Funatsu, Tokyo
Akira Funatsu, Tokyo JP
Patent application number | Description | Published |
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20110233692 | MICROPHONE UNIT AND VOICE INPUT DEVICE USING SAME - A microphone unit converts voice into an electric signal based on the vibration of a diaphragm contained in an MEMS chip. The microphone unit includes a substrate on which the diaphragm is mounted (the MEMS chip is mounted); a cover member, having sound holes, that is disposed above the substrate so that the diaphragm is contained within the inner space formed between the cover member and the substrate; and a holding member that holds only the substrate or both of the substrate and the cover member. | 09-29-2011 |
20150063763 | OPTICAL-ELECTRICAL COMPOSITE CONNECTOR - An optical-electrical composite connector includes a housing that can accommodate an extra portion of an optical fiber. The optical-electrical composite connector further includes a contact portion for electrically contacting with a mating connector, and a dividing member for dividing the housing into a first space and a second space. The optical fiber is disposed in the first space of the housing divided by the dividing member, and at least a part of the optical fiber is bent. At least another part of the optical fiber, which is other than the part accommodated in the first space thereof, is disposed in the second space of the housing divided by the dividing member. | 03-05-2015 |
Eiichi Funatsu, Tokyo JP
Patent application number | Description | Published |
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20090072123 | Solid-state imaging device and drive control method for the same - A CMOS sensor has unit pixels each structured by a light receiving element and three transistors, to prevent against the phenomenon of saturation shading and the reduction of dynamic range. The transition time (fall time), in switching off the voltage on a drain line shared in all pixels, is given longer than the transition time in turning of any of the reset line and the transfer line. For this reason, the transistor constituting a DRN drive buffer is made proper in its W/L ratio. Meanwhile, a control resistance or current source is inserted on a line to the GND, to make proper the operation current during driving. This reduces saturation shading amount. By making a reset transistor in a depression type, the leak current to a floating diffusion is suppressed to broaden the dynamic range. | 03-19-2009 |
20100110243 | SOLID STATE IMAGING DEVICE - A solid-state imaging device is capable of simplifying the pixel structure to reduce the pixel size and capable of suppressing the variation in the characteristics between the pixels when a plurality of output systems is provided. A unit cell ( | 05-06-2010 |
20100110244 | SOLID STATE IMAGING DEVICE - A solid-state imaging device is capable of simplifying the pixel structure to reduce the pixel size and capable of suppressing the variation in the characteristics between the pixels when a plurality of output systems is provided. A unit cell ( | 05-06-2010 |
20100134648 | SOLID-STATE IMAGE PICKUP DEVICE AND CAMERA SYSTEM - A solid-state image pickup device includes a pixel unit in which a plurality of photoelectric conversion elements having different sensitivities are arranged; and a pixel reading unit configured to read and add output signals from the plurality of photoelectric conversion elements in the pixel unit, and to obtain an output signal seemingly from one pixel. The pixel unit includes an absorbing unit configured to absorb overflowing electric charge from a photoelectric conversion element with a high sensitivity. | 06-03-2010 |
20100308386 | SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING SOLID STATE IMAGE PICKUP DEVICE - Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed. | 12-09-2010 |
20110221021 | Solid state image pickup device and method of producing solid state image pickup device - Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed. | 09-15-2011 |
20120113290 | Solid-state image sensing device and camera system - A solid-state image sensing device includes: a pixel part in which pixels are arranged in a matrix; and a pixel signal readout part including an AD conversion part that analog-digital (AD)-converts a pixel signal read out from the pixel part. Each of the adjacent pixels or one of the pixels of the pixel part is formed as divided pixels divided into regions with different photosensitivity or amounts of accumulated charge, photosensitivity or exposure time conditions are set for the divided pixels and the photosensitivity or exposure time conditions of the divided pixels provided to be opposed in diagonal directions are set to the same conditions, the pixel signal readout part reads out divided pixel signals of the respective divided pixels of the pixel, and the AD conversion part obtains a pixel signal of one pixel by AD-converting the respective read out divided pixel signals and adding the signals. | 05-10-2012 |
20120286388 | SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING SOLID STATE IMAGE PICKUP DEVICE - Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed. | 11-15-2012 |
20130171760 | SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING SOLID STATE IMAGE PICKUP DEVICE - Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back-side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back-side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed. | 07-04-2013 |
20130265471 | SOLID STATE IMAGING DEVICE - A solid-state imaging device is capable of simplifying the pixel structure to reduce the pixel size and capable of suppressing the variation in the characteristics between the pixels when a plurality of output systems is provided. A unit cell ( | 10-10-2013 |
