Garter
Barb Garter, Shelbyville, MI US
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20110033577 | FILLED SNACK PRODUCT WITH SPACED FILLING LINES AND METHOD OF MAKING THE SAME - A filled snack product includes a first sheet having a first surface. A plurality of filling lines are disposed upon the first surface of the first sheet. Each of the plurality of filling lines are spaced to define a void between each of the adjacent filling lines. A second sheet is disposed over the first sheet and secured to at least a portion of the first sheet to sandwich the plurality of spaced filling lines between the first and second sheets. A plurality of docking holes are disposed upon the first and second sheets. The plurality of docking holes and the plurality of spaced filling lines allow for the pinning of the first and second sheets at the voids disposed between the spaced filling lines and further for the release to steam and/or gas from the filled snack product during heating to minimize puffing of the filled snack product. | 02-10-2011 |
Barb Garter, Shelbyille, MI US
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20160058018 | Filled Snack Product with Spaced Filling Lines and Method of Making the Same - A filled snack product includes a first sheet having a first surface. A plurality of filling lines are disposed upon the first surface of the first sheet. Each of the plurality of filling lines are spaced to define a void between each of the adjacent filling lines. A second sheet is disposed over the first sheet and secured to at least a portion of the first sheet to sandwich the plurality of spaced filling lines between the first and second sheets. A plurality of docking holes are disposed upon the first and second sheets. The plurality of docking holes and the plurality of spaced filling lines allow for the pinning of the first and second sheets at the voids disposed between the spaced filling lines and further for the release to steam and/or gas from the filled snack product during heating to minimize puffing of the filled snack product. | 03-03-2016 |
Barbara Garter, Shelbyville, MI US
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20110039004 | LOW WATER ACTIVITY FOOD BINDER AND METHODS RELATED THERETO - The present invention provides a binder syrup comprising polydextrose, crystalline fructose and glycerin. The binder syrup has a low water activity of less than 0.55 and provides a significant amount of fiber. The binder syrup is disposed on particulates, such as whole grains, rolled oats, and fruit pieces, to form food products, such as ready-to-eat cereals and granola bars. The binder syrup also provides a desirable taste and maintains a chewy texture when used in the food products. | 02-17-2011 |
Michael James Garter, Lebanon, OH US
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20120193608 | FRONTSIDE-ILLUMINATED INVERTED QUANTUM WELL INFRARED PHOTODETECTOR DEVICES AND METHODS OF FABRICATING THE SAME - A method of fabricating a frontside-illuminated inverted quantum well infrared photodetector may include providing a quantum well wafer having a bulk substrate layer and a quantum material layer, wherein the quantum material layer includes a plurality of alternating quantum well layers and barrier layers epitaxially grown on the bulk substrate layer. The method further includes applying at least one frontside common electrical contact to a frontside of the quantum well wafer, bonding a transparent substrate to the frontside of the quantum well wafer, thinning the bulk substrate layer of the quantum well wafer, and etching the quantum material layer to form quantum well facets that define at least one pyramidal quantum well stack. A backside electrical contact may be applied to the pyramidal quantum well stack. In one embodiment, a plurality of quantum well stacks is bonded to a read-out integrated circuit of a focal plane array. | 08-02-2012 |
20120326124 | FRONTSIDE-ILLUMINATED INVERTED QUANTUM WELL INFRARED PHOTODETECTOR DEVICES - A method of fabricating a frontside-illuminated inverted quantum well infrared photodetector may include providing a quantum well wafer having a bulk substrate layer and a quantum material layer, wherein the quantum material layer includes a plurality of alternating quantum well layers and barrier layers epitaxially grown on the bulk substrate layer. The method further includes applying at least one frontside common electrical contact to a frontside of the quantum well wafer, bonding a transparent substrate to the frontside of the quantum well wafer, thinning the bulk substrate layer of the quantum well wafer, and etching the quantum material layer to form quantum well facets that define at least one pyramidal quantum well stack. A backside electrical contact may be applied to the pyramidal quantum well stack. In one embodiment, a plurality of quantum well stacks is bonded to a read-out integrated circuit of a focal plane array. | 12-27-2012 |