Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Gabriel M.
Gabriel M. Karamanis, Stamford, CT US
| Patent application number | Description | Published |
|---|---|---|
| 20080230169 | Housing created from high strength expanded thermoformable honeycomb structures with cementitious reinforcement - A method for producing an engineered building material comprising at least a first and second cementitious reinforced expanded honeycomb product, the method comprising: affixing at least one end of the first cementitious reinforced expanded honeycomb product to at least one end of the second cementitious reinforced expanded honeycomb product via a coupler device. | 09-25-2008 |
| 20080230962 | Method of creating high strength expanded thermoformable honeycomb structures with cementitious reinforcement - A method for producing expanded honeycomb materials with cementitious reinforcement, in a composite structure having significant structural rigidity and strength, reduction in overall weight and ease of installation comprising the steps of: placing an expanded thermoformable honeycomb in a mold or suitable mold; partially or completely filling either or both sides of the honeycomb with cementitious material; vibrating the cementitious material within the structure to eliminate any air pockets or voids; leveling the cementitious material and allowing it to cure at room or elevated temperature; removing the composite structures from the mold. | 09-25-2008 |
Gabriel M. Rebeiz, San Diego, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20120007650 | MULTIPLE E-PROBE WAVEGUIDE POWER COMBINER/DIVIDER - A power combiner/divider having a waveguide, a plurality of amplifiers disposed on a supporting structure, a plurality of probes, each one having a first end electrically coupled to an output of a corresponding one of the plurality of amplifiers and a second end projecting outwardly from the supporting structure and into the waveguide. The probes are disposed in a common region of the waveguide. The region has a common electric field maximum within the waveguide. A first portion of the probes proximate the sidewalls have lengths different from a second portion of the probes disposed in a region distal from the sidewalls of the waveguide. The waveguide is supported by the support structure. The power combiner is a monolithic microwave integrated circuit structure. | 01-12-2012 |
Gabriel M. Trionfi, San Carlos, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080210686 | Multi-Component Packaging System and Apparatus - A multi-component packaging system includes a lower containing assembly, an upper containing assembly, and a cover. The lower containing assembly defines an interior cavity that is adapted to receive a first food component. The upper containing assembly defines an interior that is adapted to receive a second food component. The upper containing assembly is adapted for engagement with the lower containing assembly. The cover is engaged with at least one of the lower containing assembly and the upper containing assembly. The cover includes a passage portion that defines a plurality of apertures. | 09-04-2008 |
| 20100015293 | MULTI-COMPONENT PACKAGING SYSTEM AND APPARATUS - A multi-component packaging system includes a lower containing assembly, an upper containing assembly, and a cover. The lower containing assembly defines an interior cavity that is adapted to receive a first food component. The upper containing assembly defines an interior that is adapted to receive a second food component. The upper containing assembly is adapted for engagement with the lower containing assembly. The cover is engaged with at least one of the lower containing assembly and the upper containing assembly. The cover includes a passage portion that defines a plurality of apertures. Anti-foam compositions for use in the multi-component packaging system and a multi-component packaging system containing the anti-foam compositions disposed on one or more interior surfaces of the packaging system are also disclosed. | 01-21-2010 |
Gabriel M. Vieth, Knoxville, TN US
| Patent application number | Description | Published |
|---|---|---|
| 20080271570 | METHOD TO PREPARE NANOPARTICLES SUSPENSION IN IONIC LIQUIDS - A method to preparing suspensions of metal or metal alloy nanoparticles in an ionic liquid involves the physical vapor deposition of a metal or a mixture of metals onto an ionic liquid. The method can be modified by the introduction of a reagent during or after formation of the suspension to yield nanoparticles of a metal salt. The nanoparticles can be isolated from the suspension by the thermal decomposition of the ionic liquid under conditions where the decomposition products are gaseous. | 11-06-2008 |
| 20080274344 | METHOD TO PREPARE NANOPARTICLES ON POROUS MEDIUMS - A method to prepare porous medium decorated with nanoparticles involves contacting a suspension of nanoparticles in an ionic liquid with a porous medium such that the particles diffuse into the pores of the medium followed by heating the resulting composition to a temperature equal to or greater than the thermal decomposition temperature of the ionic liquid resulting in the removal of the liquid portion of the suspension. The nanoparticles can be a metal, an alloy, or a metal compound. The resulting compositions can be used as catalysts, sensors, or separators. | 11-06-2008 |