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Furman, NY

Anthony Furman, Niskayuna, NY US

Patent application numberDescriptionPublished
20130055711METHOD AND SYSTEM FOR A TURBOCHARGED ENGINE - Methods and systems are provided for operating a turbocharged engine. An engine system comprises a turbocharger, a bypass path, and a turbo-compound unit. The turbocharger may include a turbine mechanically coupled to a compressor. The turbo-compound unit may include a turbine mechanically coupled to a load, such as a generator. The turbo-compound unit may be coupled in a bypass path around the turbocharger turbine. In this manner, thermodynamic energy flowing through the bypass path may be harvested to increase the engine-operating efficiency. Further, gas flow through the bypass path may be adjusted to potentially improve the transient response of the turbocharger.03-07-2013

Anthony Holmes Furman, Scotia, NY US

Patent application numberDescriptionPublished
20090158733FLUIDIC VALVE WATER DRAIN - A turbocharger is disclosed that includes a compressor, a turbine connected to the compressor by a mechanical shaft, and a fluidic drain valve in flow communication with an air bleed port of the compressor and an exhaust plenum to drain water accumulated inside the turbocharger such that water accumulated in the exhaust plenum is drained during shutdown when no air from the bleed port flows through the fluidic drain valve.06-25-2009
20100143104OPTIMIZED TURBOCHARGER BEARING SYSTEM - A turbocharger system, in certain embodiments, includes a compressor, a turbine, a shaft of common diameter coupling the compressor to the turbine, and a first fluid film bearing disposed about the shaft at a compressor end portion of the shaft. The system also includes a second fluid film fixed pad bearing disposed about the shaft at a turbine end portion of the shaft, wherein the first and second fluid film fixed pad bearings have different clearance ratios, effective lengths, or both, relative to one another. The system, in some embodiments, includes a compressor fluid film fixed pad bearing and a turbine fluid film fixed pad bearing, wherein the compressor and turbine fluid film fixed pad bearings have different clearance ratios and effective lengths, relative to one another.06-10-2010
20100178164SYSTEM AND METHOD FOR TURBOCHARGING AN ENGINE - A turbocharger system, in certain embodiments, includes a compressor, a turbine, a shaft coupling the compressor to the turbine, and a turbo casing configured to improve pressure recovery, wherein the turbo casing includes a non symmetrical geometry configured to improve flow towards an exhaust outlet.07-15-2010
20120036823METHODS AND SYSTEMS FOR MONITORING A SEAL ASSEMBLY - A method for monitoring functionality of a seal assembly within an injector feed assembly is described. The method includes providing a buffer fluid to the seal assembly, measuring at least one of a pressure and a flow rate of the buffer fluid, and determining a functionality of the seal assembly based at least partially on the at least one of a pressure and a flow rate of the buffer fluid.02-16-2012

Patent applications by Anthony Holmes Furman, Scotia, NY US

Bruce Furman, Poughquag, NY US

Patent application numberDescriptionPublished
20080265404Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling - Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.10-30-2008

Bruce K. Furman, Beacon, NY US

Patent application numberDescriptionPublished
20090032774DEAGGREGATED ELECTRICALLY CONDUCTIVE POLYMERS AND PRECURSORS THEREOF - Deaggregated substituted and unsubstituted polyparaphenylenes, polyparaphenylevevinyles, polyanilines, polyazines, polythiophenes, poly-p-phenylene sulfides, polyfuranes, polypyrroles, polyselenophene, polyacetylenes formed from soluble precursors and combinations thereof and copolymers thereof and methods of fabrication are described. The deaggregated polymer molecules when subsequently doped show higher electrical conductivity. Agents such as lithium chloride, m-cresol and nonylphenol are used to deaggregate the polymer molecules. The deaggregating agents can be added prior to or during doping the molecules.02-05-2009

Bruce K. Furman, Saratoga Springs, NY US

Patent application numberDescriptionPublished
20090316360COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.12-24-2009
20100142150COOLING APPARATUS WITH COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED - A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.06-10-2010

Bruce K. Furman, Pouquag, NY US

Patent application numberDescriptionPublished
20080268574HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS - A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.10-30-2008
20090140404HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS - A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.06-04-2009

Bruce Kenneth Furman, Poughquag, NY US

Patent application numberDescriptionPublished
20080280416Techniques for Layer Transfer Processing - Techniques for the fabrication of semiconductor devices are provided. In one aspect, a layer transfer structure is provided. The layer transfer structure comprises a carrier substrate having a porous region with a tuned porosity in combination with an implanted species defining a separation plane therein. In another aspect, a method of forming a layer transfer structure is provided. In yet another aspect, a method of forming a three dimensional integrated structure is provided.11-13-2008
20080282742DEVICES AND METHODS FOR SIDE-COUPLING OPTICAL FIBERS TO OPTOELECTRONIC COMPONENTS - Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.11-20-2008
20090233079Techniques for Layer Transfer Processing - Techniques for the fabrication of semiconductor devices are provided. In one aspect, a layer transfer structure is provided. The layer transfer structure comprises a carrier substrate having a porous region with a tuned porosity in combination with an implanted species defining a separation plane therein. In another aspect, a method of forming a layer transfer structure is provided. In yet another aspect, a method of forming a three dimensional integrated structure is provided.09-17-2009