20130308008 | SOLID-STATE IMAGE PICKUP DEVICE AND CAMERA SYSTEM - A solid-state image pickup device including a pixel unit in which a plurality of photoelectric conversion elements having different sensitivities are arranged; and a pixel reading unit configured to read and add output signals from the plurality of photoelectric conversion elements in the pixel unit, and to obtain an output signal seemingly from one pixel. The pixel unit includes an absorbing unit configured to absorb overflowing electric charge from a photoelectric conversion element with a high sensitivity. | 11-21-2013 |
20130313673 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device is provided. The solid-state imaging device includes an imaging region having a plurality of pixels arranged in a two-dimensional array, in which the imaging region includes an effective pixel and a black reference pixel; and a shape of a floating diffusion portion in the effective pixel is different from that of a floating diffusion portion in the black reference pixel. | 11-28-2013 |
20140001338 | SOLID-STATE IMAGING DEVICE AND DRIVE CONTROL METHOD FOR THE SAME | 01-02-2014 |
20150049226 | SOLID-STATE IMAGE SENSING DEVICE AND CAMERA SYSTEM WITH DIVIDED PIXELS - A solid-state image sensing device includes: a pixel part in which pixels are arranged in a matrix; and a pixel signal readout part including an AD conversion part that analog-digital (AD)-converts a pixel signal read out from the pixel part. Each of the adjacent pixels or one of the pixels of the pixel part is formed as divided pixels divided into regions with different photosensitivity or amounts of accumulated charge, photosensitivity or exposure time conditions are set for the divided pixels and the photosensitivity or exposure time conditions of the divided pixels provided to be opposed in diagonal directions are set to the same conditions, the pixel signal readout part reads out divided pixel signals of the respective divided pixels of the pixel, and the AD conversion part obtains a pixel signal of one pixel by AD-converting the respective read out divided pixel signals and adding the signals. | 02-19-2015 |
Gentaro Funatsu, Tokyo JP
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20100172653 | Optical Transmission System, Optical Transmitter for Optical Transmission System, and Optical Receiver for Optical Transmission System - An optical transmission system is provided in which the optimum operating point of a Mach-Zehnder interferometer, matched to the optical frequency of the light source on the transmitting side, can be set. The optical receiver ( | 07-08-2010 |
Junichi Funatsu, Tokyo JP
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20110299240 | OPERATION PROCESSOR - A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit. | 12-08-2011 |
Katsuhiko Funatsu, Tokyo JP
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20100123240 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device is provided with improved reliability. A semiconductor chip is mounted over a chip mounting portion of a lead frame via solder. A metal plate is arranged over a source pad of the semiconductor chip and a lead portion of a lead frame via solder. A solder reflow process is performed thereby to bond the semiconductor chip over the chip mounting portion with a solder, and to bond the metal plate to the source pad and the lead portion with the other solders. The lead frame is formed of a copper alloy, and thus has its softening temperature higher than the temperature of the solder reflow process. The metal plate is formed of oxygen-free copper, and has its softening temperature lower than the temperature of the solder reflow process, whereby the metal plate is softened in the solder reflow process. Thereafter, a gate pad electrode of the semiconductor chip is coupled to a lead portion via the wire, a sealing resin portion is formed, and then the lead frame is cut. | 05-20-2010 |
20100258922 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper surface of a die pad via a die bonding material, followed by sealing with an insulating resin. The top surface of the die pad to be brought into contact with the insulating resin is surface-roughened, while the bottom surface of the die pad and an outer lead portion are not surface-roughened. | 10-14-2010 |
20160093589 | SEMICONDUCTOR DEVICE - Reduction in reliability of a semiconductor device is suppressed. A semiconductor device includes a plurality of metal patterns formed on a ceramic substrate, and a plurality of semiconductor chips mounted on the plurality of metal patterns. Also, the plurality of metal patterns include metal patterns MPH and MPU which face each other. In addition, a region which is provided between these metal patterns MPH and MPU and which is exposed from the plurality of metal patterns extends so as to zigzag along an extending direction of the metal pattern MPH. | 03-31-2016 |
20160093594 | SEMICONDUCTOR DEVICE - A semiconductor device includes a plurality of metal patterns formed on a ceramic substrate, and a semiconductor chip mounted on some of the plurality of metal patterns. Also, a plurality of hollow portions are formed in peripheral portions of the plurality of metal patterns. In addition, the plurality of hollow portions are not formed in a region overlapping the semiconductor chip in the plurality of metal patterns. Furthermore, the plurality of hollow portions are provided in a plurality of metal patterns arranged at a position closest to the peripheral portion of the top surface of the ceramic substrate among the plurality of metal patterns. | 03-31-2016 |
Kenichi Funatsu, Tokyo JP
Patent application number | Description | Published |
