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Funatsu, Tokyo

Akira Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20110233692MICROPHONE UNIT AND VOICE INPUT DEVICE USING SAME - A microphone unit converts voice into an electric signal based on the vibration of a diaphragm contained in an MEMS chip. The microphone unit includes a substrate on which the diaphragm is mounted (the MEMS chip is mounted); a cover member, having sound holes, that is disposed above the substrate so that the diaphragm is contained within the inner space formed between the cover member and the substrate; and a holding member that holds only the substrate or both of the substrate and the cover member.09-29-2011

Eiichi Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20090072123Solid-state imaging device and drive control method for the same - A CMOS sensor has unit pixels each structured by a light receiving element and three transistors, to prevent against the phenomenon of saturation shading and the reduction of dynamic range. The transition time (fall time), in switching off the voltage on a drain line shared in all pixels, is given longer than the transition time in turning of any of the reset line and the transfer line. For this reason, the transistor constituting a DRN drive buffer is made proper in its W/L ratio. Meanwhile, a control resistance or current source is inserted on a line to the GND, to make proper the operation current during driving. This reduces saturation shading amount. By making a reset transistor in a depression type, the leak current to a floating diffusion is suppressed to broaden the dynamic range.03-19-2009
20100110243SOLID STATE IMAGING DEVICE - A solid-state imaging device is capable of simplifying the pixel structure to reduce the pixel size and capable of suppressing the variation in the characteristics between the pixels when a plurality of output systems is provided. A unit cell (05-06-2010
20100110244SOLID STATE IMAGING DEVICE - A solid-state imaging device is capable of simplifying the pixel structure to reduce the pixel size and capable of suppressing the variation in the characteristics between the pixels when a plurality of output systems is provided. A unit cell (05-06-2010
20100134648SOLID-STATE IMAGE PICKUP DEVICE AND CAMERA SYSTEM - A solid-state image pickup device includes a pixel unit in which a plurality of photoelectric conversion elements having different sensitivities are arranged; and a pixel reading unit configured to read and add output signals from the plurality of photoelectric conversion elements in the pixel unit, and to obtain an output signal seemingly from one pixel. The pixel unit includes an absorbing unit configured to absorb overflowing electric charge from a photoelectric conversion element with a high sensitivity.06-03-2010
20100308386SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING SOLID STATE IMAGE PICKUP DEVICE - Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed.12-09-2010
20110221021Solid state image pickup device and method of producing solid state image pickup device - Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed.09-15-2011

Patent applications by Eiichi Funatsu, Tokyo JP

Gentaro Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20100172653Optical Transmission System, Optical Transmitter for Optical Transmission System, and Optical Receiver for Optical Transmission System - An optical transmission system is provided in which the optimum operating point of a Mach-Zehnder interferometer, matched to the optical frequency of the light source on the transmitting side, can be set. The optical receiver (07-08-2010

Junichi Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20110299240OPERATION PROCESSOR - A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit.12-08-2011

Katsuhiko Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20100123240SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device is provided with improved reliability. A semiconductor chip is mounted over a chip mounting portion of a lead frame via solder. A metal plate is arranged over a source pad of the semiconductor chip and a lead portion of a lead frame via solder. A solder reflow process is performed thereby to bond the semiconductor chip over the chip mounting portion with a solder, and to bond the metal plate to the source pad and the lead portion with the other solders. The lead frame is formed of a copper alloy, and thus has its softening temperature higher than the temperature of the solder reflow process. The metal plate is formed of oxygen-free copper, and has its softening temperature lower than the temperature of the solder reflow process, whereby the metal plate is softened in the solder reflow process. Thereafter, a gate pad electrode of the semiconductor chip is coupled to a lead portion via the wire, a sealing resin portion is formed, and then the lead frame is cut.05-20-2010
20100258922SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper surface of a die pad via a die bonding material, followed by sealing with an insulating resin. The top surface of the die pad to be brought into contact with the insulating resin is surface-roughened, while the bottom surface of the die pad and an outer lead portion are not surface-roughened.10-14-2010

Kenichi Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20090196644IMAGE FORMING APPARATUS AND IMAGE FORMING SYSTEM - An image forming apparatus having a fixing unit fixing a developer image formed based on image data received onto a medium includes a target fixing temperature determination unit, a fixable temperature range computing unit, and a fixing temperature control unit. The target fixing temperature determination unit determines fixing temperature arranged based on the medium as target fixing temperature. The fixable temperature range computing unit computes a fixing temperature range fixable the developer image on the medium by using medium information of the medium while using the target fixing temperature as reference temperature. The fixing temperature control unit controls the fixing unit based on the fixable temperature range computed by the fixable temperature range computing unit.08-06-2009

Masayoshi Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20110063792Facilitating Cooling Of An Electronics Rack Employing Water Vapor Compression System - A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.03-17-2011

Ryoji Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20080299225STABLE MICROBICIDAL COMPOSITION - A microbicidal composition contains isothiazolone compounds, which contain 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one, a nitrate in a content of 3% by weight to 25% by weight with respect to a total weight of the composition, a haloacetamide in a content of 5 ppm to 500 ppm, and water. A nitrate in a proportion of 3% by weight to 25% by weight and a haloacetamide in a proportion of 5 ppm to 500 ppm are added to an aqueous solution of isothiazolone compounds, which contain 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one.12-04-2008

Shinichi Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20090173408Steel Pipe Covered at its Inside Surface with Polyolefin Superior in Durability and Method of Production of Same and Plated Steel Pipe Used for that Covered Steel Pipe - A steel pipe covered at its inside surface with a polyolefin superior in durability comprising a steel pipe galvanized at its inside surface and its outside surface with layers containing Al in 0.01 to 60 mass % and covered at its inside surface with a polyolefin pipe through a binder.07-09-2009

Takumi Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20080283229HEAT EXCHANGER - A heat exchanger comprises outer fins; a plurality of tubes arranged alternately with the outer fins; and header tanks receiving open ends of the tubes for communication with the tubes. The header tanks each comprise a first member and a second member which are combined to each other. The first member has tube insertion slots into which the open ends of the tubes are inserted, the second member does not have the tube insertion slots. The first member is either a core material having no brazing material layers on outer and inner peripheral surfaces thereof, or a core material having a brazing material layer on an outer peripheral surface thereof but having no brazing material layer on an inner peripheral surface thereof. The second member is brazed to the outer or inner peripheral surface of the first member having no brazing material layer thereon.11-20-2008

Toshiyuki Funatsu, Tokyo JP

Patent application numberDescriptionPublished
20110034504AGENT FOR PREVENTING AND/OR TREATING VASCULAR DISEASES - [Object] To provide an excellent pharmaceutical composition for preventing and/or treating vascular diseases.02-10-2011
20110158930METHOD FOR TREATMENT OF IRRITABLE BOWEL SYNDROME - A method for treatment of a patient suffering from irritable bowel syndrome with diarrhea or mixed irritable bowel syndrome, which comprises administering to the patient a therapeutically effective amount of ramosetron or a pharmaceutically acceptable salt thereof in combination with a therapeutically effective amount of polycarbophil or a pharmaceutically acceptable salt thereof.06-30-2011