Patent applications by Bruce Kenneth Furman, Poughquag, NY US

Dale C. Furman, Portland, NY US

Patent application numberDescriptionPublished
20090183693High efficiency wood or biomass boiler - A boiler comprising a water jacket surrounding upper and lower combustion chambers for receiving heat for heating water or other fluid therein. The upper and lower combustion chambers are defined by a refractory structure which extends entirely across the inner casing. A vertical passage through the refractory structure provides for flow of combustion gases from the upper to lower combustion chamber. Oxygen is provided through a first forced air inlet to the upper combustion chamber for burning of wood or biomass in the upper combustion chamber. Oxygen is provided through a forced air passage in the refractory structure and opening into the vertical passage thereby providing at cast one second forced air inlet to the vertical passage for burning of the combustion gases and particulates passing therethrough from the upper combustion chamber. The refractory structure sealingly engages the inner casing in a manner to seal the upper combustion chamber from the lower combustion chamber so that the upper combustion chamber can be made substantially air tight whereby the upper combustion chamber can be pressurized by forced air thereto to effect expulsion of combustion gases and particulates from the upper combustion chamber through the vertical passage for burning thereof. Refractory material in the lower combustion chamber provides refractory surface on which the burning combustion gases and particulates expelled through the vertical passage impinge.07-23-2009

William Nelson Furman, Fairport, NY US

Patent application numberDescriptionPublished
20100215125COMMUNICATIONS DEVICE WITH IN-PHASE/QUADRATURE (I/Q) DC OFFSET, GAIN AND PHASE IMBALANCE COMPENSATION AND RELATED METHOD - A DC offset estimator and removal circuit removes the DC offsets for each of the I and Q signal components in a received signal. A gain imbalance estimator and compensator circuit estimates and compensates for gain imbalances within the I and Q signal components. A phase imbalance estimator and compensator circuit estimates and compensates for phase imbalances within the I and Q signal components to produce a communications signal that is compensated for received DC offsets and gain and phase imbalances within the I and Q signal components.08-26-2010
20100232326MOBILE AD-HOC NETWORK HAVING INTERFERENCE MITIGATION AND RELATED METHODS - A mobile ad-hoc network (MANET) may include mobile nodes establishing wireless communications links therebetween. The mobile nodes may communicate based upon an avalanche or relay communications protocol. Each mobile node may comprise a wireless transceiver, and a decorrelation filter cooperating therewith for reducing interference from other mobile nodes. For example, the decorrelation filter also reduces one or more of multi-path interference from other mobile nodes or narrow band interference from other sources.09-16-2010
20110028109WIRELESS COMMUNICATIONS DEVICE WITH WHITE GAUSSIAN NOISE GENERATOR AND RELATED METHODS - A wireless communications device may include a wireless transmitter, a modulator connected to the wireless transmitter, and a white Gaussian noise generator connected to the modulator. The white Gaussian noise generator may include at least one pseudorandom number generator, and a fast Walsh transform module for generating white Gaussian noise based upon the pseudorandom numbers.02-03-2011
20110228822SPECTRAL SMOOTHING WIRELESS COMMUNICATIONS DEVICE AND ASSOCIATED METHODS - A wireless communication device operates in a wireless communications system including a plurality of wireless communication devices and communicates over a wireless medium. The wireless communication device includes an antenna, a transceiver coupled to the antenna, and a controller to cooperate with the transceiver. The controller is configured to generate and transmit a waveform having a waveform frame format including data blocks and repeating training blocks, and to modulate the repeating training blocks to reduce spectral artifacts. The controller may be configured to modulate the repeating training blocks with a pseudo-random phase, a frequency offset or with an amplitude modulation, for example.09-22-2011
20110237205WIRELESS COMMUNICATIONS DEVICE WITH WAVEFORM CONFIGURATION AND RELATED METHODS - A mobile wireless communications device may include an antenna, a transceiver coupled to the antenna, and a controller coupled to the transceiver. The controller may be configured to determine a received signal characteristic, and to configure parameters of a waveform for adjacent forward transmission blocks to be transmitted as sequential forward transmission blocks and based upon the received signal characteristic. Each forward transmission block may have a preamble portion and an associated body portion. The controller may be further configured to set the preamble portion of each forward transmission block to communicate the parameters of the configured waveform.09-29-2011
20120040618HIGH FREQUENCY AUTOMATIC LINK ESTABLISHMENT COMMUNICATION SYSTEM WITH WIDEBAND PROBE AND RELATED METHOD - An HF radio ALE communication system may include a first HF radio communications device including a first HF radio transceiver and a first controller coupled thereto, and a second HF radio communications device including a second HF radio transceiver and a second controller coupled thereto. The first controller may cooperate with the first HF radio transceiver and may be configured to use ALE to establish a narrowband communication link with the second HF radio communications device, and to communicate a wideband message probe to the second HF radio communications device. The second controller may cooperate with the second HF radio transceiver and may be configured to determine at least one channel characteristic based upon the wideband message probe. The first controller may cooperate with the first HF radio transceiver and may be configured to update the narrowband communication link based upon the at least one channel characteristic.02-16-2012

Patent applications by William Nelson Furman, Fairport, NY US