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20090196644 | IMAGE FORMING APPARATUS AND IMAGE FORMING SYSTEM - An image forming apparatus having a fixing unit fixing a developer image formed based on image data received onto a medium includes a target fixing temperature determination unit, a fixable temperature range computing unit, and a fixing temperature control unit. The target fixing temperature determination unit determines fixing temperature arranged based on the medium as target fixing temperature. The fixable temperature range computing unit computes a fixing temperature range fixable the developer image on the medium by using medium information of the medium while using the target fixing temperature as reference temperature. The fixing temperature control unit controls the fixing unit based on the fixable temperature range computed by the fixable temperature range computing unit. | 08-06-2009 |
20120099877 | IMAGE FORMING APPARATUS - An image forming apparatus includes a consumable supply detachably attached to an apparatus main body; a detection unit for detecting that the consumable supply is exchanged; a display unit for displaying the consumable supply detected with the detection unit; and an input unit for receiving an input operation for confirming whether the consumable supply detected with the detection unit is correctly exchanged. | 04-26-2012 |
20130107283 | IMAGE FORMING APPARATUS | 05-02-2013 |
20130108294 | IMAGE FORMING APPARATUS | 05-02-2013 |
Masayoshi Funatsu, Tokyo JP
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20110063792 | Facilitating Cooling Of An Electronics Rack Employing Water Vapor Compression System - A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser. | 03-17-2011 |
Ryohei Funatsu, Tokyo JP
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20150237382 | VIDEO SIGNAL TRANSMITTING DEVICE, VIDEO SIGNAL RECEIVING DEVICE, AND RECORDING MEDIUM - In a video signal transmitting device, a basic image generation unit extracts, for each of the color signal component, pixels constituting a frame of the color signal component at a uniform interval two-dimensionally and two-dimensionally arranges the extracted pixels in a prescribed arrangement to generate a prescribed number of color signal basic images. A basic stream generation unit extracts, for each of the color signal basic images, pixels of the color signal basic image generated by the basic image generation unit in a prescribed sequence to generate a basic stream. A link signal generation unit synthesizes a prescribed number of basic streams in the same or different color signal components generated by the basic stream generation unit, encodes bit-length units of the synthesized basic streams to a different bit length, and generates a link signal having a prescribed speed. | 08-20-2015 |
Ryoji Funatsu, Tokyo JP
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20080299225 | STABLE MICROBICIDAL COMPOSITION - A microbicidal composition contains isothiazolone compounds, which contain 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one, a nitrate in a content of 3% by weight to 25% by weight with respect to a total weight of the composition, a haloacetamide in a content of 5 ppm to 500 ppm, and water. A nitrate in a proportion of 3% by weight to 25% by weight and a haloacetamide in a proportion of 5 ppm to 500 ppm are added to an aqueous solution of isothiazolone compounds, which contain 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one. | 12-04-2008 |
Shinichi Funatsu, Tokyo JP
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20090173408 | Steel Pipe Covered at its Inside Surface with Polyolefin Superior in Durability and Method of Production of Same and Plated Steel Pipe Used for that Covered Steel Pipe - A steel pipe covered at its inside surface with a polyolefin superior in durability comprising a steel pipe galvanized at its inside surface and its outside surface with layers containing Al in 0.01 to 60 mass % and covered at its inside surface with a polyolefin pipe through a binder. | 07-09-2009 |
Shiro Funatsu, Tokyo JP
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20150111040 | SURFACE TREATMENT METHOD OF GLASS SUBSTRATE AND GLASS SUBSTRATE - A method capable of forming a sufficiently thick low alkali concentration region without heating glass to a high temperature and even in an atmosphere which is not an atmosphere of plasma formation gas such as helium and argon, is provided. A glass substrate having a pair of main surfaces and being made of glass containing an alkali oxide in its composition, is disposed between a first electrode and a second electrode so that one main surface is separated from the first electrode and the other main surface is brought into contact with the second electrode, and a corona discharge is generated by applying a direct-current voltage to the first electrode as a positive electrode and the second electrode as a negative electrode, in a positive-electrode-side surface layer portion of the glass substrate, at least one positive ion including an alkali ion migrate toward the negative-electrode-side. | 04-23-2015 |
20150353410 | MANUFACTURING METHOD OF GLASS FORMING BODY AND FORMING DIE - The present invention provides a manufacturing method of glass formed body and a forming die which make it possible to sufficiently fill a glass material in the forming die and manufacture a glass formed body having a desired shape. The manufacturing method of glass formed body includes: heating a plate-shaped glass material; pressing the heated plate-shaped glass material by the forming die; and cooling and solidifying the glass material transferred shapes of forming surfaces of the forming die by the pressing, wherein planar-view contour shapes of the forming surfaces are non-circular, a gap formed by the forming surfaces is formed so as to become wider from an inner side toward an outer side of the forming surfaces, and pressure distribution occurring in the plate-shaped glass material in the pressing is uniform in a contour region of each of the forming surfaces. | 12-10-2015 |
