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Gaff

Bradley L. Gaff, Portland, OR US

Patent application numberDescriptionPublished
20100022334INJECTION-MOLDED BALL BAT - A bat and a method of making a bat for use in sports, such as baseball. The bat includes a one-piece, hollow bat frame formed by injection molding a durable polymer, such as acrylonitrile butadiene styrene. The bat frame includes a barrel portion, an intermediate portion, and a handle portion, with at least one of the portions having a polygonal cross-section on an interior surface of the bat.01-28-2010

Patent applications by Bradley L. Gaff, Portland, OR US

Bradley L. Gaff, Woodridge, IL US

Patent application numberDescriptionPublished
20110118062AMERICAN-STYLE FOOTBALL INCLUDING IMPROVED BLADDER CONSTRUCTION FOR MOUNTING OF ELECTRONICS - An American style football including an inflatable bladder, a cover surrounding the bladder, and an electronic circuit. The bladder includes first and second side walls defining an expandable cavity and a cross-member configured to extend through the expandable cavity. The side walls and cross-member are coupled together to form a bladder seam. The electronic circuit is coupled to the cross-member and produces a signal to enable the position and movement of the football to be monitored during use.05-19-2011
20110118064AMERICAN-STYLE FOOTBALL INCLUDING ELECTRONICS COUPLED TO THE BLADDER - An American style football including an inflatable bladder, a cover surrounding the bladder, a lacing coupled to the at least one cover panel, and an electronic circuit. The electronic circuit is coupled to the bladder. The electronic circuit includes at least one sensor and the electronic circuit being configured to produce a signal to enable the position and movement of the football to be monitored during use.05-19-2011
20110118065AMERICAN-STYLE FOOTBALL INCLUDING ELECTRONICS - An American style football including an inflatable bladder, at least two cover panels surrounding the bladder, a lacing coupled to the at least one cover panel, and an electronic circuit. Each of the cover panels includes an outermost layer and a lining. The electronic circuit is coupled to at least one of the cover panels. The electronic circuit includes at least one sensor. The electronic circuit is configured to produce a signal to enable the position and movement of the football to be monitored during use.05-19-2011

Keith Gaff, Fremont, CA US

Patent application numberDescriptionPublished
20110092072HEATING PLATE WITH PLANAR HEATING ZONES FOR SEMICONDUCTOR PROCESSING - A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.04-21-2011

Keith William Gaff, Fremont, CA US

Patent application numberDescriptionPublished
20100108261LOWER ELECTRODE ASSEMBLY OF PLASMA PROCESSING CHAMBER - A lower electrode assembly for use in a plasma processing chamber comprises a metal base and upper and lower edge rings. The metal base comprises metal plates brazed together and forming a brazed line on a lower side surface of the base, an edge ring support surface extending horizontally inwardly from the lower side surface and an upper side surface above the edge ring support surface. The upper edge ring comprises a lower surface mounted on the edge ring support surface and the lower edge ring surrounds the lower side surface of the base with a gap between opposed surfaces of the upper and lower edge rings and between the lower edge ring and the outer periphery of the base. The gap has an aspect ratio of total gap length to average gap width sufficient to impede arcing at the location of the braze line.05-06-2010
20100309604Method and Apparatus for Chuck Thermal Calibration - Wafer temperature is measured as a function of time following removal of a heat source to which the wafer is exposed. During the wafer temperature measurements, a gas is supplied at a substantially constant pressure at an interface between the wafer and a chuck upon which the wafer is supported. A chuck thermal characterization parameter value corresponding to the applied gas pressure is determined from the measured wafer temperature as a function of time. Wafer temperatures are measured for a number of applied gas pressures to generate a set of chuck thermal characterization parameter values as a function of gas pressure. A thermal calibration curve for the chuck is generated from the set of measured chuck thermal characterization parameter values and the corresponding gas pressures. The thermal calibration curve for the chuck can be used to tune the gas pressure to obtain a particular wafer temperature during a fabrication process.12-09-2010
20110143462ADJUSTING SUBSTRATE TEMPERATURE TO IMPROVE CD UNIFORMITY - A plasma etching system having a substrate support assembly with multiple independently controllable heater zones. The plasma etching system is configured to control etching temperature of predetermined locations so that pre-etch and/or post-etch non-uniformity of critical device parameters can be compensated for.06-16-2011

Patent applications by Keith William Gaff, Fremont, CA US