| Patent application number | Description | Published |
|---|
| 20080253087 | THERMAL MANAGEMENT SYSTEM FOR AN ELECTRONIC DEVICE - A configurable multiple inlet thermal management device, such as an air-mover or passive heat sink, for electronic devices. The thermal management device is arranged on a computing device or on a component of a computing device or similar, such as an expansion module or alike, so that incoming air flow decreases the temperature of the heat producing components. In order to provide best possible air flow the air-mover comprises blade design that pressurizes the air flow from at least one side of the air-mover component. The air-mover includes removable covers for providing the openings required for intake air from the desired direction and for providing a fan wind. Depending on the application the openings may be permanently opened or closed. The intake air flow is then directed in form of fan wind towards the heat producing elements. | 10-16-2008 |
| 20090140417 | Holistic Thermal Management System for a Semiconductor Chip - Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to the semiconductor chip. A vapor chamber is coupled to the diamond heat spreader. | 06-04-2009 |
| 20100014251 | Multidimensional Thermal Management Device for an Integrated Circuit Chip - The present invention generally relates to a multidimensional thermal management device for an integrated circuit chip, and more particularly, to thermal management devices with a synthetic jet ejector adapted to operate along a hollow fin and a fin with cross-flow heat exchanger tubes. A thermal management device | 01-21-2010 |
| 20100030500 | Regulation of Power Consumption for Application-Specific Integrated Circuits - Provided are systems, methods, and computer program products for regulating power consumption in application-specific integrated circuits (ASICs)—such as, for example, a graphics processing unit. In such a method, a value of a leakage current of an ASIC is received from computer-readable information contained in the ASIC. One or more operational parameters of the ASIC—such as, for example, a supply voltage to the ASIC, a engine speed of the ASIC, and/or a fan speed of a fan used to cool the ASIC—are adjusted based on the value of the leakage current of the ASIC. Optionally, the one or more operational parameters may also be adjusted based on a type of application running on the ASIC. In addition, a supply voltage to the ASIC may (optionally) be shut off if the temperature of the ASIC exceeds a threshold. | 02-04-2010 |
| 20100103619 | Interchangeable Heat Exchanger for a Circuit Board - Various circuit board fluid cooling systems and methods of using the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first member to a circuit board where the first member has a first opening with a first internal footprint. A heat exchanger is removably coupled to the first member to transfer heat from at least one component of the circuit board. The heat exchanger has an external footprint adapted so that at least a portion of the heat exchanger fits in the first opening. A plate is coupled to the circuit board to transfer heat from at least one component of the circuit board. A fluid supply line and a fluid return line are coupled to the heat exchanger such that one of the fluid supply line and the fluid return line is thermal contact with the plate to transfer heat therefrom. | 04-29-2010 |
| 20100230805 | MULTI-DIE SEMICONDUCTOR PACKAGE WITH HEAT SPREADER - A semiconductor device includes first and second stacked semiconductor dies on a substrate. A lid having a plurality of fins extending downwardly into the cavity is mounted on the substrate to encapsulate the semiconductor dies. At least some of the fins are longer than other ones of said fins. The lid is attached to the substrate, with the longer fins extending downwardly above a region of the substrate not occupied by the first die. The shorter fins extend downwardly above a region of said first die not covered by said second die. A thermal interface material fills the remainder of the cavity and is in thermal communication with both dies, the substrate and the fins. The lid may be molded from metal. The lid may be bonded to the topmost die, using a thermal bonding material that may be liquid metal, or the like. | 09-16-2010 |
| 20100237496 | Thermal Interface Material with Support Structure - Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader. | 09-23-2010 |
| 20100314093 | VARIABLE HEAT EXCHANGER - Various apparatus and methods for thermally managing a heat generating device. In one aspect, a method of thermally managing a heat generating device is provided that includes placing a heat exchanger in thermal communication with the heat generating device. The heat exchanger has an interior space. A membrane is in the interior space between a first chamber and a second chamber. The membrane has a gas impermeable portion and at least one gas permeable portion to enable vapor bubbles in the second chamber to pass through the membrane at the at least one gas permeable portion and into the first chamber. A liquid is moved through the second chamber. | 12-16-2010 |
| 20100327431 | Semiconductor Chip Thermal Interface Structures - Various thermal interface structures and methods are disclosed. In one aspect, a method of manufacturing is provided. The method includes providing plural carbon nanotubes in a thermal interface structure. The thermal interface structure is soldered to a side of a semiconductor chip. In another aspect, an apparatus is provided. The apparatus includes a thermal interface structure that has plural carbon nanotubes. A semiconductor chip is soldered to the thermal interface structure. | 12-30-2010 |
| 20100328887 | Heat Sink for a Circuit Device - Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell. | 12-30-2010 |