Takashi Funatsu, Tokyo JP
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20150051105 | NUCLEIC ACID DETECTION METHOD, DETECTION PROBE, DETECTION PROBE SET, AND NUCLEIC ACID QUANTIFICATION METHOD - A method for detecting a target nucleic acid, comprising: (a) contacting a nucleic acid sample comprising a target nucleic acid, comprising a first portion and a second portion, with: (i) a detection probe, wherein the detection probe is labeled with a labeling substance and comprises a nucleic acid sequence that forms a stem-loop structure and having a 5′ protruding end or a 3′ protruding end that is capable of hybridizing to the second portion, and (ii) a capture probe comprising a nucleic acid sequence capable of hybridizing to the first portion, wherein the capture probe is immobilized to a substrate, under conditions to form a target nucleic acid-detection probe-capture probe complex by hybridizing the second portion to the detection probe and hybridizing the first portion to the capture probe; (b) ligating a first end of the detection probe with an end of the target nucleic acid and ligating a second end of the detection probe with an end of the capture probe; and (c) detecting the labeling substance of the nucleic acid-detection probe-capture probe complex formed on the substrate. | 02-19-2015 |
Takumi Funatsu, Tokyo JP
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20080283229 | HEAT EXCHANGER - A heat exchanger comprises outer fins; a plurality of tubes arranged alternately with the outer fins; and header tanks receiving open ends of the tubes for communication with the tubes. The header tanks each comprise a first member and a second member which are combined to each other. The first member has tube insertion slots into which the open ends of the tubes are inserted, the second member does not have the tube insertion slots. The first member is either a core material having no brazing material layers on outer and inner peripheral surfaces thereof, or a core material having a brazing material layer on an outer peripheral surface thereof but having no brazing material layer on an inner peripheral surface thereof. The second member is brazed to the outer or inner peripheral surface of the first member having no brazing material layer thereon. | 11-20-2008 |
Terunobu Funatsu, Tokyo JP
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20160006648 | Distributed Control System and Control Method Thereof - In a distributed control system including a central communication device, terminal communication devices to which target devices to be controlled are connected, and a network including multiple communication paths connecting the central communication device and terminal communication devices, each terminal communication device includes a calculation input/output performance storage unit storing input/output performance of a calculation unit for controlling the target devices to be controlled and a control input/output performance storage unit storing the performance of the input/output control units of the target devices to be controlled, and the central communication device collects input/output performance information previously stored in these storage units, determines communication paths of the terminal communication units and a packet division method in such a manner that an amount of a communication data of a network and response performance requested of the distributed control system are satisfied, on the basis of the collected input/output performance information and sets the determination results in the terminal communication devices. | 01-07-2016 |
Toshifumi Funatsu, Tokyo JP
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20160099494 | ANTENNA SYSTEM - Disclosed is an antenna system including a glass antenna that is disposed in window glass that is installed in a window opening that is formed in a metal body of a vehicle, wherein the glass antenna is to receive a radio wave in a MF band or in a LF band; an in-vehicle antenna that is disposed at an inner side of the vehicle compared to the metal body of the vehicle, wherein the in-vehicle antenna is positioned in a vicinity of the glass antenna; and a canceler to cancel a noise signal of the in-vehicle antenna in a received signal of the glass antenna. | 04-07-2016 |
Toshiyuki Funatsu, Tokyo JP
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20110034504 | AGENT FOR PREVENTING AND/OR TREATING VASCULAR DISEASES - [Object] To provide an excellent pharmaceutical composition for preventing and/or treating vascular diseases. | 02-10-2011 |
20110158930 | METHOD FOR TREATMENT OF IRRITABLE BOWEL SYNDROME - A method for treatment of a patient suffering from irritable bowel syndrome with diarrhea or mixed irritable bowel syndrome, which comprises administering to the patient a therapeutically effective amount of ramosetron or a pharmaceutically acceptable salt thereof in combination with a therapeutically effective amount of polycarbophil or a pharmaceutically acceptable salt thereof. | 06-30-2011 |
Yoshihiro Funatsu, Tokyo JP
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20140320734 | IMAGE CAPTURE APPARATUS AND METHOD OF CONTROLLING THE SAME - An image sensor has multiple pixel units in correspondence with each microlens, and focus detection is performed with a phase-difference detection method using output from the image sensor. The signals to be used in the focus detection can be combined, and a larger signal combining amount is set in the case of output from the image sensor with a first thinning amount than in the case of output from the image sensor with a second thinning amount. | 10-30-2014 |