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Gamini Ananda Vedage, Bethlehem US

Gamini Ananda Vedage, Bethlehem, PA US

Patent application numberDescriptionPublished
20080227928Polyamide Curing Agent Compositions - The present invention provides polyamide curing agent compositions comprising the reaction products of (1) multifunctional amines of structure 109-18-2008
20080275191New Amine Composition - The present invention provides novel polymeric amine compositions employing amine compounds having multiple tertiary amine groups. Methods of making these new compositions are also disclosed. Amine compositions and amine-epoxy compositions employing the polymeric amine compositions of the present invention are also provided.11-06-2008
20090018278Alkylated Aminopropylated Methylene-Di-(Cyclohexylamine) And Uses Thereof - The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated methylene-di-(cyclohexylamine) compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.01-15-2009
20090023846Benzylated Polyalkylene Polyamines And Uses Thereof - The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.01-22-2009
20090029175Alkylated Polyalkylene Polyamines And Uses Thereof - The present invention provides curing agent compositions comprising alkylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.01-29-2009
20090030125Benzylated Aminopropylated Ethylenediamines And Uses Thereof - The present invention provides epoxy curing agent compositions comprising benzylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.01-29-2009
20090030159Alkylated Aminopropylated Ethylenediamines And Uses Thereof - The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.01-29-2009
20090163676Benzylated Polyalkylene Polyamines And Uses Thereof - The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.06-25-2009
20090259003Curing Agent For Low Temperature Cure Applications - The present invention provides Mannich base derivatives of N,N′-dimethyl secondary diamine polymers including Mannich base derivatives of methylamine-terminated poly-(N-methylazetidine) and Mannich base derivatives of methylamine-terminated poly-(N-methylazacycloheptane). Amine curing agent compositions and amine-epoxy compositions containing Mannich base derivatives of N,N′-dimethyl secondary diamine polymers are also disclosed.10-15-2009
20100048827CURING AGENT FOR LOW TEMPERATURE CURE APPLICATIONS - The present invention discloses both amine compositions and amine-epoxy compositions containing N,N′-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N′-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.02-25-2010
20100048832Alkylated 4-Aminobenzyl-4-Aminocyclohexane - Alkylated 4-aminobenzyl-4-aminocyclohexane curing agents that can be used, for example, in polyurea, polyurethane and urea/urethane hybrid elastomeric, epoxy resin, epoxy adhesive, epoxy composites and/or coating compositions and polymeric compositions comprising these curing agents are provided herein. In one embodiment, the curing agent comprises a compound having the following Formula I:02-25-2010
20100048833Mixed Polycycloaliphatic Amines (MPCA) And MPCA Alkylates - Mixed polycycloaliphatic amines (MPCA) and alkylates thereof (MPCA alkylates), methods for making mixed polycycloaliphatic MPCA amines and MPCA alkylates thereof, as well as polymeric compositions, such as spray-applied polyurea coating compositions, comprising said mixed amines MPCA and MPCA alkylates thereof are described herein. In one embodiment, the polymeric composition comprises an isocyanate component, and a resin component comprising an organic compound having the following Formula I:02-25-2010
20100048954CURING AGENT FOR LOW TEMPERATURE CURE APPLICATIONS - The present invention discloses both amine compositions and amine-epoxy compositions containing N,N′-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N′-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.02-25-2010
20100119838Curing Agent For Low Temperature Cure Applications - The present invention provides N,N′-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N′-dimethyl secondary diamine polymers are also disclosed.05-13-2010
20100280192Fast Curable Epoxy Compositions Containing Imidazole- And 1-(Aminoalkyl) Imidazole-Isocyanate Adducts - Epoxy curing agents comprising imidazole-isocyanate adducts, including 1-(aminoalkyl) imidazole-isocyanate adducts and especially 1-(3-aminopropyl) imidazole-isocyanate adducts, and their use as curing agents in heat curable one-component epoxy resin compositions.11-04-2010
20100280211FAST CURABLE EPOXY COMPOSITIONS CONTAINING IMIDAZOLE-AND 1 -(AMINOALKYL) IMIDAZOLE-ISOCYANATE ADDUCTS - Epoxy curing agents comprising imidazole-isocyanate adducts, including 1-(aminoalkyl)imidazole-isocyanate adducts and especially 1-(3-aminopropyl)imidazole-isocyanate adducts, and their use as curing agents in heat curable one-component epoxy resin compositions. Epoxy curing agents comprising imidazole-isocyanate adducts comprising the reaction product of at least one imidazole, at least one polyisocyanate and at least one diamine.11-04-2010
20110065837LOW TEMPERATURE CURABLE EPOXY COMPOSITIONS CONTAINING PHENOLIC-BLOCKED UREA CURATIVES - A heat curable epoxy composition comprising the contact product of an epoxy resin, an epoxy curing agent and an accelerator for the epoxy curing agent, the curing agent or the accelerator comprising the reaction product of (a) a phenolic resin and (b) a urea compound which is the reaction product of an isocyanate and an alkylated polyalkylenepolyamine having one primary or secondary amine and at least two tertiary amines of the general formula:03-17-2011
20110065958Low Temperature Curable Epoxy Compositions Containing Urea Curatives - A heat curable epoxy composition comprising the contact product of an epoxy resin, an epoxy curing agent and an accelerator for the epoxy curing agent, the curing agent or the accelerator comprising a urea compound which is the reaction product of an isocyanate and an alkylated polyalkylenepolyamine having one primary or secondary amine and at least two tertiary amines of the general formula:03-17-2011

Patent applications by Gamini Ananda Vedage, Bethlehem, PA US