Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Garant
Herve I. Garant, Belmont, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20100285534 | COMBINED THERMOCHEMICAL PRETREATMENT AND REFINING OF LIGNOCELLULOSIC BIOMASS - One aspect of the present invention relates to a method of processing lignocellulosic material, comprising initial steam pretreatment to give pretreated lignocellulosic material with an average particle size, followed by refining to give refined lignocellulosic material with an average particle size, wherein the average particle of the pretreated lignocellulosic material is greater than the average particle size of the refined lignocellulosic material. In certain embodiments, the lignocellulosic material is selected from the group consisting of grass, switch grass, cord grass, rye grass, reed canary grass, miscanthus, sugar-processing residues, sugar cane bagasse, agricultural wastes, rice straw, rice hulls, barley straw, corn cobs, cereal straw, wheat straw, canola straw, oat straw, oat hulls, corn fiber, stover, soybean stover, corn stover, forestry wastes, recycled wood pulp fiber, sawdust, hardwood, and softwood. | 11-11-2010 |
John J. Garant, Hopewell Junction, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20110049759 | VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING - A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location. | 03-03-2011 |
John J. Garant, Poughkeepsie, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20090020590 | PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE - A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads. | 01-22-2009 |
| 20090242614 | METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD - A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position. | 10-01-2009 |
John Joseph Garant, Poughkeepsie, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20100084437 | Dispensing Assembly with a Controlled Gas Environment - Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material. | 04-08-2010 |
| 20100084438 | Dispensing Assembly with an Injector Controlled Gas Environment - An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas. | 04-08-2010 |