONDUCTORS - Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated. | 07-19-2012 |
20130203252 | ACTIVATION PROCESS TO IMPROVE METAL ADHESION - Native oxide removing and activating solutions containing fluoride ions and organic acids are used in the formation of metal layers on semiconductor wafers. The method may also be used in the formation of silicides and for preparing the metal silicides for additional metal plating and build-up. The solutions and methods may be used in the manufacture of photovoltaic devices and other electronic devices and components. | 08-08-2013 |
20130240368 | LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD - Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit. | 09-19-2013 |
20130264214 | METAL PLATING FOR PH SENSITIVE APPLICATIONS - Metal electroplating processes are used in pH sensitive applications to plate metal layers on semiconductors. The semiconductors may be used in the manufacture of photovoltaic devices and solar cells. | 10-10-2013 |
20130288476 | ELECTROCHEMICAL ETCHING OF SEMICONDUCTORS - Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated. | 10-31-2013 |
20140174936 | PLATING OF COPPER ON SEMICONDUCTORS - Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices. | 06-26-2014 |